公开(公告)号：WO2011149508A3

公开(公告)日：2012-04-05

申请号：PCT/US2011000867

申请日：2011-05-17

Applicant: LAM RES CORP ,  RICCI ANTHONY ,  ULLAL SAURABH ,  KANG MICHAEL ,  BUSCHE MATTHEW

Inventor： RICCI ANTHONY ,  ULLAL SAURABH ,  KANG MICHAEL ,  BUSCHE MATTHEW

IPC: H01L21/683 ,  H01L21/205 ,  H01L21/3065

CPC classification number: H01L21/67248 ,  H01J37/32715 ,  H01J37/32724 ,  H01L21/67109

Abstract: A recirculation system of a substrate support on which a semiconductor substrate is subjected to a multistep process in a vacuum chamber, the system comprising a substrate support having at least one liquid flow passage in a base plate thereof, an inlet and an outlet in fluid communication with the flow passage, a supply line in fluid communication with the inlet, and a return line in fluid communication with the outlet; a first recirculator providing liquid at temperature T 1 in fluid communication with the supply line and the return line; a second recirculator providing liquid at temperature T 2 in fluid communication with the supply line and the return line, temperature T 2 being at least 10°C above temperature T 1 ; a pre-cooling unit providing liquid at temperature T pc connected to the inlet and the outlet, temperature T pc being at least 10C below T 1 ; a pre-heating unit providing liquid at temperature T ph connected to the inlet and the outlet, temperature T ph being at least 10°C above T 2 ; a controller operable to selectively operate valves of the recirculation system to recirculate liquid between the flow passage and the first recirculator, the second recirculator, the pre-cooling unit or the pre-heating unit.

Abstract translation: 一种衬底支撑件的再循环系统，半导体衬底在其上在真空室中进行多步骤处理，所述系统包括衬底支撑件，所述衬底支撑件在其底板中具有至少一个液体流动通道，流体连通的入口和出口 与流路连通，与入口流体连通的供应管线和与出口流体连通的回流管线; 第一再循环器，其在与所述供应管线和所述回流管线流体连通的温度T 1下提供液体; 提供温度T 2的液体与供应管线和返回管线流体连通的第二再循环器，温度T 2高于温度T 1至少10℃; 提供温度T pc连接到入口和出口的液体的预冷单元，温度T pc比T 1低至少10℃; 预热单元，其在与入口和出口连接的温度T ph下提供液体，温度T ph比T 2高至少10℃; 控制器，其可操作以选择性地操作所述再循环系统的阀，以在所述流动通道和所述第一再循环器，所述第二再循环器，所述预冷单元或所述预热单元之间再循环液体。

公开(公告)号：WO2006073947A3

公开(公告)日：2007-04-05

申请号：PCT/US2005047109

申请日：2005-12-13

Applicant: LAM RES CORP ,  RICCI ANTHONY J ,  COMENDANT KEITH ,  TAPPAN JAMES

Inventor： RICCI ANTHONY J ,  COMENDANT KEITH ,  TAPPAN JAMES

IPC: H01L21/00

CPC classification number: H01L21/6833 ,  H01J37/32724 ,  H01J2237/20 ,  H01L21/67103 ,  H01L21/6831 ,  H01L2221/683 ,  H05B3/26 ,  Y10T29/49146 ,  Y10T29/53252 ,  Y10T279/23

Abstract: An apparatus for control of a temperature of a substrate has a temperature­controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus. The layer of dielectric material forms an electrostatic clamping mechanism and supports the substrate.

Abstract translation: 用于控制基板的温度的装置具有温度控制的基座，加热器，金属板，介电材料层。 加热器在与金属板电绝缘的同时热耦合到金属板的下侧。 第一层粘合材料将金属板和加热器粘合到温度受控基底的顶面。 该粘合剂层是机械柔性的，并且具有设计用于平衡加热器的热能和外部工艺的物理性能，以在设备的表面上提供期望的温度图案。 第二层粘合剂材料将介电材料层粘合到金属板的顶表面上。 该第二粘合剂层具有设计成将期望的温度图案转移到设备表面的物理性质。 电介质材料层形成静电夹持机构并支撑衬底。

公开(公告)号：WO2007011613A2

公开(公告)日：2007-01-25

申请号：PCT/US2006/027090

申请日：2006-07-13

Applicant: LAM RESEARCH CORPORATION ,  RICCI, Anthony ,  TAPPAN, Jim ,  COMENDANT, Keith

Inventor： RICCI, Anthony ,  TAPPAN, Jim ,  COMENDANT, Keith

IPC: B05D3/02

CPC classification number: H01L21/76251 ,  H01L21/68757 ,  H01L21/68785

Abstract: A method of protecting a bond layer in a substrate support adapted for use in a plasma processing system. The method includes the steps of attaching an upper member of a substrate support to a lower member of a substrate support with a bonding material. An adhesive is applied to an outer periphery of the upper member and to an upper periphery of the lower member, and a protective ring is positioned around the outer periphery of the upper member and the upper periphery of the lower member. The protective ring is originally fabricated with dimensions that provide mechanical stability and workability. The protective ring is then machined to an exact set of final dimensions consistent with the design of the substrate support application.

Abstract translation: 一种保护适于在等离子体处理系统中使用的衬底支撑体中的接合层的方法。 该方法包括以下步骤：利用接合材料将衬底支撑件的上部构件附接到衬底支撑件的下部构件。 将粘合剂施加到上部构件的外周和下部构件的上周边，并且保护环围绕上部构件的外周和下部构件的上周边定位。 保护环最初由具有提供机械稳定性和可加工性的尺寸制成。 然后将保护环加工成与衬底支撑应用的设计一致的最终尺寸的精确组合。

公开(公告)号：WO2012018368A2

公开(公告)日：2012-02-09

申请号：PCT/US2011001270

申请日：2011-07-18

Applicant: LAM RES CORP ,  RICCI ANTHONY ,  SAURABH ULLAL ,  MARTINEZ LARRY

Inventor： RICCI ANTHONY ,  SAURABH ULLAL ,  MARTINEZ LARRY

IPC: H05H1/24 ,  H01L21/205 ,  H01L21/3065

CPC classification number: H01L21/67069 ,  C23C16/4404 ,  H01J37/32477 ,  H01J37/32798 ,  H01L21/6833 ,  Y10T156/10

Abstract: Parasitic plasma in voids in a component of a plasma processing chamber can be eliminated by covering electrically conductive surfaces in an interior of the voids with a sleeve. The voids can be gas holes, lift pin holes, helium passages, conduits and/or plenums in chamber components such as an upper electrode and a substrate support.

Abstract translation: 通过用套筒覆盖空隙内部的导电表面，可以消除等离子体处理室的部件中的空隙中的寄生等离子体。 空隙可以是诸如上电极和衬底支撑件之类的室部件中的气孔，提升针孔，氦气通道，导管和/或增压室。

公开(公告)号：WO2007056632A2

公开(公告)日：2007-05-18

申请号：PCT/US2006/060304

申请日：2006-10-25

Applicant: SOUNDBOX CORPORATION ,  CARLEY, Thomas ,  RICCI, Anthony, P.M

Inventor： CARLEY, Thomas ,  RICCI, Anthony, P.M

IPC: H04N7/00

CPC classification number: H04N5/28 ,  H04N5/772

Abstract: A stand-alone performance recording system includes an enclosure or performance area adapted to be moved from a first location to a second location, and temporarily, semi-permanently or permanently set up at the second location for the purpose of recording the audio and/or visual aspects of an event performed within the enclosure. Digital audio and video recording are performed within the enclosure. A controlled environment is provided within the enclosure, and the recording system includes features that allow for the superposing and/or editing of multiple live and prerecorded audio and/or video inputs provided within the stand-alone enclosure during an event performed within the enclosure at whatever location is desired.

Abstract translation: 独立的录音系统包括适于从第一位置移动到第二位置的外壳或演奏区域，并且在第二位置暂时地，半永久地或永久地设置以便记录音频和/或 在外壳内执行的事件的视觉方面。 数字音频和视频录制在机箱内执行。 在机箱内提供受控的环境，并且记录系统包括允许叠加和/或编辑在外壳内执行的事件期间提供在独立外壳内的多个实时和预录音频和/或视频输入的特征 任何位置都是需要的

公开(公告)号：WO2013042027A2

公开(公告)日：2013-03-28

申请号：PCT/IB2012/054903

申请日：2012-09-17

Applicant: LAM RESEARCH CORPORATION ,  LAM RESEARCH AG ,  GAFF, Keith, William ,  COMENDANT, Keith ,  RICCI, Anthony

Inventor： GAFF, Keith, William ,  COMENDANT, Keith ,  RICCI, Anthony

IPC: H01L21/30 ,  H05B3/68 ,  H01C17/02

CPC classification number: F25B21/04 ,  H01L21/0201 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/6831 ,  H01L35/34 ,  Y10T29/49083 ,  Y10T29/49165

Abstract: A thermal plate for a substrate support assembly in a semiconductor plasma processing apparatus, comprises multiple independently controllable planar thermal zones arranged in a scalable multiplexing layout, and electronics to independently control and power the planar heater zones. Each planar thermal zone uses at least one Peltier device as a thermoelectric element. A substrate support assembly in which the thermal plate is incorporated includes an electrostatic clamping electrode layer and a temperature controlled base plate. Methods for manufacturing the thermal plate include bonding together ceramic or polymer sheets having planar thermal zones, positive, negative and common lines and vias.

Abstract translation: 一种用于半导体等离子体处理装置中的衬底支撑组件的热板，包括以可伸缩复用布局布置的多个可独立控制的平面热区，以及用于独立地控制和供电平面加热器区的电子装置。 每个平面热区使用至少一个珀耳帖装置作为热电元件。 其中结合热板的基板支撑组件包括静电夹持电极层和温度控制的基板。 用于制造热板的方法包括将具有平面热区域，正，负和公共线路和通孔的陶瓷或聚合物片材结合在一起。

公开(公告)号：WO2007056632A3

公开(公告)日：2008-07-10

申请号：PCT/US2006060304

申请日：2006-10-25

Applicant: SOUNDBOX CORP ,  CARLEY THOMAS ,  RICCI ANTHONY P M

Inventor： CARLEY THOMAS ,  RICCI ANTHONY P M

IPC: H04N5/00

CPC classification number: H04N5/28 ,  H04N5/772

Abstract: A stand-alone performance recording system includes an enclosure or performance area adapted to be moved from a first location to a second location, and temporarily, semi-permanently or permanently set up at the second location for the purpose of recording the audio and/or visual aspects of an event performed within the enclosure. Digital audio and video recording are performed within the enclosure. A controlled environment is provided within the enclosure, and the recording system includes features that allow for the superposing and/or editing of multiple live and prerecorded audio and/or video inputs provided within the stand-alone enclosure during an event performed within the enclosure at whatever location is desired.

Abstract translation: 独立的录音系统包括适于从第一位置移动到第二位置的外壳或演奏区域，并且在第二位置暂时地，半永久地或永久地设置以便录制音频和/或 在外壳内执行的事件的视觉方面。 数字音频和视频录制在机箱内执行。 在机箱内提供受控的环境，并且记录系统包括允许叠加和/或编辑在外壳内执行的事件期间提供在独立外壳内的多个实时和预录音频和/或视频输入的特征 任何位置都是需要的

公开(公告)号：WO2006073947A2

公开(公告)日：2006-07-13

申请号：PCT/US2005/047109

申请日：2005-12-13

Applicant: LAM RESEARCH CORPORATION ,  RICCI, Anthony, J. ,  COMENDANT, Keith ,  TAPPAN, James

Inventor： RICCI, Anthony, J. ,  COMENDANT, Keith ,  TAPPAN, James

IPC: H01L21/00

CPC classification number: H01L21/6833 ,  H01J37/32724 ,  H01J2237/20 ,  H01L21/67103 ,  H01L21/6831 ,  H01L2221/683 ,  H05B3/26 ,  Y10T29/49146 ,  Y10T29/53252 ,  Y10T279/23

Abstract: An apparatus for control of a temperature of a substrate has a temperature­controlled base, a heater, a metal plate, a layer of dielectric material. The heater is thermally coupled to an underside of the metal plate while being electrically insulated from the metal plate. A first layer of adhesive material bonds the metal plate and the heater to the top surface of the temperature controlled base. This adhesive layer is mechanically flexible, and possesses physical properties designed to balance the thermal energy of the heaters and an external process to provide a desired temperature pattern on the surface of the apparatus. A second layer of adhesive material bonds the layer of dielectric material to a top surface of the metal plate. This second adhesive layer possesses physical properties designed to transfer the desired temperature pattern to the surface of the apparatus. The layer of dielectric material forms an electrostatic clamping mechanism and supports the substrate.

Abstract translation: 用于控制基板的温度的装置具有温度控制的基座，加热器，金属板，介电材料层。 加热器在与金属板电绝缘的同时热耦合到金属板的下侧。 第一层粘合剂材料将金属板和加热器粘合到温度受控底座的顶部表面。 该粘合剂层具有机械柔性，并具有设计用于平衡加热器的热能和外部工艺的物理性能，以在设备的表面上提供期望的温度图案。 第二层粘合剂材料将介电材料层粘合到金属板的顶表面上。 该第二粘合剂层具有设计成将期望的温度图案转移到设备的表面的物理性质。 介电材料层形成静电夹持机构并支撑基板。

公开(公告)号：WO2012018368A9

公开(公告)日：2012-02-09

申请号：PCT/US2011/001270

申请日：2011-07-18

Applicant: LAM RESEARCH CORPORATION ,  RICCI, Anthony ,  SAURABH, Ullal ,  MARTINEZ, Larry

Inventor： RICCI, Anthony ,  SAURABH, Ullal ,  MARTINEZ, Larry

IPC: H05H1/24 ,  H01L21/205 ,  H01L21/3065

Abstract: Parasitic plasma in voids in a component of a plasma processing chamber can be eliminated by covering electrically conductive surfaces in an interior of the voids with a sleeve. The voids can be gas holes, lift pin holes, helium passages, conduits and/or plenums in chamber components such as an upper electrode and a substrate support.

公开(公告)号：WO2013042027A3

公开(公告)日：2015-06-25

申请号：PCT/IB2012054903

申请日：2012-09-17

Applicant: LAM RES CORP ,  LAM RES AG ,  GAFF KEITH WILLIAM ,  COMENDANT KEITH ,  RICCI ANTHONY

Inventor： GAFF KEITH WILLIAM ,  COMENDANT KEITH ,  RICCI ANTHONY

IPC: H01L21/30 ,  H01C17/02 ,  H05B3/68

CPC classification number: F25B21/04 ,  H01L21/0201 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/6831 ,  H01L35/34 ,  Y10T29/49083 ,  Y10T29/49165

Abstract: A thermal plate for a substrate support assembly in a semiconductor plasma processing apparatus, comprises multiple independently controllable planar thermal zones arranged in a scalable multiplexing layout, and electronics to independently control and power the planar heater zones. Each planar thermal zone uses at least one Peltier device as a thermoelectric element. A substrate support assembly in which the thermal plate is incorporated includes an electrostatic clamping electrode layer and a temperature controlled base plate. Methods for manufacturing the thermal plate include bonding together ceramic or polymer sheets having planar thermal zones, positive, negative and common lines and vias.

Abstract translation: 一种用于半导体等离子体处理装置中的衬底支撑组件的热板，包括以可伸缩复用布局布置的多个可独立控制的平面热区，以及用于独立地控制和供电平面加热器区的电子装置。 每个平面热区使用至少一个珀耳帖装置作为热电元件。 其中结合热板的基板支撑组件包括静电夹持电极层和温度控制的基板。 用于制造热板的方法包括将具有平面热区域，正，负和公共线路和通孔的陶瓷或聚合物片材结合在一起。