公开(公告)号：WO2018097995A1

公开(公告)日：2018-05-31

申请号：PCT/US2017/061738

申请日：2017-11-15

Applicant: SNAPTRACK, INC.

Inventor： PORTMANN, Dr. Jürgen ,  STELTER, Mark ,  KONOPKA, Niklaas ,  LINDEN, Dr. Jennifer

IPC: H01L21/67 ,  H01L21/50 ,  H03H9/10 ,  B30B15/34 ,  B32B37/06

CPC classification number: H01L21/67092 ,  B30B5/02 ,  B30B15/061 ,  B30B15/064 ,  B30B15/34 ,  B32B37/06 ,  H01L21/50 ,  H01L21/67109 ,  H01L21/67259 ,  H01L21/67288 ,  H01L2224/75252 ,  H01L2924/3511 ,  H03H9/10

Abstract: An apparatus (1) for connecting two substrates (2, 3) for an electric component features a chamber (4) for inserting the substrates (2, 3), wherein a gas inlet (13) is arranged to direct a gas (14) in the chamber (4) in a targeted manner on the surface of at least one of the substrates (2, 3). The gas inlet (13) is particularly designed to control any warping of at least one of the substrates (2, 3), which may occur during a pre-conditioning phase due to inhomogeneous heat expansion of one of the substrates (2, 3) in the bonding level, different coefficients of thermal expansion of the two substrates (2, 3) or inhomogeneous temperature distribution. Thanks to the aimed direction of the gas (14) onto the surface of at least one of the substrates (2, 3), the warping of the substrates (2, 3) may be intensified or reduced, in particular any warping of the upper substrate (3) towards the lower substrate (2) can be avoided. This allows the prevention of any direct contact of the substrates (2, 3) during the pre-conditioning phase. During the pre-conditioning phase, one or several spacers (6) can be arranged between the substrates (2, 3), the spacers (6) being removed at the end of the pre-conditioning phase. In one set-up configuration, the apparatus (1) features a measuring device (for example, a device for optical distance determination such as a camera (18) arranged at the level of a gap between the substrates (2, 3)) to determine a distance (d) between the substrates (2, 3) and/or any warping of at least one of the substrates (2, 3). The apparatus may also feature a control circuit (21) to control and readjust the flow quantity and/or the temperature of the gas (14), thus controlling the warping of the substrates (2, 3), wherein the control circuit (21) shows the measuring result of the measuring device (18) as a control variable.

公开(公告)号：WO2018097955A2

公开(公告)日：2018-05-31

申请号：PCT/US2017/060245

申请日：2017-11-06

Applicant: APPLIED MATERIALS, INC.

Inventor： NEMANI, Srinivas D. ,  PISHARODY, Gautam ,  RAMASWAMI, Seshadri ,  ROY, Shambhu N. ,  KUMAR, Niranjan

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67288 ,  G01R29/12 ,  H01L21/67253 ,  H01L21/6831 ,  H01L21/6833 ,  H01L21/6838

Abstract: An electrostatic chucking force tool is described that may be used on workpiece carriers for micromechanical and semiconductor processing. One example includes a workpiece fitting to hold a workpiece when gripped by an electrostatic chucking force by an electrostatic chuck, an arm coupled to the workpiece fitting to pull the workpiece through the workpiece fitting laterally across the chuck, and a force gauge coupled to the arm to measure an amount of force with which the workpiece fitting is pulled by the arm in order to move the workpiece.

公开(公告)号：WO2017127405A1

公开(公告)日：2017-07-27

申请号：PCT/US2017/013890

申请日：2017-01-18

Applicant: INTEVAC, INC.

Inventor： BLUCK, Terry ,  ADIBI, Babak ,  PRABHAKAR, Vinay ,  RUNSTADLER, JR., William Eugene

IPC: H01L21/68 ,  H01L21/683 ,  H01L21/687

CPC classification number: H01L21/6833 ,  H01L21/67288 ,  H01L21/6831 ,  H01L21/68735 ,  H01L21/6875 ,  H01L22/12

Abstract: A chuck for wafer processing that counters the deleterious effects of thermal expansion of the wafer. Also, a combination of chuck and shadow mask arrangement that maintains relative alignment between openings in the mask and the wafer in spite of thermal expansion of the wafer. A method for fabricating a solar cell by ion implant, while maintaining relative alignment of the implanted features during thermal expansion of the wafer.

Abstract translation: 用于晶片加工的卡盘，用于抵消晶片热膨胀的有害影响。 此外，卡盘和阴影掩模装置的组合，尽管晶片热膨胀，仍然保持掩模和晶片中的开口之间的相对对准。 一种通过离子注入制造太阳能电池的方法，同时在晶片热膨胀期间保持注入特征的相对对准。

公开(公告)号：WO2017084079A1

公开(公告)日：2017-05-26

申请号：PCT/CN2015/095089

申请日：2015-11-20

Applicant: ACM RESEARCH (SHANGHAI) INC.

Inventor： WANG, Hui ,  WU, Jun ,  FANG, Zhiyou

IPC: H01L21/677 ,  H01L21/683

CPC classification number: H01L21/68707 ,  H01L21/67288 ,  H01L21/6838

Abstract: A robot arm (300, 400, 500, 600) for transporting semiconductor substrates (304, 404) comprises a body portion (301, 401, 501, 601), an end portion (302, 402, 502, 602) extending from the body portion (301, 401, 501, 601), a plurality of vacuum cups disposed on the end portion (302, 402, 502, 602), and a plurality of vacuum lines connecting to the plurality of vacuum cups respectively. The distance between any two adjacent vacuum cups satisfies the following condition: a vertical displacement of the semiconductor substrate (304, 404) produced by one of the two adjacent vacuum cups sucking down the semiconductor substrate is greater than a warpage of the semiconductor substrate (304, 404) in the range of the two adjacent vacuum cups, so that once the one of the two adjacent vacuum cups sucks the semiconductor substrate (304, 404), the other vacuum cup of the two adjacent vacuum cups is followed to suck the semiconductor substrate (304, 404).

Abstract translation: 用于传输半导体衬底（304,404）的机器人臂（300,400,500,600）包括主体部分（301,401,501,601），端部部分（302,402 ，从所述主体部分（301,401,501,601）延伸的多个真空吸盘，布置在所述末端部分（302,402,502,602）上的多个真空吸盘以及连接到所述多个吸盘 的真空杯分别。 任意两个相邻的真空杯之间的距离满足以下条件：由两个相邻的真空杯中的一个抽吸半导体衬底产生的半导体衬底（304,404）的垂直位移大于半导体衬底（304,404）的翘曲 ，404）在两个相邻的真空杯的范围内，从而一旦两个相邻的真空杯中的一个抽吸半导体衬底（304,404），就跟随两个相邻真空杯中的另一个真空杯吸附半导体 衬底（304,404）。

公开(公告)号：WO2016157356A1

公开(公告)日：2016-10-06

申请号：PCT/JP2015/059898

申请日：2015-03-30

Applicant: 富士機械製造株式会社

Inventor： 藤井　公夫

IPC: H05K13/04 ,  H01L21/52 ,  H01L21/677 ,  H05K13/08

CPC classification number: H01L21/52 ,  G01R31/2831 ,  H01L21/67144 ,  H01L21/67276 ,  H01L21/67288 ,  H01L21/677 ,  H01L22/20 ,  H05K13/04 ,  H05K13/043 ,  H05K13/08

Abstract: 　管理装置は、ウェハから採取された部品が基材に実装されると、実装部品の採取位置に関する採取位置情報を含む採取元情報と、実装部品の実装位置に関する実装位置情報を含む実装先情報とを取得して、両情報を互いに関連付けた実装実績情報をＨＤＤ（９３）に記憶する。このため、ＨＤＤ（９３）に記憶された実装実績情報を参照して、実装部品の実装先情報から採取元情報をたどれば、実装部品が採取されたウェハにおける採取位置を特定することができる。

Abstract translation: 当从晶片收集的部件安装在基板上时，管理装置：获取收集起始信息，包括与收集安装的部件的位置有关的收集位置信息，以及安装目的地信息，其包括与 安装部件的安装位置; 并且在HDD（93）上存储收集起始信息和安装目的地信息相关联的装载记录信息。 因此，通过参照存储在HDD（93）上的安装记录信息，并根据安装部件的安装目的地信息追踪收集原始信息，可以指定在安装部件被收集的晶片上的收集位置 。

公开(公告)号：WO2016145404A1

公开(公告)日：2016-09-15

申请号：PCT/US2016/022188

申请日：2016-03-11

Applicant: KLA-TENCOR CORPORATION

Inventor： SUBRAHMANYAN, Pradeep ,  HUANG, Luping ,  POHLHAMMER, Christopher

IPC: H01L21/683 ,  H01L21/687

CPC classification number: H01L21/6838 ,  H01L21/67288

Abstract: An apparatus for fixing a wafer, including a chuck having a surface, a plurality of through bores in the chuck extending through the surface of the chuck, a fixed vacuum bellows, and a plurality of floating air bearings, wherein the fixed vacuum bellows and a respective floating air bearing of the plurality of floating air bearings are each individually arranged in separate through bores of the plurality of through bores and elevationally above the surface of the chuck.

Abstract translation: 一种用于固定晶片的装置，包括具有表面的卡盘，在卡盘中延伸穿过卡盘表面的多个通孔，固定的真空波纹管和多个浮动空气轴承，其中固定的真空波纹管和 多个浮动空气轴承的各自的浮动空气轴承各自分别布置在多个通孔的分开的通孔中并且在卡盘的表面上方。

公开(公告)号：WO2016038982A1

公开(公告)日：2016-03-17

申请号：PCT/JP2015/068447

申请日：2015-06-26

Applicant: 株式会社日立ハイテクノロジーズ

Inventor： 嶺川　陽平 ,  高木　裕治 ,  平井　大博

IPC: H01L21/66

CPC classification number: G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148 ,  H01L21/67288 ,  H01L21/68

Abstract: 　欠陥の程度を定量化し、歩留まり管理に有用な情報を提供する。　欠陥画像を分類し、欠陥画像分類結果に基づいて、欠陥画像と、欠陥画像に対応する参照画像それぞれに計測領域と計測箇所を設定し、欠陥画像と参照画像の計測箇所から得た各々の計測値を用いて欠陥の評価値を算出し欠陥を定量化する。

Abstract translation: 量化缺陷程度，并提供有用的收益管理信息。 公开了一种缺陷量化方法，其中：对缺陷图像进行分类; 基于缺陷图像分类结果将测量区域和测量区域设置为每个缺陷图像和参考图像，所述参考图像对应于缺陷图像; 并且使用从缺陷图像和参考图像的每个测量区域获得的每个测量值来计算缺陷的评估值，并且对缺陷进行量化。

公开(公告)号：WO2015175404A1

公开(公告)日：2015-11-19

申请号：PCT/US2015/030145

申请日：2015-05-11

Applicant: KLA-TENCOR CORPORATION

Inventor： KULKARNI, Ashok V.

IPC: H01L21/66

CPC classification number: G06T7/001 ,  G01B21/16 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/9501 ,  G01N23/2251 ,  G01N2021/8825 ,  G01N2021/8887 ,  G01N2201/10 ,  G01N2201/12 ,  G01N2223/6116 ,  G06F17/5045 ,  G06T7/60 ,  G06T7/74 ,  G06T2207/30148 ,  H01L21/67288 ,  H01L22/12

Abstract: Methods and systems for determining a position of inspection data with respect to a stored high resolution die image are provided. One method includes aligning data acquired by an inspection system for alignment sites on a wafer with data for predetermined alignment sites. The predetermined alignment sites have a predetermined position in die image space of a stored high resolution die image for the wafer. The method also includes determining positions of the alignment sites in the die image space based on the predetermined positions of the predetermined alignment sites in the die image space. In addition, the method includes determining a position of inspection data acquired for the wafer by the inspection system in the die image space based on the positions of the alignment sites in the die image space.

Abstract translation: 提供了用于确定检查数据相对于存储的高分辨率管芯图像的位置的方法和系统。 一种方法包括将通过检查系统获取的数据对准用于晶片上的对准位置的数据与用于预定对准位置的数据。 预定的对准位置在晶片的存储的高分辨率芯片图像的管芯图像空间中具有预定位置。 该方法还包括基于管芯图像空间中的预定对准位置的预定位置来确定管芯图像空间中的对准位置的位置。 此外，该方法包括基于管芯图像空间中的对准位置的位置来确定由管芯图像空间中的检查系统为晶片获取的检查数据的位置。

公开(公告)号：WO2015153970A1

公开(公告)日：2015-10-08

申请号：PCT/US2015/024245

申请日：2015-04-03

Applicant: NORDSON CORPORATION

Inventor： TINGAY, John ,  WALKER, William, T. ,  KING, Phil ,  WHITE, Simon ,  STEWART, Kate

IPC: G01N23/083 ,  G01N23/04 ,  G01N23/02

CPC classification number: G01N23/04 ,  G01N2223/309 ,  G01N2223/6113 ,  G01N2223/6116 ,  G01N2223/6462 ,  H01L21/67288 ,  H01L21/681 ,  H01L21/6838 ,  H01L22/12

Abstract: An x-ray inspection system comprising: a cabinet (110), the cabinet (110) containing an x-ray source (100), a sample support (200) for supporting a sample to be inspected, and an x-ray detector (300); an air mover (130) configured to force air into the cabinet (110) through an air inlet (132) in the cabinet (110) above the sample support (200), wherein the air mover (130) and cabinet (110) are configured to force air through the cabinet (110) from the air inlet (132) past the sample support (200) to an air outlet (150) in the cabinet (110) below the sample support (200), and a sample support positioning assembly (310) for positioning the sample support (200) relative to the x-ray source (100) and x-ray detector (300); wherein the sample support (200) comprises an upper surface extending in a horizontal plane and wherein the sample positioning assembly (210) comprises a vertical positioning mechanism (214, 216) for moving the sample support in a vertical direction, orthogonal to the horizontal plane, and a first horizontal positioning mechanism (212, 214) for moving both the sample support (200) and the vertical positioning mechanism (214, 216) in a first horizontal direction.

Abstract translation: 一种x射线检查系统，包括：机壳（110），所述机壳（110）包含x射线源（100），用于支撑待检查样品的样品支撑件（200）和x射线检测器 300）; 空气推动器（130），其构造成通过所述样品支撑件（200）上方的所述机壳（110）中的空气入口（132）将空气强制进入所述机壳（110），其中所述鼓风机（130）和机壳（110） 被配置为迫使来自所述空气入口（132）的所述机壳（110）经过所述样品支撑件（200）到所述样品支撑件（200）下方的所述机壳（110）中的空气出口（150），并且样品支撑定位 用于相对于x射线源（100）和x射线检测器（300）定位样品支架（200）的组件（310）; 其中所述样品支撑件（200）包括在水平平面中延伸的上表面，并且其中所述样品定位组件（210）包括垂直定位机构（214,216），用于沿垂直于水平面的垂直方向移动样品支撑件 以及用于在第一水平方向上移动样品支撑件（200）和垂直定位机构（214,216）的第一水平定位机构（212,214）。

公开(公告)号：WO2015153962A1

公开(公告)日：2015-10-08

申请号：PCT/US2015/024235

申请日：2015-04-03

Applicant: NORDSON CORPORATION

Inventor： WALKER, William, T. ,  WHITE, Simon

IPC: G01N23/083 ,  G01N23/04 ,  G01N23/02

CPC classification number: G01N23/04 ,  G01N2223/309 ,  G01N2223/6113 ,  G01N2223/6116 ,  G01N2223/6462 ,  H01L21/67288 ,  H01L21/681 ,  H01L21/6838 ,  H01L22/12

Abstract: An x-ray inspection system comprising: an x-ray source (100), a sample support (200) for supporting a sample to be inspected, an x-ray detector (300), a sample positioning assembly (210) including a first positioning mechanism (210) for moving the sample support (200) along a first axis towards and away from the x-ray source (100), a proximity sensor (400) fixed to the x-ray source (100) configured to provide a measurement of distance between the x-ray source (100) and a surface of a sample on the sample support (200); and a controller (500) connected to the proximity sensor (400). Measurements from the proximity sensor (400) can be used in image processing calculations and to prevent collision between a sample and the x-ray source (100).

Abstract translation: 一种X射线检查系统，包括：x射线源（100），用于支撑待检查样本的样本支撑件（200），x射线检测器（300），包括第一 定位机构（210），其用于沿着第一轴线朝向和远离所述x射线源（100）移动所述样品支撑件（200）;固定到所述x射线源（100）的接近传感器（400） 测量x射线源（100）与样品支架（200）上的样品表面之间的距离; 以及连接到所述接近传感器（400）的控制器（500）。 来自接近传感器（400）的测量可用于图像处理计算并防止样品与X射线源（100）之间的碰撞。