公开(公告)号：WO2016024917A1

公开(公告)日：2016-02-18

申请号：PCT/SG2015/050257

申请日：2015-08-12

Applicant: ROKKO SYSTEMS PTE LTD

Inventor： LIM, Chong Chen, Gary ,  BAEK, Seung Ho, James ,  JUNG, Jong Jae ,  SHIN, Yun Suk ,  JANG, Deok Chun

IPC: C23C14/34 ,  C23C14/56 ,  H01L23/00

CPC classification number: C23C14/50 ,  C23C14/34 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/67265 ,  H01L21/6836 ,  H01L2221/68313 ,  H01L2221/68368 ,  H01L2221/68386 ,  H01L2924/14

Abstract: A method for preparing a film carrier for sputtering of IC units placed thereon, the method comprising the steps of: providing a carrier of IC units; removing said units from the carrier; delivering said IC units to a flipper; inverting and delivering said units to a sputtering film frame; placing the units on said sputtering film frame in an array having a pre-determined clearance about adjacent units.

Abstract translation: 一种制备放置在其上的IC单元的溅射用膜载体的方法，所述方法包括以下步骤：提供IC单元的载体; 从载体上移除所述单元; 将所述IC单元传送到导板; 将所述单元反转并传送到溅射膜框架; 将单元放置在具有关于相邻单元的预定间隙的阵列中的所述溅射膜框架上。

公开(公告)号：WO2011068478A8

公开(公告)日：2011-06-09

申请号：PCT/SG2010/000447

申请日：2010-11-30

Applicant: ROKKO SYSTEMS PTE LTD ,  JUNG, Jong Jae ,  SHIN, Yun Suk ,  YANG, Hae Choon ,  JANG, Deok Chun

Inventor： JUNG, Jong Jae ,  SHIN, Yun Suk ,  YANG, Hae Choon ,  JANG, Deok Chun

IPC: H01L21/66 ,  B07C5/34 ,  B07C5/02 ,  H01L21/67

Abstract: A method for inspecting and sorting a plurality of IC units comprising the steps of: delivering a frame containing said IC units to a unit picking station; conducting a first inspection of said units during the delivering step and recording the subsequent result; removing said units from the frame, and moving said units from the unit picking station to a flipping station; conducting a second inspection of said units during the moving step and recording the subsequent result; flipping said units to expose an opposed face said units; conducting a third inspection of said opposed face and recording the subsequent result, then; sorting said units into categories based on the recorded results from the first, second and third inspecting steps.

公开(公告)号：WO2019066722A1

公开(公告)日：2019-04-04

申请号：PCT/SG2018/050465

申请日：2018-09-12

Applicant: ROKKO SYSTEMS PTE LTD

Inventor： JUNG, Jong Jae ,  SHIN, Yuk Suk ,  JANG, Deok Chun

IPC: H01L21/00 ,  B25J9/00

Abstract: A system for mounting a flip chip, comprising: at least one flipper arm, having an engagement end; said flipper arm arranged to rotate in a vertical plane; said engagement end arranged to engage a chip and, on engagement, rotate 180⁰.

公开(公告)号：WO2019032048A1

公开(公告)日：2019-02-14

申请号：PCT/SG2018/050401

申请日：2018-08-07

Applicant: ROKKO SYSTEMS PTE LTD

Inventor： SHIN, Yun Suk ,  JUNG, Jong Jae ,  JANG, Deok Chun

IPC: H05K3/40 ,  H01L21/02

Abstract: A method for washing a plurality of PCB units, the method comprising the steps of: receiving a plurality of PCB units, said PCB units arranged with a bump face projecting downwards; washing the bump face of the PCB units, then; flipping the PCB units so as to project a ball face downwards, then; washing the ball face.

公开(公告)号：WO2011078802A1

公开(公告)日：2011-06-30

申请号：PCT/SG2010/000484

申请日：2010-12-23

Applicant: ROKKO SYSTEMS PTE LTD ,  YANG, Hae Choon ,  JUNG, Jong Jae ,  JANG, Deok Chun ,  LIM, Chong Chen, Gary

Inventor： YANG, Hae Choon ,  JUNG, Jong Jae ,  JANG, Deok Chun ,  LIM, Chong Chen, Gary

IPC: H01L21/67 ,  H01L21/677 ,  B65H29/00

CPC classification number: H05K13/0408 ,  H05K13/0413 ,  H05K13/0478 ,  Y10T74/18296 ,  Y10T74/19051

Abstract: A picker assembly comprising: a plurality of pickers in selective variable spaced relation; a shaft having a plurality of cam plates, said cam plates co-axial with said shaft and having a variable thickness; said cam plates in engagement with said pickers and positioned in interstitial spaces between said pickers; wherein the selective variability in spacing is provided by rotation of the shaft such that thickness variation of the cam plates move the respective pickers along an axis parallel to the shaft.

Abstract translation: 选择器组件包括：多个选择性可变间隔关系的拾取器; 具有多个凸轮板的轴，所述凸轮板与所述轴同轴并具有可变的厚度; 所述凸轮板与所述拾取器接合并定位在所述拾取器之间的间隙空间中; 其中间隔的选择性变化通过轴的旋转来提供，使得凸轮板的厚度变化沿着平行于轴的轴线移动各个拾取器。

公开(公告)号：WO2017095327A1

公开(公告)日：2017-06-08

申请号：PCT/SG2016/050569

申请日：2016-11-17

Applicant: ROKKO SYSTEMS PTE LTD

Inventor： BAEK, Seung Ho ,  JANG, Deok Chun ,  JUNG, Jong Jae

IPC: H01L21/67 ,  C23C14/34 ,  C23C14/50

CPC classification number: H01L21/67336 ,  H01L21/6835 ,  H01L22/10 ,  H01L22/12 ,  H01L24/14 ,  H01L2221/68309 ,  H01L2221/68313 ,  H01L2221/68354 ,  H01L2224/1412

Abstract: A method for preparing a stencil to receive a plurality of IC units, the method comprising the steps of: providing a metal substrate having an array of apertures; applying an adhesive surface to said substrate; removing portions of said adhesive surface corresponding to the apertures in the metal substrate.

Abstract translation: 一种用于制备模版以接收多个IC单元的方法，所述方法包括以下步骤：提供具有孔阵列的金属基板; 将粘合剂表面施加到所述基底上; 去除对应于金属衬底中的孔的所述粘合表面的部分。

公开(公告)号：WO2015038068A1

公开(公告)日：2015-03-19

申请号：PCT/SG2014/000427

申请日：2014-09-11

Applicant: ROKKO SYSTEMS PTE LTD

Inventor： HA, Chang Hwan ,  JANG, Deok Chun ,  CHOI, Sang Young ,  KIM, Chang Doun ,  BAEK, Seung Ho

IPC: G06F7/06 ,  H01L21/67 ,  H01L21/77

CPC classification number: H01L21/78 ,  H01L21/67092 ,  H01L21/67271 ,  H01L21/67276

Abstract: There is disclosed a method for singulating IC units from a plurality of substrates, the substrates being divided into a sequence of two or more batches in one or more magazines, the method comprising, in a singulation apparatus having a singulation section and a sorting section: sequentially singulating substrates of a first batch in the singulation section and transporting singulated IC units to the sorting section; determining that singulated units of a last substrate of the first batch have reached the sorting section; sequentially processing substrates of a next batch in the sequence until singulated units of the first substrate of the next batch are ready to be sorted in the sorting section; and on receiving an indication that singulated units of the last substrate of the first batch have been cleared from the sorting section, continuing sequential processing of substrates of the next batch.

Abstract translation: 公开了一种用于从多个基板分离IC单元的方法，所述基板在一个或多个杂志中分成两批以上的序列，所述方法包括在具有单片化部分和分类部分的单片机中： 在分割部分中顺序地分割第一批的基片并将分离的IC单元传送到分选部分; 确定第一批次的最后一个基底的单个单元已经到达分选部分; 顺序地处理下一批次的基板，直到下一批次的第一基板的分割单元准备在分选部分中分类; 并且在接收到从所述分选部分清除了所述第一批次的最后一个基板的分割单元的指示时，继续对下一个批次的基板进行顺序处理。