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    AUTOMATIC PICK-UP EQUIPMENT
    2.
    发明申请
    AUTOMATIC PICK-UP EQUIPMENT 审中-公开

    公开(公告)号：WO2018178348A1

    公开(公告)日：2018-10-04

    申请号：PCT/EP2018/058321

    申请日：2018-03-30

    Applicant: TYCO ELECTRONICS (SHANGHAI) CO. LTD. ,  SHENZHEN AMI TECHNOLOGY CO., LTD. ,  TYCO ELECTRONICS UK LTD

    Inventor： DAI, Zhiyong ,  HU, Lvhai ,  DENG, Yingcong ,  ZENG, Qinglong ,  KANG, Wei

    IPC: B25J15/00 ,  B25J15/02

    Abstract: An automatic pick-up equipment for picking up components with different shapes, comprises: a base (1) mounted on a manipulator of a robot; a first pick-up device (2) mounted on the base and comprising two first gripping mechanisms opposite to each other, which are configured to linearly reciprocate relative to each other to hold a first component (300); and a second pick-up device (3) mounted on the base. The second pick-up device comprises: two second gripping mechanisms (31) opposite to each other, which are configured to pivotally reciprocate relative to each other to grip a second component (400); and a rotation mechanism (32) configured to drive the two second gripping mechanisms to rotate relative to the baseto change a posture of the gripped second component. The automatic pick-up equipment is adapted to pick up components with different shapes and sizes by different gripping ways.

    SOLDERING MACHINE
    3.
    发明申请
    SOLDERING MACHINE 审中-公开
    焊接机

    公开(公告)号：WO2014046922A1

    公开(公告)日：2014-03-27

    申请号：PCT/US2013/059126

    申请日：2013-09-11

    Applicant: TYCO ELECTRONICS CORPORATION ,  SHENZHEN AMI TECHNOLOGY CO., LTD.

    Inventor： LU, Roberto Francisco-YI ,  ZENG, Qinglong ,  FRY, Charles David ,  CHEN, Bicheng

    IPC: B23K1/00 ,  B23K3/08 ,  H01R43/02

    CPC classification number: H05K13/06 ,  B23K1/0016 ,  B23K3/087 ,  B23K2201/42 ,  H01R43/0263

    Abstract: A soldering machine (100) includes a frame (110) and a fixture (106) held by the frame that supports a substrate (104) and a cable. A guidance system (160) is supported by the frame with a camera (102) viewing the fixture that is movable relative to the fixture. A positioning system is supported by the frame. The positioning system (120) has a camera positioner and a soldering mechanism positioner (130). A soldering mechanism (122) is coupled to the soldering mechanism positioner and is moved by the soldering mechanism positioner relative to the fixture. The soldering mechanism solders wires (103) to the substrate. A controller (170) communicates with the positioning system and the guidance system to operates the positing system to control positions of the camera and soldering mechanism relative to the fixture based on an image obtained by the camera.

    Abstract translation: 焊接机（100）包括框架（110）和由框架保持的固定件（106），支撑基板（104）和电缆。 引导系统（160）由框架支撑，相机（102）观察可相对于固定装置移动的固定装置。 定位系统由框架支撑。 定位系统（120）具有相机定位器和焊接机构定位器（130）。 焊接机构（122）耦合到焊接机构定位器，并且通过焊接机构定位器相对于固定装置移动。 焊接机构将线（103）焊接到基板。 控制器（170）与定位系统和引导系统进行通信，以基于由照相机获得的图像来操作定位系统以控制摄像机和焊接机构相对于固定装置的位置。

    CHIP SORTING AND PACKAGING PLATFORM
    4.
    发明申请
    CHIP SORTING AND PACKAGING PLATFORM 审中-公开
    芯片分拣和包装平台

    公开(公告)号：WO2018011718A1

    公开(公告)日：2018-01-18

    申请号：PCT/IB2017/054192

    申请日：2017-07-12

    Applicant: TYCO ELECTRONICS (SHANGHAI) CO. LTD. ,  TE CONNECTIVITY CORPORATION ,  SHENZHEN AMI TECHNOLOGY CO., LTD. ,  TYCO ELECTRONICS UK LTD

    Inventor： ZHOU, Lei ,  ZHANG, Dandan ,  LU, Roberto Francisco-Yi ,  ZENG, Qinglong

    IPC: B07C5/344 ,  B07C5/36

    Abstract: The present disclosure discloses a chip sorting and packaging platform including: a feed module adapted to feed chips; a sorting module configured to pick up the chips fed by the supply module and detecting the picked chips to determine whether the picked chips are qualified; and a packaging module configured to package the qualified chips sorted by the sorting module. In the present disclosure, the sorting and packaging of the clips is automatically achieved by the chip sorting and packaging platform, which greatly improves efficiency of sorting and packaging of the clips. In addition, it is also possible to improve accuracy and reliability of sorting the clips.

    Abstract translation: 本公开公开了一种芯片分类和包装平台，包括：馈送模块，适于馈送芯片; 分拣模块，用于拾取由供给模块供给的芯片并检测拾取的芯片以确定拾取的芯片是否合格; 以及封装模块，其被配置为封装由分类模块分类的合格芯片。 在本发明中，通过芯片分拣包装平台自动实现夹具的分拣和包装，大大提高了夹具分拣包装的效率。 此外，还可以提高分类剪辑的准确性和可靠性。

    DISPENSING MACHINE AUTOMATICALLY DISPENSING FLUID TO PREDETERMINED LOCATIONS
    5.
    发明申请
    DISPENSING MACHINE AUTOMATICALLY DISPENSING FLUID TO PREDETERMINED LOCATIONS 审中-公开
    分配机自动分配流体到预定位置

    公开(公告)号：WO2014046921A1

    公开(公告)日：2014-03-27

    申请号：PCT/US2013/059111

    申请日：2013-09-11

    Applicant: TYCO ELECTRONICS CORPORATION ,  SHENZHEN AMI TECHNOLOGY CO., LTD.

    Inventor： LU, Roberto Francisco-Yi ,  ZENG, Qinglong ,  FRY, Charles David ,  CHEN, Bicheng

    IPC: B05B12/12 ,  H05K3/10

    CPC classification number: B05C9/10 ,  B05B12/122 ,  B05C5/0216 ,  B05C11/1021 ,  B05D1/00 ,  H05K3/3484 ,  H05K13/0469 ,  H05K2203/0126 ,  H05K2203/163

    Abstract: A fluid dispensing machine (100) includes a frame (110) and a fixture (106) held by the frame. The fixture is configured to support a substrate (104). A positioning system (120) is supported by the frame. A guidance system (160) is supported by the positioning system. The guidance system has a camera (102) viewing the fixture that is movable relative to the fixture. A fluid dispenser (122) is supported by the positioning system and is moved by the positioning system relative to the fixture. The fluid dispenser is configured to dispense fluid onto the substrate. A controller (170) communicates with the positioning system and the guidance system. The controller operates the positing system to control a position of the fluid dispenser relative to the fixture based on an image obtained by the camera.

    Abstract translation: 流体分配机器（100）包括框架（110）和由框架保持的夹具（106）。 夹具被构造成支撑衬底（104）。 定位系统（120）由框架支撑。 引导系统（160）由定位系统支撑。 引导系统具有观察可相对于固定装置移动的固定装置的照相机（102）。 流体分配器（122）由定位系统支撑并且被定位系统相对于固定装置移动。 流体分配器构造成将流体分配到基底上。 控制器（170）与定位系统和引导系统进行通信。 控制器操作定位系统，以基于由照相机获得的图像来控制流体分配器相对于固定装置的位置。

    PROGRAM-CONTROLLED AUTOMATIC SOLDERING SYSTEM AND METHOD
    9.
    发明申请
    PROGRAM-CONTROLLED AUTOMATIC SOLDERING SYSTEM AND METHOD 审中-公开
    程序控制自动焊接系统及方法

    公开(公告)号：WO2015028909A2

    公开(公告)日：2015-03-05

    申请号：PCT/IB2014063732

    申请日：2014-08-06

    Applicant: TYCO ELECTRONICS CORP ,  SHENZHEN AMI TECHNOLOGY CO LTD ,  TYCO ELECTRONICS LTD UK

    Inventor： CHEN BICHENG ,  ZENG QINGLONG ,  LU ROBERTO FRANCISCO-YI

    IPC: B23K1/00

    CPC classification number: B23K1/0056 ,  B23K1/0016 ,  B23K26/03 ,  B23K26/04 ,  B25J9/1697 ,  G05B2219/45138

    Abstract: A program-controlled automatic soldering system, comprising: a laser source configured to emit a laser beam; a laser scan head configured to receive the laser beam from the laser source and focus the laser beam on a target position in a work area; a vision system; and a moving device configured to move products under a guidance of the vision system to a position where portions of the products to be soldered overlap the target position, so that the focused laser beam heats a solder material provided on the portions of the products to be soldered to solder the products together.

    Abstract translation: 一种程序控制的自动焊接系统，包括：被配置为发射激光束的激光源; 激光扫描头，被配置为从激光源接收激光束并将激光束聚焦在工作区域中的目标位置; 视觉系统; 以及移动装置，其被配置为在视觉系统的引导下将产品移动到待焊接的产品的一部分与目标位置重叠的位置，使得聚焦的激光束加热设置在产品的部分上的焊料材料 焊接焊接产品在一起。

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