公开(公告)号：WO1997003097A1

公开(公告)日：1997-01-30

申请号：PCT/JP1996001846

申请日：1996-07-03

Applicant: KAO CORPORATION ,  SUMITOMO RUBBER INDUSTRIES, LTD. ,  NITTO DENKO CORPORATION ,  TANAKA, Yasuyuki ,  SHIBATA, Kazuhiko ,  HAYASHI, Masaharu ,  NAKADE, Shinichi ,  KANAMARU, Eiji

Inventor： KAO CORPORATION ,  SUMITOMO RUBBER INDUSTRIES, LTD. ,  NITTO DENKO CORPORATION

IPC: C08F253/00

CPC classification number: C08F253/00 ,  C08L51/04 ,  C09J7/383 ,  C08F212/08 ,  C08F220/14

Abstract: A graft natural rubber pressure-sensitive adhesive containing in a latex state a copolymer formed by graft polymerizing a vinyl polymer onto a natural rubber having a protein content of 0.1 % by weight or less in terms of nitrogen, and a pressure-sensitive adhesive tape comprising a support having coated on at least one surface thereof the pressure-sensitive adhesive. The pressure-sensitive adhesive is excellent in various properties such as film-forming property, pressure-sensitive characteristics, water resistance, and electrical insulation property.

Abstract translation: 一种含有胶乳状态的接枝天然橡胶压敏粘合剂，该共聚物通过将乙烯基聚合物接枝聚合到蛋白质含量以氮计为0.1重量％以下的天然橡胶上而形成的共聚物，以及包含 在其至少一个表面上涂覆有压敏粘合剂的载体。 压敏粘合剂在成膜性，压敏特性，耐水性和电绝缘性等各种性能方面是优异的。

公开(公告)号：WO1991018415A1

公开(公告)日：1991-11-28

申请号：PCT/JP1991000680

申请日：1991-05-22

Applicant: NIPPON MEKTRON, LTD. ,  TANAKA, Yasuyuki ,  OOMACHI, Chikafumi

Inventor： NIPPON MEKTRON, LTD.

IPC: H01L21/60

CPC classification number: H01L23/49816 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/81192 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/189 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3494 ,  H05K2201/0108 ,  H05K2201/10719 ,  H05K2203/107 ,  H05K2203/304 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T29/49144 ,  H01L2924/00

Abstract: A circuit board for mounting ICs comprises required circuit conductor patterns formed on one side of an insulation layer, bumps for bonding the pads of ICs to them which are connected to required parts of the circuit conductor patterns electrically, penetrate the insulation layer and protruding to the external of the circuit board, and a light transmitting insulation coating layer which can transmit irradiation light for heating and melting the bumps and is formed on the circuit conductor pattern side. There is a basic method of mounting ICs on such a circuit board in which pads of an IC chip are connected electrically with the bumps after heating and melting the bumps by the action of the irradiation light projected concentratedly on the bump parts from the side of the light transmitting insulation coating layer in the state that the IC chip are placed on the bumps.

Abstract translation: 用于安装IC的电路板包括形成在绝缘层的一侧上的所需的电路导体图案，用于将电连接到电路导体图案的所需部分的IC的焊盘接合到其上的凸块穿过绝缘层并突出到 电路板的外部，透光绝缘被覆层，该透光绝缘被覆层能够透过照射光来加热熔融凸块，并形成在电路导体图案侧。 在这样的电路板上安装有IC的基本方法，其中IC芯片的焊盘在加热和熔化凸起之后，通过聚集在凸起部分上的照射光的作用从IC侧的 透光绝缘涂层处于IC芯片放置在凸块上的状态。

公开(公告)号：WO1991006977A1

公开(公告)日：1991-05-16

申请号：PCT/JP1990001413

申请日：1990-11-02

Applicant: NIPPON MEKTRON, LTD. ,  OOMACHI, Chikafumi ,  TANAKA, Yasuyuki

Inventor： NIPPON MEKTRON, LTD.

IPC: H01L21/60

CPC classification number: H01L24/16 ,  H01L21/486 ,  H01L23/49572 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/86 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/0393 ,  H05K1/113 ,  H05K3/423 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A flexible circuit board for mounting IC has conductor bumps on the rear surface, and they penetrate the flexible circuit board to connect a circuit wiring pattern. The surfaces of the bumps can be coated with a bonding metal depending on the structure of the bumps. Bare IC chips are easily connected to the bumps of the circuit board by a thermal or ultrasonic bonding method. When such bumps or protrusions for bonding to IC pads are provided on the flexible circuit board, tiny holes are preferably formed in the insulating substrate by excimer laser means. The bumps are formed by plating means such as soldering or by a suitable treatment for filling the holes with an electrically conductive material. Further, the bumps should desirably be formed in a semi-spherical shape by the reflow treatment.

Abstract translation: 用于安装IC的柔性电路板在后表面具有导体凸块，并且它们穿过柔性电路板以连接电路布线图案。 凸起的表面可以根据凸块的结构用粘结金属涂覆。 裸IC芯片通过热或超声波接合方法容易地连接到电路板的凸块。 当在柔性电路板上设置用于与IC焊盘接合的这种凸起或凸起时，优选通过准分子激光装置在绝缘衬底中形成微小的孔。 凸起由诸如焊接的电镀装置或通过用导电材料填充孔的适当处理形成。 此外，优选通过回流处理将凸块形成为半球形。

公开(公告)号：WO1996028500A1

公开(公告)日：1996-09-19

申请号：PCT/JP1996000640

申请日：1996-03-14

Applicant: FUJI LATEX CO., LTD. ,  SUMITOMO RUBBER INDUSTRIES, LTD. ,  KAO CORPORATION ,  TANAKA, Yasuyuki ,  NAKADE, Shinichi ,  OCHI, Atsuko ,  SAKAKI, Toshiaki ,  HAYASHI, Masaharu ,  SEKIGUCHI, Kazuhiro ,  KUGA, Akihito ,  KANAMARU, Eiji

Inventor： FUJI LATEX CO., LTD. ,  SUMITOMO RUBBER INDUSTRIES, LTD. ,  KAO CORPORATION

IPC: C08J05/02

CPC classification number: C08J3/244 ,  C08C1/04 ,  C08J5/00 ,  C08J5/02 ,  C08J2307/00 ,  Y10S524/925 ,  Y10S524/926 ,  Y10S528/932 ,  Y10S528/934 ,  Y10S528/935

Abstract: A process for preparing a deproteinized natural rubber latex, while lowering the allergen content of a natural rubber latex as the raw material to such an extent as will be safe for the human body without sacrificing the yield and moldability. The step of washing off non-rubber components is provided after each of the steps of proteolysis, precure, and molding by using an aqueous alkali solution, ammonia, water containing 0.005 to 0.02 % by weight of free chlorine, or an alcohol-water mixture having an alcohol content of 5 to 80 % by weight as the washing solution for the treatment. The process is suitable for the preparation of natural rubber products such as rubber gloves, condoms, catheters, and foam rubbers.

Abstract translation: 一种制备脱蛋白天然橡胶胶乳的方法，同时将作为原料的天然橡胶胶乳的变应原含量降低到对人体而言不会牺牲产率和成型性的安全性。 通过使用碱水溶液，氨，含有0.005〜0.02重量％的游离氯的水或醇 - 水混合物进行蛋白水解，预固化和成型的各步骤之后，提供洗涤非橡胶成分的步骤 醇的含量为5〜80重量％，作为处理用洗涤液。 该方法适用于天然橡胶制品的制备，如橡胶手套，避孕套，导管和泡沫橡胶。

公开(公告)号：WO1991016726A1

公开(公告)日：1991-10-31

申请号：PCT/JP1991000523

申请日：1991-04-19

Applicant: NIPPON MEKTRON, LTD. ,  TANAKA, Yasuyuki ,  OOMACHI, Chikafumi

Inventor： NIPPON MEKTRON, LTD.

IPC: H01L21/60

CPC classification number: H01L24/81 ,  H01L21/4853 ,  H01L23/3192 ,  H01L23/49816 ,  H01L23/5384 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/05572 ,  H01L2224/0603 ,  H01L2224/10175 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/0393 ,  H05K1/113 ,  H05K3/3457 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/4069 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09436 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09845 ,  H05K2201/10734 ,  H05K2203/043 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A multilayer circuit board for mounting ICs so constituted that IC bare chips can be mounted directly on the multilayer circuit board comprising a flexible circuit board and a manufacturing method thereof. Hole parts for connecting electrically ICs with a desired conductive layer of the multilayer circuit board are formed in required positions of the circuit board and conductive bump members protruding from the circuit board are formed with a means for plating the hole parts or with a means for filling the holes with a conductive material. The pads of the IC bare chips can be electrically connected with the desired conductive layer of the circuit board through these conductive bump members reliably. Thus, the IC bare chips can be easily and quickly mounted through the bump members on the multilayer circuit board by a heat or ultrasonic bonding method or by means of a laser beam, infrared rays or the like.

Abstract translation: 一种用于安装IC的多层电路板，使得IC裸芯片可以直接安装在包括柔性电路板的多层电路板及其制造方法上。 用于将电IC连接到多层电路板的所需导电层的孔部分形成在电路板的所需位置，并且从电路板突出的导电凸块部件形成有用于电镀孔部件的装置或用于填充的装置 具有导电材料的孔。 IC裸芯片的焊盘可以通过这些导电凸块部件可靠地与电路板的期望的导电层电连接。 因此，通过热或超声波接合方法或者通过激光束，红外线等可以容易且快速地通过多层电路板上的凸起构件安装IC裸芯片。