Abstract:
The LDMOS transistor (1) of the invention comprises a substrate (2), a gate electrode (10), a substrate contact region (11), a source region (3), a channel region (4) and a drain region (5), which drain region (5) comprises a drain contact region (6) and a drain extension region (7). The drain contact region (6) is electrically connected to a top metal layer (23), which extends over the drain extension region (7), with a distance (723) between the top metal layer (23) and the drain extension region (7) that is larger than 2μm. This way the area of the drain contact region (6) may be reduced and the RF power output efficiency of the LDMOS transistor (1) increased. In another embodiment the source region (3) is electrically connected to the substrate contact region (11) via a suicide layer (32) instead of a first metal layer (21), thereby reducing the capacitive coupling between the source region (3) and the drain region (5) and hence increasing the RF power output efficiency of the LDMOS transistor (1) further.
Abstract:
The LDMOS transistor of the invention is provided with a stepped shield structure and/or with a first and a second drain extension region having a higher dopant concentration than the second drain extension region, and being covered by the shield.
Abstract:
The LDMOS transistor (1) of the invention comprises a substrate (2), a gate electrode (10), a substrate contact region (11), a source region (3), a channel region (4) and a drain region (5), which drain region (5) comprises a drain contact region (6) and a drain extension region (7). The drain contact region (6) is electrically connected to a top metal layer (23), which extends over the drain extension region (7), with a distance (723) between the top metal layer (23) and the drain extension region (7) that is larger than 2µm. This way the area of the drain contact region (6) may be reduced and the RF power output efficiency of the LDMOS transistor (1) increased. In another embodiment the source region (3) is electrically connected to the substrate contact region (11) via a suicide layer (32) instead of a first metal layer (21), thereby reducing the capacitive coupling between the source region (3) and the drain region (5) and hence increasing the RF power output efficiency of the LDMOS transistor (1) further.
Abstract:
The LDMOS transistor (1) of the invention comprises a source region (3), a channel region (4), a drain extension region (7) and a gate electrode (10). The LDMOS transistor (1) further comprises a first gate oxide layer (8) and a second gate oxide layer (9), which is thicker than the first gate oxide layer (8). The first gate oxide layer (8) at least extends over a first portion of the channel region (4), which is adjacent to the source region (3). The second gate oxide layer (9) extends over a region where a local maximum (A, B) of the electric field (E) generates hot carriers thereby reducing the impact of the hot carriers and reducing the Idq-degradation. In another embodiment the second gate oxide layer (9) extends over a second portion of the channel region (4), which mutually connects the drain extension region (7) and the first portion of the channel region (4), thereby improving the linear efficiency of the LDMOS transistor (1).
Abstract:
The invention relates to in particular a lateral DMOST with a drain extension (8). In the known transistor a further metal strip (20) is positioned between the gate electrode contact strip and the drain contact (16) which is electrically connected with the source region contact (15). In the device proposed here, the connection between the further metal strip (20) and the source contact (15,12) comprises a capacitor (30) and the further metal strip (20) is provided with a further contact region (35) for delivering a voltage to the further metal strip (20). In this way an improved linearity is possible and the usefulness of the device is improved in particular at high power and at high frequencies. Preferably the capacitor (30) is integrated with the transistor in a single semiconductor body (1). The invention further comprises a method of operating a device (10) according to the invention.
Abstract:
An LDMOS transistor (100) on a substrate (70a, 70b) of a first conductivity type, comprises a first source region (10a), a second source region (10b) both with a source portion (73) and a common drain region (112, 212). The source portions and common drain region are of a second conductivity type opposite to the first conductivity type. The source portions and the common drain region are mutually connected through respective channel region (28a, 28b) in the substrate over which respective gate electrodes (14a, 14b) extend. The common drain region is a compound drain region comprising a first drain region (112), a second drain region (212).An isolation region (130) separating the first drain region from the second drain region by a separating distance (S) is provided in said common drain region to allow decoupling of the output capacitance and the thermal properties.
Abstract:
The invention relates to in particular a lateral DMOST with a drain extension (8). In the known transistor a further metal strip (20) is positioned between the gate electrode contact strip and the drain contact (16) which is electrically connected with the source region contact (15). In the device proposed here, the connection between the further metal strip (20) and the source contact (15,12) comprises a capacitor (30) and the further metal strip (20) is provided with a further contact region (35) for delivering a voltage to the further metal strip (20). In this way an improved linearity is possible and the usefulness of the device is improved in particular at high power and at high frequencies. Preferably the capacitor (30) is integrated with the transistor in a single semiconductor body (1). The invention further comprises a method of operating a device (10) according to the invention.
Abstract:
An LDMOS transistor (100) on a substrate (70a, 70b) of a first conductivity type, comprises a source region (10) with a source portion (73) and a drain region (12). The source portion and drain region are of a second conductivity type opposite to the first conductivity type and are mutually connected through a channel region (28) in the substrate over which a gate electrode (14) extends. The drain region comprises a drain contact region (16) and a drain extension region (15) which extends from the channel region (28) towards the drain contact region. The drain contact region is electrically connected to a top metal layer (22) by a drain contact (20), and a poly-Si drain contact layer (80) is arranged as a first contact material in between the drain contact region and the drain contact in a contact opening (51) of a first dielectric layer (52) deposited on the surface of the drain region. The poly-Si drain contact layer comprises a dopant element of the second conductivity type which is diffused therefrom through annealing to form said drain contact region.
Abstract:
The LDMOS transistor (1) of the invention comprises a source region (3), a channel region (4), a drain extension region (7) and a gate electrode (10). The LDMOS transistor (1) further comprises a first gate oxide layer (8) and a second gate oxide layer (9), which is thicker than the first gate oxide layer (8). The first gate oxide layer (8) at least extends over a first portion of the channel region (4), which is adjacent to the source region (3). The second gate oxide layer (9) extends over a region where a local maximum (A, B) of the electric field (E) generates hot carriers thereby reducing the impact of the hot carriers and reducing the Idq-degradation. In another embodiment the second gate oxide layer (9) extends over a second portion of the channel region (4), which mutually connects the drain extension region (7) and the first portion of the channel region (4), thereby improving the linear efficiency of the LDMOS transistor (1).
Abstract:
The LDMOS transistor (99) of the invention is provided with a stepped shield structure (50) and/or with a first (25) and a second (26) drain extension region having a higher dopant concentration than the second drain extension region, and being covered by the shield.