摘要:
The invention has its object to effect simultaneous multi-color printing on a container having drum sections recessed from a drum portion by means of a simple construction. To attain such object, according to the invention, a timing screw (35) conveys containers (1), a transfer drum (10) is rotated, a first marking roll (31) transfers ink to stationary shoulder transfer surface portions (11) and stationary drum transfer surface portions (13), a second marking roll transfers ink to movable transfer surface portions (20), and after ink is transferred to shoulder portions (4), drum portion (6) and a neck portion (5) of a container (1) held between a guide (34) and the transfer roll (10) and moved in rotation and printing is performed, a cleaning roll (30) removes the remaining ink on the stationary shoulder transfer surface portions (11), stationary drum transfer surface portions (13) and the movable transfer surface portions (20).
摘要:
Provided is a method of manufacturing a capacitive electromechanical transducer using fusion bonding, which is capable of reducing fluctuations in initial deformation among diaphragms caused at positions having different boundary conditions such as the bonding area, thereby enhancing the uniformity of the transducer and stabilizing the sensitivity and the like. The method of manufacturing a capacitive electromechanical transducer includes: forming an insulating layer on a first silicon substrate and forming at least one recess; fusion bonding a second silicon substrate onto the insulating layer; and thinning the second silicon substrate and forming a silicon film. The method further includes, before the bonding of the second silicon substrate onto the insulating layer, forming a groove in the insulating layer at the periphery of the at least one recess.
摘要:
An oscillating structure includes a supporting member, a first oscillating member, second oscillating member, a first resilient supporting member configured to connect the supporting member and the first oscillating member and to support the first oscillating member for oscillatory motion around the supporting member as a central axis, and a second resilient supporting member configured to connect the first oscillating member and the second oscillating member and to support the second oscillating member movably relative to the first oscillating member, wherein the direction in which the first resilient supporting member extends from the supporting member to the first oscillating member and the direction in which the second resilient supporting member extends from the first oscillating member to the second oscillating member are opposite to each other.
摘要:
Provided is a method of manufacturing a capacitive electromechanical transducer using fusion bonding, which is capable of reducing fluctuations in initial deformation among diaphragms caused at positions having different boundary conditions such as the bonding area, thereby enhancing the uniformity of the transducer and stabilizing the sensitivity and the like. The method of manufacturing a capacitive electromechanical transducer includes: forming an insulating layer on a first silicon substrate and forming at least one recess; fusion bonding a second silicon substrate onto the insulating layer; and thinning the second silicon substrate and forming a silicon film. The method further includes, before the bonding of the second silicon substrate onto the insulating layer, forming a groove in the insulating layer at the periphery of the at least one recess.
摘要:
Provided is a capacitive electromechanical transducer manufactured by fusion bonding, which is capable of enhancing the performance by reducing fluctuations in initial deformation among diaphragms caused at positions having difference boundary conditions such as the bonding area. The capacitive electromechanical transducer includes a device (101), the device including at least one cellular structure (102) including: a silicon substrate; a diaphragm; and a diaphragm supporting portion configured to support the diaphragm so that a gap is formed between one surface of the silicon substrate and the diaphragm. The device has, in its periphery, a groove (103) formed in a layer shared with the diaphragm supporting portion.
摘要:
A microstructure manufacturing method includes forming a first insulating film on an Si substrate, exposing an Si surface by removing a part of the first insulating film, forming a recessed portion by etching the Si substrate from the exposed Si surface, forming a second insulating film on a sidewall and a bottom of the recessed portion, forming an Si exposed surface by removing at least a part of the second insulating film formed on the bottom of the recessed portion, and filling the recessed portion with a metal from the Si exposed surface by electrolytic plating.
摘要:
A polyisocyanate composition which comprises (a) a hydrophilic polyisocyanate comprising at least one diisocyanate selected from among aliphatic and alicyclic diisocyanates, at least one base polyisocyanate selected from the group consisting of polyisocyanates derived from the above at least one diisocyanate and having two or more terminal isocyanate groups, and a nonionic hydrophilic group composed of on average 5 to 50 repeating ethylene oxide units which is bonded to the base polyisocyanate, wherein the amount of the hydrophilic groups is 2 to 50 wt.% based on the total weight of the base polyisocyanate and the hydrophilic group, and (b) 0.5 to 20 wt.% (based on the total weight of the components (a) and (b)) of a substantially water-free ionic surfactant. This polyisocyanate composition is not only excellent in dispersibility in water, but also highly stable in a state dispersed in water because the reaction of the terminal isocyanate group of the polyisocyanate with water is inhibited. A two-package aqueous coating composition comprising the polyisocyanate composition as a curing agent and an aqueous polyol as a chief material is excellent in pot life, water resistance and so on, and is extremely useful as various aqueous coating materials, adhesives, building materials and sealing compounds.