公开(公告)号：WO2003101164A1

公开(公告)日：2003-12-04

申请号：PCT/US2003/014838

申请日：2003-05-13

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： CHARLES, Scott B., ,  GROSS, Kathleen M., ,  HACKETT, Steven C., ,  KROPP, Michael A., ,  SCHULTZ, William J., ,  THOMPSON, Wendy L.,

IPC: H05K1/18

CPC classification number: H01L23/295 ,  H01L21/563 ,  H01L23/293 ,  H01L24/29 ,  H01L2224/16 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K3/305 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/05442

Abstract: The invention provides electronic articles and methods of making said articles. The electronic articles comprise an electronic component (12) bonded and electrically connected to a substrate (14) using an underfill adhesive (16) comprising the reaction product of a thermosetting resin, curing catalyst, and surface-treated nanoparticles (18) that are substantially spherical, non-agglomerated, amorphous, and solid.

Abstract translation: 本发明提供了制造所述制品的电子制品和方法。 电子制品包括使用底部填充粘合剂（16）粘合并电连接到基底（14）的电子部件（12），所述底部填充粘合剂包括热固性树脂，固化催化剂和表面处理的纳米颗粒（18）的反应产物，所述反应产物基本上 球形，非团聚，无定形和固体。