Abstract:
A multilayer construction is disclosed that includes a dielectric substrate defining a through via having top and bottom openings at respective major top and bottom surfaces of the substrate. The multilayer construction also includes an electrically continuous electrode that includes first and second electrode portions disposed on the respective major top and bottom surfaces covering the respective top and bottom openings of the via, and a third electrode portion filling the via and making physical and electrical contact with the first and second electrode portions. The second electrode portion has a bottom major surface having a curved concave surface portion aligned with the through via.
Abstract:
A flexible multilayer construction is configured for mounting an electronic device. The flexible multilayer construction includes electrically conductive spaced apart first and second pads for electrically connecting to corresponding electrically conductive first and second terminals of the electronic device. The first and second pads define a capillary groove therebetween that is at least partially filled with an electrically insulative reflective material by a capillary action.
Abstract:
Various embodiments provide a flexible printed circuit comprising a substrate layer portion and an electrically-conductive layer portion. The electrically-conductive layer portion may be superimposed over the substrate layer portion. The substrate layer portion may have an opening formed therein and part of the electrically-conductive layer portion may be positioned over the opening to form a partially detachable tab. The tab may be for use in initiating separation of one portion of the flexible printed circuit from another portion of the flexible printed circuit. Various embodiments provide a corresponding method of fabrication of a flexible printed circuit. Various embodiments provide a corresponding method of fabrication of a plurality of electronic devices.