公开(公告)号：WO2018076151A1

公开(公告)日：2018-05-03

申请号：PCT/CN2016/103150

申请日：2016-10-25

Applicant: ACM RESEARCH (SHANGHAI) INC.

Inventor： WANG, Hui ,  WANG, Xi ,  CHENG, Cheng ,  WU, Jun

IPC: H01L21/67 ,  B05C5/00

Abstract: An apparatus and a method for wet process on a semiconductor substrate are provided. The apparatus includes a process chamber (1005), a chuck (1002) for holding and positioning a semiconductor substrate (1001) disposed in the process chamber, a rotating driving mechanism(1004) driving the chuck to rotate, a chamber shroud (1006) disposed surrounding the process chamber, at least one vertical driving mechanism driving the chamber shroud to move up or down, a shielding cover (1007), at least one driving device (1008) driving the shielding cover to cover down or lift up, at least one dispenser module (1014) having a dispenser (1030) for spraying liquid to the surface of the semiconductor substrate. When the shielding cover covers above the process chamber, the chamber shroud is moved up to couple with the shielding cover, so as to seal the process chamber for preventing the liquid from splashing out of the process chamber.

Abstract translation: 提供了一种用于半导体衬底上的湿法工艺的装置和方法。 该装置包括处理室（1005），用于保持和定位设置在处理室中的半导体衬底（1001）的卡盘（1002），驱动卡盘旋转的旋转驱动机构（1004），室护罩（1006） （1007）;至少一个驱动装置（1008），所述驱动装置（1008）驱动所述屏蔽罩以覆盖或提起，至少一个驱动装置（1008）围绕所述处理室设置，至少一个驱动所述罩护罩以上下移动的垂直驱动机构， 一个分配器模块（1014），其具有用于将液体喷射到半导体衬底的表面的分配器（1030）。 当屏蔽罩覆盖在处理室上方时，室护罩向上移动以与屏蔽罩连接，以密封处理室以防止液体溅出处理室。

公开(公告)号：WO2017156758A1

公开(公告)日：2017-09-21

申请号：PCT/CN2016/076681

申请日：2016-03-18

Applicant: ACM RESEARCH (SHANGHAI) INC.

Inventor： WANG, Hui ,  YANG, Hongchao ,  WU, Jun ,  WANG, Wenjun ,  CHEN, Fuping ,  FANG, Zhiyou

IPC: H01L21/67

Abstract: A substrate heat treatment apparatus for heat treating a substrate, comprising a bake plate, a plurality of support components, a baffle plate, and a driving device. The bake plate defines at least one gas passage. The plurality of support components support the substrate. The baffle plate is fixed on a top surface of the bake plate. The baffle plate surrounds the substrate and a gap is formed between an inner circumferential wall of the baffle plate and the substrate. A driving device drives the plurality of support components to move up or down. When heat treating the substrate, a hot gas is supplied to the space between the substrate and the top surface of the bake plate through the gas passage of the bake plate, and the hot gas flows out through the gap for-med between the inner circumferential wall of the baffle plate and the substrate.

Abstract translation: 一种用于热处理基板的基板热处理装置，包括烘烤板，多个支撑部件，挡板和驱动装置。 烘烤板限定至少一个气体通道。 多个支撑部件支撑基板。 挡板固定在烘烤板的顶面上。 挡板包围基板，在挡板的内周壁与基板之间形成间隙。 驱动装置驱动多个支撑部件上下移动。 在对基板进行加热处理时，通过烘烤板的气体通道向基板与烘烤板的上表面之间的空间供给热气体，热气体通过内周壁之间的间隙流出 挡板和基板的壁。

公开(公告)号：WO2017054146A1

公开(公告)日：2017-04-06

申请号：PCT/CN2015/091150

申请日：2015-09-30

Applicant: ACM RESEARCH (SHANGHAI) INC.

Inventor： ZHANG, Xiaoyan ,  WU, Jun ,  WANG, Hui ,  CHEN, Fuping

IPC: H01L21/67 ,  H01L21/02 ,  B08B3/04 ,  B08B7/04

CPC classification number: H01L21/68771 ,  H01L21/67051 ,  H01L21/68728 ,  H01L21/68764

Abstract: An apparatus (2000,3000,9000) for cleaning packaged wafers (1000) is provided. The apparatus (2000,3000,9000) comprises: a chuck (2001,3001,9001) holding at least two wafers (1000), the at least two wafers (1000) are disposed with a distance from the center of the chuck (2001,3001,9001), and each wafer (1000) has a plurality of tiny structures (1003) on a surface of the wafer (1000); driving device (2002,3002,9002) drives the chuck (2001,3001,9001) to rotate; and at least one nozzle (2003,2004, 3003,3004, 9003,9004) sprays fluid to the wafers (1000) for cleaning or drying the wafers (1000). Apparatus (2000,3000,9000) further provides a method for cleaning wafers (1000). The method comprises: loading at least two wafers (1000) on the chuck (2001,3001,9001), the at least two wafers (1000) are disposed with a distance from the center of the chuck (2001,3001,9001), and each wafer (1000) has a plurality of tiny structures (1003) on a surface of the wafer (1000); driving the chuck (2001,3001,9001) to rotate at a rotation speed; and spraying fluid to the wafers (1000) for cleaning or drying the wafers (1000).

Abstract translation: 提供了一种用于清洁封装晶片（1000）的设备（2000,3000,9000）。 所述装置（2000,3000,9000）包括：夹持至少两个晶片（1000）的卡盘（2001,3001,9001），所述至少两个晶片（1000）设置成与所述卡盘的中心距离（2001 ，3001,9001），并且每个晶片（1000）在晶片（1000）的表面上具有多个微小结构（1003）; 驱动装置（2002,3002,9002）驱动卡盘（2001,3001,9001）旋转; 并且至少一个喷嘴（2003,2004,3003,3004,9003,9004）将流体喷射到晶片（1000）以用于清洁或干燥晶片（1000）。 装置（2000,3000,9000）还提供了清洁晶片（1000）的方法。 该方法包括：将至少两个晶片（1000）装载在卡盘（2001,3001,9001）上，至少两个晶片（1000）设置成距卡盘中心一定距离（2001,3001,9001）， 并且每个晶片（1000）在晶片（1000）的表面上具有多个微小结构（1003）; 驱动卡盘（2001,3001,9001）以旋转速度旋转; 以及将流体喷射到晶片（1000）上以清洁或干燥晶片（1000）。

公开(公告)号：WO2015184628A1

公开(公告)日：2015-12-10

申请号：PCT/CN2014/079323

申请日：2014-06-06

Applicant: ACM RESEARCH (SHANGHAI) INC.

Inventor： ZHANG, Xiaoyan ,  WANG, Hui ,  WU, Jun ,  CHENG, Cheng ,  CHEN, Fufa ,  CHEN, Fuping

IPC: H01L21/02 ,  H01L21/30

CPC classification number: H01L21/68792 ,  H01L21/02087 ,  H01L21/6708 ,  H01L21/67126 ,  H01L21/68785

Abstract: An apparatus and a method for removing a film on edge of backside of a wafer. The apparatus includes a vacuum chuck (110) having an inner groove (111) and an outer groove (1113) defined at the peripheral edge of the vacuum chuck (110), an inner sealing ring (1115) disposed in the inner groove (111); and an outer sealing ring (1116) disposed in the outer groove (1113). When the wafer is put on the vacuum chuck (110), the space defined by the wafer and the area of the vacuum chuck (110) encircled by the inner sealing ring (1115) is vacuumized for holding and positioning the wafer on the vacuum chuck (110), and the space defined by the wafer and the area between the inner sealing ring (1115) and the outer sealing ring (1116) of the vacuum chuck (110) is filled with pressurized gas for making the space defined by the wafer and the area between the inner sealing ring (1115)and the outer sealing ring (1116) of the vacuum chuck (110) maintain positive pressure for preventing liquid from getting into the center area of the backside of the wafer.

Abstract translation: 一种用于去除晶片背面边缘的薄膜的设备和方法。 该装置包括：真空吸盘（110），其具有限定在真空吸盘（110）的周缘的内槽（111）和外槽（1113）;内密封环（1115），设置在内槽 ）; 以及设置在外槽（1113）中的外密封圈（1116）。 当将晶片放在真空吸盘（110）上时，将由晶片限定的空间和由内密封环（1115）包围的真空吸盘（110）的面积抽真空，以将晶片保持并定位在真空吸盘 （110），并且由所述晶片限定的空间和所述真空卡盘（110）的所述内密封环（1115）和所述外密封环（1116）之间的面积填充有用于制造由所述晶片限定的空间的加压气体 并且真空吸盘（110）的内密封环（1115）和外密封圈（1116）之间的面积保持正压，以防止液体进入晶片背面的中心区域。

公开(公告)号：WO2016127635A1

公开(公告)日：2016-08-18

申请号：PCT/CN2015/089096

申请日：2015-09-08

Applicant: ACM RESEARCH (SHANGHAI) INC.

Inventor： CHU, Zhenming ,  WANG, Xi ,  WANG, Hui ,  JIA, Shena ,  WU, Jun ,  CHEN, Fuping ,  LI, Xuejun

IPC: H01L21/302 ,  B08B3/12

CPC classification number: H01L21/67051 ,  B08B3/02 ,  B08B3/024 ,  B08B3/08 ,  B08B3/12 ,  B08B5/02 ,  B08B9/00 ,  B08B13/00 ,  B08B2203/0288 ,  G01B5/14 ,  G01B7/14 ,  G01B11/14 ,  G08B21/182 ,  H01L21/687

Abstract: A fall-proof apparatus for cleaning semiconductor devices is provided. The fall-proof apparatus comprises: a nozzle (102) connecting with a carrier(101); a megasonic/ultrasonic device (105) fixing on the carrier (101); and a sensor (104) detecting the distance between the megasonic/ultrasonic device (105) and the carrier (101) to determine whether the megasonic/ultrasonic device (105) is loose and going to fall. The megasonic/ultrasonic device works with the nozzle during a cleaning process. A chamber with the fall-proof apparatus is also provided.

Abstract translation: 提供了用于清洁半导体器件的防坠落装置。 防坠装置包括：与承载件连接的喷嘴（102）; 固定在所述载体（101）上的兆声波/超声波装置（105）; 以及检测所述兆声波/超声波装置（105）与所述载体（101）之间的距离的传感器（104），以确定所述兆声波/超声波装置（105）是否松动并将下降。 超声波/超声波装置在清洁过程中与喷嘴配合使用。 还提供具有防坠落装置的室。

公开(公告)号：WO2016045072A1

公开(公告)日：2016-03-31

申请号：PCT/CN2014/087493

申请日：2014-09-26

Applicant: ACM RESEARCH (SHANGHAI) INC.

Inventor： WANG, Xi ,  CHENG, Cheng ,  WU, Jun ,  WANG, Hui

IPC: B08B1/04 ,  H01L21/304

CPC classification number: H01L21/67046 ,  B08B1/002 ,  B08B1/02 ,  B08B1/04 ,  B08B3/041 ,  B08B3/08 ,  H01L21/02096 ,  H01L21/68764

Abstract: An apparatus and method for cleaning semiconductor wafer are provided. The apparatus includes a brush module, a swing arm, a rotating actuator and an elevating actuator. The brush module has a brush head for providing mechanical force on a surface of a wafer. An end of the swing arm mounts the brush module. The rotating actuator is connected with the other end of the swing arm. The rotating actuator drives the swing arm to swing across the whole surface of the wafer, which brings the brush head moving across the whole surface of the wafer. The elevating actuator is connected with the other end of the swing arm. The elevating actuator drives the swing arm to rise or descend, which brings the brush module rising or descending. The apparatus cleans the semiconductor wafer by means of the brush head, which improves the cleaning effect.

Abstract translation: 提供了一种用于清洁半导体晶片的设备和方法。 该装置包括刷子模块，摆臂，旋转致动器和升降致动器。 刷子模块具有用于在晶片的表面上提供机械力的刷头。 摆臂的一端安装刷子模块。 旋转执行器与摆臂的另一端连接。 旋转的致动器驱动摆臂跨过晶片的整个表面，这使得刷头移动跨越晶片的整个表面。 升降驱动器与摆臂的另一端连接。 升降驱动器驱动摆臂上升或下降，使刷子模块上升或下降。 该装置通过刷头清洁半导体晶片，这改善了清洁效果。

公开(公告)号：WO2018006283A1

公开(公告)日：2018-01-11

申请号：PCT/CN2016/088754

申请日：2016-07-06

Applicant: ACM RESEARCH (SHANGHAI) INC.

Inventor： CHEN, Fufa ,  FANG, Zhiyou ,  WU, Jun ,  WANG, Hui ,  CHEN, Fuping ,  WANG, Wenjun

IPC: H01L21/67

Abstract: A substrate supporting apparatus (300) for cleaning a back side of a substrate (107) is provided. The substrate supporting apparatus (300) has a hollow shaft (319) and a rotary spindle (303). The rotary spindle (303) is set in the hollow shaft (319) and a spacing is formed between an outer wall of the rotary spindle (303) and an inner wall of the hollow shaft (319). The outer wall of the rotary spindle (303) defines a blocking wall (322) and a recess (324) to prevent particles in the spacing from entering a gas groove (325) which is formed on the hollow shaft (319) and supplies gas to a front side of the substrate (107), avoiding the particles contaminating the front side of the substrate (107), which improves the quality of semiconductor devices.

Abstract translation: 提供了一种用于清洁衬底（107）的背面的衬底支撑设备（300）。 基板支撑装置（300）具有中空轴（319）和旋转主轴（303）。 旋转主轴（303）安装在中空轴（319）中，并且在旋转主轴（303）的外壁和中空轴（319）的内壁之间形成间隔。 旋转轴（303）的外壁形成一个阻挡壁（322）和一个凹槽（324），以防止间隔中的颗粒进入形成在空心轴（319）上的气体槽（325），并将气体 到衬底（107）的前侧，避免污染衬底（107）正面的颗粒，这改善了半导体器件的质量。

公开(公告)号：WO2017084079A1

公开(公告)日：2017-05-26

申请号：PCT/CN2015/095089

申请日：2015-11-20

Applicant: ACM RESEARCH (SHANGHAI) INC.

Inventor： WANG, Hui ,  WU, Jun ,  FANG, Zhiyou

IPC: H01L21/677 ,  H01L21/683

CPC classification number: H01L21/68707 ,  H01L21/67288 ,  H01L21/6838

Abstract: A robot arm (300, 400, 500, 600) for transporting semiconductor substrates (304, 404) comprises a body portion (301, 401, 501, 601), an end portion (302, 402, 502, 602) extending from the body portion (301, 401, 501, 601), a plurality of vacuum cups disposed on the end portion (302, 402, 502, 602), and a plurality of vacuum lines connecting to the plurality of vacuum cups respectively. The distance between any two adjacent vacuum cups satisfies the following condition: a vertical displacement of the semiconductor substrate (304, 404) produced by one of the two adjacent vacuum cups sucking down the semiconductor substrate is greater than a warpage of the semiconductor substrate (304, 404) in the range of the two adjacent vacuum cups, so that once the one of the two adjacent vacuum cups sucks the semiconductor substrate (304, 404), the other vacuum cup of the two adjacent vacuum cups is followed to suck the semiconductor substrate (304, 404).

Abstract translation: 用于传输半导体衬底（304,404）的机器人臂（300,400,500,600）包括主体部分（301,401,501,601），端部部分（302,402 ，从所述主体部分（301,401,501,601）延伸的多个真空吸盘，布置在所述末端部分（302,402,502,602）上的多个真空吸盘以及连接到所述多个吸盘 的真空杯分别。 任意两个相邻的真空杯之间的距离满足以下条件：由两个相邻的真空杯中的一个抽吸半导体衬底产生的半导体衬底（304,404）的垂直位移大于半导体衬底（304,404）的翘曲 ，404）在两个相邻的真空杯的范围内，从而一旦两个相邻的真空杯中的一个抽吸半导体衬底（304,404），就跟随两个相邻真空杯中的另一个真空杯吸附半导体 衬底（304,404）。

公开(公告)号：WO2022226684A1

公开(公告)日：2022-11-03

申请号：PCT/CN2021/089596

申请日：2021-04-25

Applicant: ACM RESEARCH (SHANGHAI) , INC. ,  ACM RESEARCH KOREA CO., LTD. ,  CLEANCHIP TECHNOLOGIES LIMITED

Inventor： WANG, Hui ,  LEE, Mark ,  WU, Jun ,  CHENG, Cheng ,  JUNG, Andrew ,  SOHN, Bruce ,  WANG, Jun ,  KIM, Yy

IPC: H01L21/677

Abstract: Embodiments of the present invention provide a substrate processing apparatus comprising a chemical liquid processing apparatus. The chemical liquid processing apparatus includes a first chemical liquid processing part, a second chemical liquid processing part configured to be stacked with the first chemical liquid processing part, a heating processing part located opposite the first chemical liquid processing part and the second chemical liquid processing part and a substrate transferring part located between the first and second chemical liquid processing parts and the heating processing part. The substrate transferring part is configured to have at least two first robots, at least one second robot and at least one third robot, all of which are arranged in parallel layers, and at least one pair of first buffer units located between two adjacent first robots and configured for loading and unloading the substrates therein and therefrom via the at least one second robot. The at least two first robots are configured to transfer the substrates between the first chemical liquid processing part and the heating processing part and the at least one third robot is configured to transfer the substrates between the second chemical liquid processing part and the heating processing part.

公开(公告)号：WO2019232741A1

公开(公告)日：2019-12-12

申请号：PCT/CN2018/090227

申请日：2018-06-07

Applicant: ACM RESEARCH (SHANGHAI) INC.

Inventor： WANG, Hui ,  FANG, Zhiyou ,  WU, Jun ,  LU, Guanzhong ,  CHEN, Fuping ,  WANG, Jian ,  WANG, Jun ,  WANG, Deyun

IPC: H01L21/00

Abstract: Methods and apparatuses for cleaning semiconductor wafers(202). Thereinto, a method comprises transferring one or more wafers(202) to at least one first tank(201) containing cleaning chemical, one or more second tanks(207) containing cleaning liquid successively for implementing batch cleaning process; taking the one or more wafers(202) out of the cleaning liquid in the one or more second tanks(207) and transferring the one or more wafers(202) to one or more single wafer cleaning modules(510) for implementing single wafer cleaning and drying processes; wherein control and keep a certain thickness of liquid film(204,504) on the one or more wafers(202) from the moment of the one or more wafers out of the cleaning chemical in the at least one first tank(201) till the one or more wafers(202) are immersed in the cleaning liquid of the one or more second tanks(207), and/or from the moment of the one or more wafers(202) out of the cleaning liquid in the one or more second tanks(207) till the one or more wafers(202) are transferred to the one or more single wafer cleaning modules(510).