Abstract:
The invention is embodied by a plasma reactor for processing a workpiece, including a reactor enclosure (105) defining a processing chamber (100), a semiconductor window (110), a base (120) within the chamber (100) for supporting the workpiece (125) during processing thereof, a gas inlet system (137) for admitting a plasma precursor gas into the chamber (100), and an inductive antenna (145) adjacent a side of the semiconductor window (110) opposite the base (120) for coupling power into the interior of the chamber (100) through the semiconductor window electrode (110).