公开(公告)号：WO2020069302A1

公开(公告)日：2020-04-02

申请号：PCT/US2019/053430

申请日：2019-09-27

Applicant: APPLIED MATERIALS, INC.

Inventor： KASHYAP, Dhritiman Subha ,  KRISHNA, Gopu ,  BALUJA, Sanjeev ,  RICE, Michael

IPC: H01L21/67

Abstract: Multi-station process chamber lids comprising a plurality of station openings are described. A station separation purge channel is around the station openings. A plurality of angular purge channels separate station openings from adjacent station openings. A lid support beam can compensate for deflection of the chamber lid body.

公开(公告)号：WO1997008734A1

公开(公告)日：1997-03-06

申请号：PCT/US1996014157

申请日：1996-08-28

Applicant: APPLIED MATERIALS, INC.

Inventor： APPLIED MATERIALS, INC. ,  COLLINS, Kenneth ,  RICE, Michael ,  TROW, John ,  BUCHBERGER, Douglas ,  ASKARIAN, Eric ,  TSUI, Joshua ,  GROECHEL, David ,  HUNG, Raymond

IPC: H01J37/32

CPC classification number: H01J37/32458 ,  A21D2/185 ,  A23G3/346 ,  A23G9/52 ,  A23G2200/06 ,  A23L2/60 ,  A23L9/12 ,  A23L19/115 ,  A23L27/30 ,  A23L27/32 ,  A23L29/231 ,  A23L29/238 ,  A23L29/256 ,  A23L29/27 ,  A23L33/21 ,  H01J37/321 ,  H01J37/32165 ,  H01J37/32467 ,  H01J37/32522 ,  H01J37/32871 ,  H01J2237/3345 ,  H01J2237/3346 ,  H01L21/6831

Abstract: The invention is embodied by a plasma reactor for processing a workpiece, including a reactor enclosure (105) defining a processing chamber (100), a semiconductor window (110), a base (120) within the chamber (100) for supporting the workpiece (125) during processing thereof, a gas inlet system (137) for admitting a plasma precursor gas into the chamber (100), and an inductive antenna (145) adjacent a side of the semiconductor window (110) opposite the base (120) for coupling power into the interior of the chamber (100) through the semiconductor window electrode (110).

Abstract translation: 本发明通过用于加工工件的等离子体反应器来实现，该反应器包括限定处理室（100）的反应器壳体（105），半导体窗口（110），腔室（100）内的基座（120） （125），用于将等离子体前体气体引入所述室（100）中的气体入口系统（137）以及与所述半导体窗口（110）的与所述基座（120）相对的一侧附近的感应天线（145） 用于通过半导体窗口电极（110）将动力耦合到腔室（100）的内部。

公开(公告)号：WO2020092047A1

公开(公告)日：2020-05-07

申请号：PCT/US2019/057326

申请日：2019-10-22

Applicant: APPLIED MATERIALS, INC.

Inventor： AUBUCHON, Joseph ,  BALUJA, Sanjeev ,  RICE, Michael ,  DAN, Arkaprava ,  CHEN, Hanhong

IPC: H01L21/02 ,  H01L21/324 ,  C23C16/455 ,  H01L21/67 ,  H01J37/32 ,  H05H1/46

Abstract: Apparatus and methods to process one or more wafers are described. A first processing station has a first gas flow pattern from one or more of a first gas diffuser, a first cooling channel pattern, or a first heater. A second processing station has a second gas flow pattern from one or more of a second gas diffuser, a second cooling channel pattern, or a second heater. The second gas diffuser, the second cooling channel pattern, or the second heater is rotated or translated relative to the first gas diffuser, the first cooling channel pattern, or the first heater to provide the second gas flow pattern complementary to the first gas flow pattern.

公开(公告)号：WO2019210127A1

公开(公告)日：2019-10-31

申请号：PCT/US2019/029282

申请日：2019-04-26

Applicant: APPLIED MATERIALS, INC.

Inventor： RICE, Michael ,  AUBUCHON, Joseph ,  BALUJA, Sanjeev ,  OKADA, Ashley M. ,  FERNANDEZ, Alexander ,  XU, Ming ,  JOSEPHSON, Marcel E. ,  KOSHTI, Sushant Suresh ,  LE, Kenneth ,  BRASHEAR, Kevin

IPC: H01L21/67 ,  H01L21/02

Abstract: Gas distribution apparatus to provide uniform flows of gases from a single source to multiple processing chambers are described. A regulator is positioned at an upstream end of a shared volume having a plurality of downstream ends. A flow controller is positioned at each downstream end of the shared volume, the flow controller comprising an orifice and a fast pulsing valve. Methods of using the gas distribution apparatus and calibrating the flow controllers are also described.

公开(公告)号：WO2003007349A2

公开(公告)日：2003-01-23

申请号：PCT/US2002/022127

申请日：2002-07-12

Applicant: APPLIED MATERIALS, INC.

Inventor： PENCIS, Chris, Holt ,  HUDGENS, Jeffrey, C. ,  COX, Damon, Keith ,  RICE, Michael ,  CIULIK, James, R. ,  FREEMAN, Marvin, L. ,  VAN GOGH, David, A.

IPC: H01L21/00

CPC classification number: H01L21/67748 ,  B25J9/0009 ,  B25J9/107 ,  B25J9/1628 ,  G05B19/404 ,  G05B2219/39192 ,  G05B2219/45031 ,  G05B2219/49169 ,  G05B2219/49207 ,  H01L21/67103 ,  H01L21/67259 ,  H01L21/67742 ,  H01L21/68

Abstract: Generally, a robot for transferring a substrate in a processing system and a method of determining a position of the robot is provided. In one embodiment, a method of determining a position of a robot comprises acquiring a first set of positional metrics, acquiring a second set of positional metrics and resolving the position of the robot due to thermal expansion using the first set and the second set of positional metrics. Acquiring the first and second set of positional metrics may occur at the same location within a processing system, or may occur at different locations. For example, in another embodiment, the method may comprise acquiring a first set of positional metrics at a first location proximate a processing chamber and acquiring a second set of positional metrics in another location. In another embodiment, substrate center information is corrected using the determined position of the robot. The robot maybe comprised of linkages fabricated from materials selected to minimize the effects of thermal changes.

Abstract translation: 通常，提供了一种用于在处理系统中传送基板的机器人和确定机器人的位置的方法。 在一个实施例中，一种确定机器人位置的方法包括获取第一组位置度量，获取第二组位置度量并且利用第一组和第二组位置来解决由于热膨胀引起的机器人的位置 指标。 获取第一和第二组位置度量可以发生在处理系统内的相同位置处，或者可以在不同位置处发生。 例如，在另一个实施例中，该方法可以包括在靠近处理室的第一位置获取第一组位置度量，并在另一个位置获取第二组位置度量。 在另一个实施例中，使用所确定的机器人的位置校正基板中心信息。 机器人可以由由选择的材料制成的连接件以使热变化的影响最小化。

公开(公告)号：WO2021055762A1

公开(公告)日：2021-03-25

申请号：PCT/US2020/051510

申请日：2020-09-18

Applicant: APPLIED MATERIALS, INC.

Inventor： AUBUCHON, Joseph ,  BALUJA, Sanjeev ,  RICE, Michael ,  DAN, Arkaprava ,  CHEN, Hanhong

IPC: C23C16/455 ,  C23C16/458

Abstract: Apparatus and methods to process one or more substrates are described. A plurality of process stations are arranged in a circular configuration around a rotational axis. A support assembly with a rotatable center base defining a rotational axis, at least two support arms extending from the center base and heaters on each of the support arms is positioned adjacent the processing stations so that the heaters can be moved amongst the various process stations to perform one or more process condition. The support assembly configured to offset the position of the substrate with respect to the processing stations.

公开(公告)号：WO2020092184A1

公开(公告)日：2020-05-07

申请号：PCT/US2019/058248

申请日：2019-10-28

Applicant: APPLIED MATERIALS, INC.

Inventor： AUBUCHON, Joseph ,  BALUJA, Sanjeev ,  RICE, Michael ,  DAN, Arkaprava ,  CHEN, Hanhong

IPC: C23C16/455 ,  C23C16/458 ,  C23C16/54 ,  H01L21/02 ,  H01L21/687 ,  H01L21/67

Abstract: Apparatus and methods to process one or more wafers are described. A spatial deposition tool comprises a plurality of substrate support surfaces on a substrate support assembly and a plurality of spatially separated and isolated processing stations. The spatially separated isolated processing stations have independently controlled temperature, processing gas types, and gas flows. In some embodiments, the processing gases on one or multiple processing stations are activated using plasma sources. The operation of the spatial tool comprises rotating the substrate assembly in a first direction, and rotating the substrate assembly in a second direction, and repeating the rotations in the first direction and the second direction until a predetermined thickness is deposited on the substrate surface(s).

公开(公告)号：WO2004082014A1

公开(公告)日：2004-09-23

申请号：PCT/US2004/007202

申请日：2004-03-09

Applicant: APPLIED MATERIALS, INC. ,  SADIGHI, Iraj ,  HUDGENS, Jeff ,  RICE, Michael ,  WYKA, Gary

Inventor： SADIGHI, Iraj ,  HUDGENS, Jeff ,  RICE, Michael ,  WYKA, Gary

IPC: H01L21/68

CPC classification number: H01L21/67259 ,  B25J9/1692 ,  B25J9/1697 ,  G05B2219/45031 ,  H01L21/681

Abstract: A vision system and method for calibrating motion of a robot disposed in a processing system is provided. In one embodiment, a vision system for a processing system includes a camera and a calibration wafer that are positioned in a processing system. The camera is positioned on the robot and is adapted to obtain image data of the calibration wafer disposed in a predefined location within the processing system. The image data is utilized to calibrate the robots motion.

Abstract translation: 提供了一种用于校准设置在处理系统中的机器人的运动的视觉系统和方法。 在一个实施例中，用于处理系统的视觉系统包括位于处理系统中的照相机和校准晶片。 相机位于机器人上，并且适于获得设置在处理系统内的预定位置的校准晶片的图像数据。 图像数据用于校准机器人运动。

公开(公告)号：WO2003007095A1

公开(公告)日：2003-01-23

申请号：PCT/US2002/020647

申请日：2002-07-01

Applicant: APPLIED MATERIALS, INC.

Inventor： FREEMAN, Marvin, L. ,  HUDGENS, Jeff ,  COX, Damon, Keith ,  PENCIS, Chris, Holt ,  RICE, Michael ,  VAN GOGH, David, A.

IPC: G05B19/404

CPC classification number: H01L21/67259 ,  B25J9/0009 ,  B25J9/107 ,  G05B19/404 ,  G05B2219/37608 ,  G05B2219/39192 ,  G05B2219/49169 ,  G05B2219/49207 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/68 ,  Y10S414/136 ,  Y10S414/137 ,  Y10S414/139

Abstract: Generally, a method of determining a position of a robot is provided. In one embodiment, a method of determining a position of a robot comprises acquiring a first set of positional metrics, acquiring a second set of positional metrics and resolving the position of the robot due to thermal expansion using the first set and the second set of positional metrics. Acquiring the first and second set of positional metrics may occur at the same location within a processing system, or may occur at different locations. For example, in another embodiment, the method may comprise acquiring a first set of positional metrics at a first location proximate a processing chamber and acquiring a second set of positional metrics in another location. In another embodiment, substrate center information is corrected using the determined position of the robot.

Abstract translation: 通常，提供了一种确定机器人的位置的方法。 在一个实施例中，一种确定机器人位置的方法包括获取第一组位置度量，获取第二组位置度量并且利用第一组和第二组位置来解决由于热膨胀引起的机器人的位置 指标。 获取第一和第二组位置度量可以发生在处理系统内的相同位置处，或者可以在不同位置处发生。 例如，在另一个实施例中，该方法可以包括在靠近处理室的第一位置获取第一组位置度量，并在另一个位置获取第二组位置度量。 在另一个实施例中，使用所确定的机器人的位置校正基板中心信息。

公开(公告)号：WO2006069341A2

公开(公告)日：2006-06-29

申请号：PCT/US2005/046877

申请日：2005-12-21

Applicant: APPLIED MATERIALS, INC. ,  ISHIKAWA, Tetsuya ,  ROBERTS, Rick, J. ,  ARMER, Helen, R. ,  VOLFOVSKI, Leon ,  PINSON, Jay, D. ,  RICE, Michael ,  QUACH, David, H. ,  SALEK, Mohsen, S. ,  LOWRANCE, Robert ,  BACKER, John, A. ,  WEAVER, William, Tyler ,  CARLSON, Charles ,  WANG, Chongyang ,  HUDGENS, Jeffrey ,  HERCHEN, Harald ,  LUE, Brian

Inventor： ISHIKAWA, Tetsuya ,  ROBERTS, Rick, J. ,  ARMER, Helen, R. ,  VOLFOVSKI, Leon ,  PINSON, Jay, D. ,  RICE, Michael ,  QUACH, David, H. ,  SALEK, Mohsen, S. ,  LOWRANCE, Robert ,  BACKER, John, A. ,  WEAVER, William, Tyler ,  CARLSON, Charles ,  WANG, Chongyang ,  HUDGENS, Jeffrey ,  HERCHEN, Harald ,  LUE, Brian

IPC: H01L21/00

CPC classification number: H01L21/67167 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/67742 ,  H01L21/67754 ,  H01L21/67766 ,  H01L21/67781

Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased throughput, increased reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also has a smaller system footprint. In one embodiment of the cluster tool, the cost of ownership is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

Abstract translation: 实施方式通常提供了一种用于使用多室处理系统（例如，群集工具）来处理衬底的设备和方法，所述多室处理系统具有增加的生产量，增加的可靠性，在群集工具中处理的衬底具有更多 可重复的晶圆历史，并且还具有较小的系统尺寸。 在群集工具的一个实施例中，通过将衬底分组在一起并且以两个或更多个成组的方式传送和处理衬底来降低所有权成本，以提高系统吞吐量，并且减少机器人为了传送批次而必须做出的移动次数 的处理室之间的基板，从而减少了机器人的磨损并提高了系统的可靠性。 实施例还提供了用于增加衬底传输过程的可靠性以减少系统停机时间的方法和设备。