SUBSTRATE PROCESSING CHAMBER HAVING IMPROVED PROCESS VOLUME SEALING

    公开(公告)号:WO2019060259A1

    公开(公告)日:2019-03-28

    申请号:PCT/US2018/051415

    申请日:2018-09-18

    摘要: Embodiments of process chambers are provided herein. In some embodiments, a process chamber includes: a chamber wall defining an inner volume within the process chamber; a substrate support disposed in the inner volume having a support surface to support a substrate, wherein the inner volume includes a processing volume disposed above the support surface and a non-processing volume disposed at least partially below the support surface; a gas supply plenum fluidly coupled to the processing volume via a gas supply channel disposed above the support surface; a pumping plenum fluidly coupled to the processing volume via an exhaust channel disposed above the support surface; and a sealing apparatus configured to fluidly isolate the processing volume from the non-processing volume when the substrate support is in a processing position, wherein the processing volume and the non-processing volume are fluidly coupled when the substrate support is in a non-processing position.

    THIN END EFFECTOR WITH ABILITY TO HOLD WAFER DURING MOTION
    3.
    发明申请
    THIN END EFFECTOR WITH ABILITY TO HOLD WAFER DURING MOTION 审中-公开
    具有在运动期间保持水平的最终效果

    公开(公告)号:WO2015195230A1

    公开(公告)日:2015-12-23

    申请号:PCT/US2015/030620

    申请日:2015-05-13

    IPC分类号: H01L21/677

    摘要: Embodiments of the invention include methods and apparatuses for removing a carrier ring assembly from a carrier that includes tightly pitched slots. Embodiments include a robot arm that comprises an end effector wrist, an end effector that has a maximum thickness less than approximately 3.0 mm and a gripping device for securing a carrier ring assembly to the end effector. According to an embodiment, the gripping device may be a clamping member. One or more actuators may be used to displace the clamping member in a direction relative to the end effector. In an additional embodiment, the gripping device may be an electromagnetic device that includes a plurality of electromagnets that are inserted into a top surface of the end effector. Embodiments further include a vacuum gripping device that includes openings in a top surface of the end effector that are coupled to a vacuum controller by air-lines.

    摘要翻译: 本发明的实施例包括用于从包括紧密倾斜槽的载体移除载体环组件的方法和装置。 实施例包括机器人臂,其包括端部执行器腕部,具有小于约3.0mm的最大厚度的端部执行器和用于将承载环组件固定到端部执行器的夹持装置。 根据实施例,夹持装置可以是夹紧构件。 一个或多个致动器可以用于沿相对于末端执行器的方向移动夹紧构件。 在另外的实施例中,夹持装置可以是包括插入端部执行器的顶表面中的多个电磁体的电磁装置。 实施例还包括真空夹紧装置,其包括端部执行器的顶表面中的通过空气线联接到真空控制器的开口。

    ON-END EFFECTOR MAGNETIC WAFER CARRIER ALIGNMENT
    4.
    发明申请
    ON-END EFFECTOR MAGNETIC WAFER CARRIER ALIGNMENT 审中-公开
    端接效应器磁性载波对准

    公开(公告)号:WO2015175714A1

    公开(公告)日:2015-11-19

    申请号:PCT/US2015/030654

    申请日:2015-05-13

    IPC分类号: H01L21/677

    摘要: Embodiments include methods and apparatuses for transferring and aligning a carrier ring. In an embodiment, a method includes lifting the carrier ring from a first location with a robot arm that includes an end effector wrist and an end effector. Front dowel pins and rear dowel pins are coupled to the end effector. In an embodiment, the end effector wrist includes a plunger that has a gripping device. Embodiments include securing the plunger to the carrier ring with the gripping device and extending the plunger out from the end effector wrist until the carrier ring contacts the front dowel pins. Thereafter, the carrier ring is transferred from the first location to the second location. The plunger and the carrier ring are then retracted until the rear dowel pins engage an alignment notch and an alignment flat on the carrier ring.

    摘要翻译: 实施例包括用于传送和对准载体环的方法和装置。 在一个实施例中,一种方法包括用包括末端执行器腕部和末端执行器的机器人手臂从第一位置提升载体环。 前销销和后销销连接到末端执行器。 在一个实施例中,末端执行器腕部包括具有夹持装置的柱塞。 实施例包括用夹持装置将柱塞固定到承载环上,并将柱塞从端部执行器手腕伸出,直到承载环接触前销钉。 此后,载波环从第一位置传送到第二位置。 柱塞和承载环然后缩回,直到后销定位销与载体环上的对准槽口和对准平面接合。

    METHOD AND APPARATUS FOR PROCESSING A SUBSTRATE

    公开(公告)号:WO2018129049A1

    公开(公告)日:2018-07-12

    申请号:PCT/US2018/012191

    申请日:2018-01-03

    摘要: Embodiments of a method and apparatus for annealing a substrate are disclosed herein. In some embodiments, a substrate support includes a substrate support pedestal having an upper surface to support a substrate and an opposing bottom surface, wherein the substrate support pedestal is formed of a material that is transparent to radiation; a lamp assembly disposed below the substrate support pedestal and having a plurality of lamps configured to heat the substrate; a pedestal support extending through the lamp assembly to support the substrate support pedestal in a spaced apart relation to the plurality of lamps; a shaft coupled to a second end of the pedestal support opposite the first end; and a rotation assembly coupled to the shaft opposite the pedestal support to rotate the shaft, the pedestal support, and the substrate support pedestal with respect to the lamp assembly.

    PRESENCE SENSING AND POSITION CORRECTION FOR WAFER ON A CARRIER RING
    6.
    发明申请
    PRESENCE SENSING AND POSITION CORRECTION FOR WAFER ON A CARRIER RING 审中-公开
    在载波环上存在感测和位置校正

    公开(公告)号:WO2015179194A1

    公开(公告)日:2015-11-26

    申请号:PCT/US2015/030656

    申请日:2015-05-13

    IPC分类号: H01L21/68

    摘要: Embodiments of the invention include apparatuses and systems for determining the position of a carrier ring assembly supported by an end effector. In an embodiment, the position of the carrier ring assembly is determined by passing the carrier ring assembly through a plurality of through beam sensors. As the carrier ring passes through the sensors, a plurality of sensor transitions along points on the carrier ring assembly are detected. Each sensor transition indicates that one of the through beam sensors changed from an unblocked state to a blocked state, or changed from an blocked state to an unblocked state. The position of the end effector is recorded at each sensor transition and is associated with the sensor transition that caused the end effector position to be recorded. A position of the carrier ring assembly is then calculated from the plurality of sensor transitions and their associated end effector positions.

    摘要翻译: 本发明的实施例包括用于确定由端部执行器支撑的载体环组件的位置的装置和系统。 在一个实施例中,通过使承载环组件穿过多个通过梁传感器来确定承载环组件的位置。 当载体环通过传感器时,检测到沿着载体环组件上的点的多个传感器转变。 每个传感器转换指示一个通过光束传感器从未阻塞状态改变到阻塞状态,或从阻塞状态改变为未阻塞状态。 在每个传感器转换处记录末端执行器的位置,并且与导致末端执行器位置被记录的传感器转换相关联。 然后从多个传感器转变及其相关的末端执行器位置计算载体环组件的位置。

    DESIGN TO MANAGE STATIC CHARGE AND DISCHARGE OF WAFERS AND WAFER CARRIER RINGS
    7.
    发明申请
    DESIGN TO MANAGE STATIC CHARGE AND DISCHARGE OF WAFERS AND WAFER CARRIER RINGS 审中-公开
    设计用于管理静态电荷和放电的波浪和波浪载体环

    公开(公告)号:WO2015175661A1

    公开(公告)日:2015-11-19

    申请号:PCT/US2015/030566

    申请日:2015-05-13

    IPC分类号: H01L21/677

    摘要: Embodiments of the invention include methods and apparatuses for removing charge from a carrier ring assembly. Embodiments include picking up a carrier ring assembly from a first location with an end effector. The charge is removed from the carrier ring assembly by one or more charge regulating surfaces formed on an end effector. According to an embodiment the charge regulating surfaces may be pads formed above top surfaces of an end effector blade. Embodiments include charge regulating surfaces that cover the entire surface of the end effector blade. Embodiments include removing charge from a carrier ring of an end effector assembly, and from a substrate supported on a conductive adhesive backing tape surrounded by the carrier ring. In an embodiment, the carrier ring assembly is then transferred to a second location with the end effector.

    摘要翻译: 本发明的实施例包括从载体环组件去除电荷的方法和装置。 实施例包括从具有末端执行器的第一位置拾起承载环组件。 电荷通过形成在端部执行器上的一个或多个电荷调节表面从载体环组件移除。 根据实施例,电荷调节表面可以是形成在末端执行器叶片的顶表面上方的垫片。 实施例包括覆盖末端执行器叶片的整个表面的电荷调节表面。 实施例包括从末端执行器组件的载体环和从由载体环包围的导电粘合剂背衬带上支撑的基底去除电荷。 在一个实施例中,然后将载体环组件转移到具有末端执行器的第二位置。