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    MEMS TRANSDUCER PACKAGE
    1.
    发明申请
    MEMS TRANSDUCER PACKAGE 审中-公开
    MEMS传感器封装

    公开(公告)号：WO2016102924A1

    公开(公告)日：2016-06-30

    申请号：PCT/GB2015/053728

    申请日：2015-12-04

    Applicant: CIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LIMITED

    Inventor： HOEKSTRA, Tsjerk

    IPC: H04R19/00 ,  H04R31/00 ,  H04R1/28 ,  H04R1/34 ,  H04R19/04

    CPC classification number: H04R19/005 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/10155 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/16195 ,  H04R1/342 ,  H04R19/04 ,  H04R31/00

    Abstract: A MEMS transducer package (1) is provide having a semiconductor die portion (3) with a thickness bounded by a first surface (9) and an opposite second surface (11). The package further has a transducer element (13) incorporated in the second surface (11) and a die back volume (7) that extends through the thickness of the semiconductor die portion (3) between the first surface (9) and the transducer element (13). The package is completed by a cap portion (23) that abuts the semiconductor die portion (3) at the first surface (9).

    Abstract translation: 提供一种具有由第一表面（9）和相对的第二表面（11）限定的厚度的半导体管芯部分（3）的MEMS换能器封装（1）。 该封装还包括结合在第二表面（11）中的换能器元件（13）和延伸穿过第一表面（9）和换能器元件（3）之间的半导体管芯部分（3）的厚度的模具后部体积（7） （13）。 封装由在第一表面（9）处邻接半导体管芯部分（3）的帽部分（23）完成。

    STRESS DECOUPLING IN MEMS TRANSDUCERS
    2.
    发明申请
    STRESS DECOUPLING IN MEMS TRANSDUCERS 审中-公开
    MEMS传感器中的应力解耦

    公开(公告)号：WO2017129973A1

    公开(公告)日：2017-08-03

    申请号：PCT/GB2017/050185

    申请日：2017-01-25

    Applicant: CIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LIMITED

    Inventor： PATTEN, David Talmage ,  HOEKSTRA, Tsjerk

    IPC: B81B7/00

    CPC classification number: H04R19/04 ,  B81B3/0021 ,  B81B7/0048 ,  B81B2201/0257 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2207/09 ,  H04R19/005 ,  H04R2201/003

    Abstract: A MEMS transducer (200) comprises a substrate (101) having a first surface (102) and a membrane (103) formed relative to an aperture in the substrate. The MEMS transducer (200) further comprises one or more bonding structures (107) coupled to the substrate, wherein the one or more bonding structures (107), during use, mechanically couple the MEMS transducer to an associated substrate (111). The MEMS transducer (200) comprises a sealing element (109) for providing a seal, during use, in relation to the substrate (101) and the associated substrate (111). A stress decoupling member (119) is coupled between the substrate (101) and the sealing element (109).

    Abstract translation: MEMS换能器（200）包括具有相对于基板中的孔形成的第一表面（102）和膜（103）的基板（101）。 所述MEMS换能器（200）还包括耦合到所述衬底的一个或多个键合结构（107），其中所述一个或多个键合结构（107）在使用期间将所述MEMS换能器机械地耦合到相关联的衬底（111）。 MEMS换能器（200）包括用于在使用期间相对于衬底（101）和相关联的衬底（111）提供密封的密封元件（109）。 应力解耦元件（119）连接在衬底（101）和密封元件（109）之间。

    Packaging for MEMS transducers
    3.
    发明申请
    Packaging for MEMS transducers 审中-公开
    MEMS传感器的封装

    公开(公告)号：WO2015189598A1

    公开(公告)日：2015-12-17

    申请号：PCT/GB2015/051687

    申请日：2015-06-09

    Applicant: CIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LIMITED

    Inventor： HOEKSTRA, Tsjerk

    IPC: B81B7/00

    CPC classification number: H04R19/04 ,  B81B7/0029 ,  B81B7/0038 ,  B81B7/0051 ,  B81B7/0064 ,  B81B7/0077 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/015 ,  B81C2203/0714 ,  B81C2203/0742 ,  B81C2203/0778 ,  H01L2224/48091 ,  H04R1/04 ,  H04R19/005 ,  H04R31/003 ,  H04R2201/003 ,  H04R2499/11 ,  H01L2924/00014

    Abstract: This application describes methods and apparatus relating to packaging of MEMS transducers and to MEMS transducer packages. The application describes a MEMS transducer package (300) having a first integrated circuit die (200) which has an integrated MEMS transducer (202) and integrated electronic circuitry (203) for operation of the MEMS transducer. The package is arranged such that the footprint of the MEMS transducer package is substantially the same size as the footprint of the integrated circuit die. At least part of the first integrated circuit die (200) may form a sidewall of the package. The package may be formed by a first package cover (302) which overlies the MEMS transducer and a second package cover (301) on the other side of the first integrated circuit die.

    Abstract translation: 该应用描述了与MEMS换能器和MEMS换能器封装的封装相关的方法和装置。 该应用描述了具有第一集成电路管芯（200）的MEMS传感器封装（300），该第一集成电路管芯具有用于MEMS传感器的操作的集成MEMS换能器（202）和集成电子电路（203）。 该封装被布置成使得MEMS换能器封装的占地面积与集成电路管芯的占地面积大致相同。 第一集成电路管芯（200）的至少一部分可以形成封装的侧壁。 封装可以由覆盖在MEMS换能器上的第一封装盖（302）和在第一集成电路管芯的另一侧上的第二封装盖（301）形成。

    MEMS TRANSDUCER PACKAGE
    5.
    发明申请
    MEMS TRANSDUCER PACKAGE 审中-公开
    MEMS传感器封装

    公开(公告)号：WO2016102925A1

    公开(公告)日：2016-06-30

    申请号：PCT/GB2015/053729

    申请日：2015-12-04

    Applicant: CIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LIMITED

    Inventor： PENNOCK, John Laurence ,  HOEKSTRA, Tsjerk ,  PATTEN, David Talmage

    IPC: H04R19/00 ,  H04R31/00 ,  H04R19/04 ,  H04R1/28 ,  H04R1/34

    CPC classification number: H04R1/04 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2207/015 ,  B81C1/00309 ,  H04R1/2853 ,  H04R1/342 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R31/003 ,  H04R2201/003 ,  H04R2410/07

    Abstract: A MEMS transducer package (1) comprises a semiconductor die element (3) and a cap element (23). The semiconductor die element (3) and cap element (23) have mating surfaces (9, 21). The semiconductor die element (3) and cap element (23) are configured such that when the semiconductor die element (3) and cap element (4) are conjoined, a first volume (7, 27) is formed through the semiconductor die element (3) and into the semiconductor cap element (23), and an acoustic channel is formed to provide an opening between a non-mating surface (11) of the semiconductor die element (3) and a side surface (10, 12) of the transducer package.

    Abstract translation: MEMS换能器封装（1）包括半导体管芯元件（3）和帽元件（23）。 半导体管芯元件（3）和盖元件（23）具有配合表面（9,21）。 半导体管芯元件（3）和盖元件（23）构造成使得当半导体管芯元件（3）和盖元件（4）结合时，通过半导体管芯元件形成第一体积（7,27） 3）并且进入半导体盖元件（23）中，并且形成声通道以在半导体管芯元件（3）的非配合表面（11）与所述半导体管芯元件（3）的侧表面（10,12）之间提供开口 传感器包装。

    MEMS TRANSDUCER PACKAGE
    7.
    发明申请
    MEMS TRANSDUCER PACKAGE 审中-公开
    MEMS传感器封装

    公开(公告)号：WO2016102922A1

    公开(公告)日：2016-06-30

    申请号：PCT/GB2015/053726

    申请日：2015-12-04

    Applicant: CIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LIMITED

    Inventor： HOEKSTRA, Tsjerk ,  PATTEN, David Talmage

    IPC: H04R19/00 ,  H04R31/00 ,  H04R1/38 ,  H04R19/04

    CPC classification number: H04R19/005 ,  H04R1/38 ,  H04R19/04 ,  H04R31/00 ,  H04R2410/07

    Abstract: A method of fabricating a micro-electrical-mechanical system (MEMS) transducer chip scale package. The method comprising: providing (101) a front side pre-fabricated semiconductor die wafer (1) comprising a plurality of individual die that each comprise at least a MEMS transducer. And back etching (104) the semiconductor die wafer (1) at the back side (4) of the semiconductor die wafer (1) by etching an acoustic die channel (5) through each respective die of the plurality of die and etching a die back volume (6) into each respective die of the plurality of die. The semiconductor die wafer (1) is capped with a cap wafer (16) such that a wafer level packaged MEMS transducer wafer is provided containing multiple MEMS transducer chip scale packages.

    Abstract translation: 一种制造微机电系统（MEMS）传感器芯片级封装的方法。 该方法包括：提供（101）包括多个单个管芯的前侧预制半导体管芯晶片（1），每个管芯至少包括MEMS换能器。 并且通过经由多个管芯的每个相应管芯蚀刻声管芯通道（5）并在半导体晶片（1）的背面（4）处背面蚀刻（104）半导体晶片（1） 后部体积（6）进入多个模具的每个相应的模具。 半导体晶片（1）被盖帽盖（18），使得提供包含多个MEMS换能器芯片级封装的晶片级封装的MEMS换能器晶片。

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