摘要:
A silver paste having no or only poor fire-through capability comprises silver particles, at least one lead-free glass frit containing 0.5 to 15 wt.% SiO 2 , 0.3 to 10 wt.% Al 2 0 3 and 67 to 75 wt.% Bi 2 O 3 (the weight percentages being based on the total weight of the glass frit) and an organic vehicle, wherein the content of the silver particles in the paste is 60 to 92 wt.% based on total paste composition and wherein the paste is free from zinc oxide and compounds capable of generating zinc oxide on firing. The silver paste is used in the manufacture of metallisations (electrodes, parts of electrodes or other metal contacts) of solar cells.
摘要翻译:没有或只有不良的穿透能力的银膏包括银颗粒,至少一种含0.5至15重量%SiO 2,0.3至10重量%Al 2 O 3和67至75重量%Bi 2 O 3的无铅玻璃料 重量百分数是基于玻璃料的总重量)和有机载体,其中糊料中银粒子的含量基于总糊剂组合物为60至92重量%,并且其中糊料不含氧化锌和 能够在烧制时产生氧化锌的化合物。 银膏用于太阳能电池的金属化(电极,电极部分或其他金属接触)的制造。
摘要:
Embodiments of the invention relate to a silicon semiconductor device, and a conductive silver paste for use in the front side of a solar cell device.
摘要:
A process for the formation of at least one aluminum p-doped surface region of a semiconductor substrate comprising the steps: (1) providing a semiconductor substrate, (2) applying and drying an aluminum paste on at least one surface area of the semiconductor substrate, (3) firing the dried aluminum paste, and (4) removing the fired aluminum paste with water, wherein the aluminum paste employed in step (2) includes particulate aluminum, an organic vehicle and 3 to 20 wt.% of glass frit, based on total aluminum paste composition.
摘要:
The present invention is directed to an electroconductive thick film paste composition comprising Ag and a lead-tellurium-lithium-titanium-oxide both dispersed in an organic medium. The present invention is further directed to an electrode formed from the paste composition and a semiconductor device and, in particular, a solar cell comprising such an electrode.
摘要:
The present invention is directed to an electroconductive thick film paste composition comprising Ag and a Pb-free Bi-based glass frit both dispersed in an organic medium, wherein the paste is fireable at temperatures below 420°C. The paste is especially useful for forming electrodes on substrates such as glass or films, particularly electrochromic glass or films, that would be damaged by higher firing temperatures. The present invention is further directed to a device comprising an electrode formed from the paste composition and, in particular, to an electrochromic device comprising such an electrode.
摘要:
A process for the formation of at least one aluminum p-doped surface region of an n-type semiconductor substrate comprising the steps: (1) providing an n-type semiconductor substrate, (2) applying and drying an aluminum paste on at least one surface area of the n-type semiconductor substrate, (3) firing the dried aluminum paste, and (4) removing the fired aluminum paste with water, wherein the aluminum paste employed in step (2) includes particulate aluminum, an organic vehicle and 3 to 20 wt.% of glass frit, based on total aluminum paste composition.
摘要:
The present invention is directed to an electroconductive thick film paste composition comprising electrically conductive Ag, a second electrically conductive metal selected from the group consisting of Ni, Al and mixtures thereof and a lead-tellurium-lithium-titanium-oxide all dispersed in an organic medium. The present invention is further directed to an electrode formed from the thick film paste composition and a semiconductor device and, in particular, a solar cell comprising such an electrode.
摘要:
The present invention is directed to an electroconductive thick film paste composition comprising Ag and a Pb-free bismuth-tellurium oxide both dispersed in an organic medium, wherein the paste is fireable at temperatures below 420°C. The paste is especially useful for forming electrodes on substrates such as glass or films, particularly electrochromic glass or films, that would be damaged by higher firing temperatures. The present invention is further directed to a device comprising an electrode formed from the paste composition and, in particular, to an electrochromic device comprising such an electrode.
摘要:
A lead-tellurium-lithium-titanium-oxide glass composition is useful as a component of a conductive silver paste. Especially useful are P-containing and V-containing lead-tellurium-lithium-titanium-oxide glass composition. Conductive silver via paste comprising particulate conductive silver and any of the lead-tellurium-lithium-titanium-oxide glass compositions of the invention can be used in providing the metallization of the holes in the silicon wafers of MWT solar cells. The result is a metallic electrically conductive via between the collector lines on the front side and the emitter electrode on the back-side of the solar cell. The paste can also be used to form the collector lines on the front-side of the solar cell and the emitter electrode on the back-side of the solar cell.
摘要:
An aluminium paste having no or only poor fire-through capability comprises aluminium particles, at least one glass frit containing 0.5 to 15 wt.% SiO 2 , 0.3 to 10 wt.% Al203 and 67 to 75 wt.% Bi 2 O 3 (the weight percentages being based on the total weight of the glass frit) and an organic vehicle. The aluminium paste is used in the manufacture of aluminium back electrodes of PERC (passivated emitter and rear contact) silicon solar cells, wherein the paste is applied on a perforated dielectric passivation layer on the back-side of a silicon wafer and subsequently dried and fired or, alternatively, wherein the paste is applied on a non-perforated passivation layer on the back-side of a silicon wafer, dried and fired and the aluminium layer and the passivation layer are subsequently laser fired to produce perforations in the passivation layer and to form local BSF (back surface field) contacts.
摘要翻译:没有或仅仅具有差的穿透能力的铝浆包括铝颗粒,至少一种含有0.5至15重量%SiO 2,0.3至10重量%Al 2 O 3和67至75重量%Bi 2 O 3的玻璃料(重量百分数为 基于玻璃料的总重量)和有机载体。 铝浆用于制造PERC(钝化发射器和后接触)硅太阳能电池的铝背电极,其中将糊剂施加在硅晶片背面上的穿孔电介质钝化层上,随后干燥和烧制 或者替代地,其中将糊剂施加在硅晶片的背侧上的非穿孔钝化层上,干燥和烧制,随后激光烧制铝层和钝化层以在钝化层中产生穿孔,并且 形成本地BSF(背面场)接触。