公开(公告)号：WO2017099880A1

公开(公告)日：2017-06-15

申请号：PCT/US2016/055765

申请日：2016-10-06

申请人： INTEL CORPORATION

发明人： FITZGERALD, Thomas ,  LAMBERT, William ,  KOTHARI, Shrenik ,  SULLHAN, Punita ,  ANTONISWAMY, Aravindha

IPC分类号： H01L23/522 ,  H01L23/34 ,  H01L23/367 ,  H01L23/373

CPC分类号： H01L23/345 ,  G06F1/20 ,  H01L23/04 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5227 ,  H01L24/13 ,  H01L24/16 ,  H01L24/18 ,  H01L24/29 ,  H01L24/32 ,  H01L25/0652 ,  H01L25/0657 ,  H01L28/10 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/381 ,  H01L2924/014 ,  H01L2924/00014

摘要： Embedded air core inductors are described for integrated circuit package substrates. The substrates have a thermal conductor for the inductors. One example includes a package substrate to carry an integrated circuit die, the package substrate having a plurality of top side pads to connect to the die on a top side and a plurality of bottom side pads to connect to an external component on a bottom side. An inductor is embedded within the package substrate, a thermal conductor is embedded within the package substrate adjacent to the inductor to conduct heat away from the inductor, and a heat sink is thermally coupled to the thermal conductor to receive the heat from the conductor.

摘要翻译： 针对集成电路封装衬底描述了嵌入式空芯电感器。 衬底具有用于电感器的热导体。 一个示例包括承载集成电路管芯的封装衬底，该封装衬底具有多个顶侧焊盘以连接至顶侧上的管芯，多个底侧焊盘连接至底侧上的外部组件。 电感器嵌入在封装衬底内，热导体嵌入在封装衬底内与电感器相邻以将热量从电感器导出，并且散热器热耦合到热导体以接收来自导体的热量。 / p>