公开(公告)号：WO2017099880A1

公开(公告)日：2017-06-15

申请号：PCT/US2016/055765

申请日：2016-10-06

申请人： INTEL CORPORATION

发明人： FITZGERALD, Thomas ,  LAMBERT, William ,  KOTHARI, Shrenik ,  SULLHAN, Punita ,  ANTONISWAMY, Aravindha

IPC分类号： H01L23/522 ,  H01L23/34 ,  H01L23/367 ,  H01L23/373

CPC分类号： H01L23/345 ,  G06F1/20 ,  H01L23/04 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5227 ,  H01L24/13 ,  H01L24/16 ,  H01L24/18 ,  H01L24/29 ,  H01L24/32 ,  H01L25/0652 ,  H01L25/0657 ,  H01L28/10 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/381 ,  H01L2924/014 ,  H01L2924/00014

摘要： Embedded air core inductors are described for integrated circuit package substrates. The substrates have a thermal conductor for the inductors. One example includes a package substrate to carry an integrated circuit die, the package substrate having a plurality of top side pads to connect to the die on a top side and a plurality of bottom side pads to connect to an external component on a bottom side. An inductor is embedded within the package substrate, a thermal conductor is embedded within the package substrate adjacent to the inductor to conduct heat away from the inductor, and a heat sink is thermally coupled to the thermal conductor to receive the heat from the conductor.

摘要翻译： 针对集成电路封装衬底描述了嵌入式空芯电感器。 衬底具有用于电感器的热导体。 一个示例包括承载集成电路管芯的封装衬底，该封装衬底具有多个顶侧焊盘以连接至顶侧上的管芯，多个底侧焊盘连接至底侧上的外部组件。 电感器嵌入在封装衬底内，热导体嵌入在封装衬底内与电感器相邻以将热量从电感器导出，并且散热器热耦合到热导体以接收来自导体的热量。 / p>

公开(公告)号：WO2003043081A2

公开(公告)日：2003-05-22

申请号：PCT/US2002/036895

申请日：2002-11-14

申请人： INTEL CORPORATION

发明人： DEPPISCH, Carl ,  HOULE, Sabina ,  FITZGERALD, Thomas ,  DAYTON, Kristopher ,  HUA, Fay

IPC分类号： H01L23/00

CPC分类号： H01L23/433 ,  H01L23/10 ,  H01L23/3735 ,  H01L23/3736 ,  H01L24/31 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00

摘要： An electronic assembly including a die, having an integrated circuit formed therein, a thermally conductive heat spreader, and indium located between the die and the heat spreader, is described. The heat spreader has a layer of nickel. A gold layer is formed on the nickel layer, and provides better wetting of indium than nickel. A better structural connection between the indium and the heat spreader is provided, especially during thermal cycling.

摘要翻译： 描述了一种包括其中形成有集成电路的模具，导热散热器和位于模具和散热器之间的铟的电子组件。 散热器有一层镍。 在镍层上形成金层，并且比镍提供更好的铟润湿。 提供铟和散热器之间更好的结构连接，特别是在热循环期间。

公开(公告)号：WO2003043081A3

公开(公告)日：2003-05-22

申请号：PCT/US2002/036895

申请日：2002-11-14

申请人： INTEL CORPORATION

发明人： DEPPISCH, Carl ,  HOULE, Sabina ,  FITZGERALD, Thomas ,  DAYTON, Kristopher ,  HUA, Fay

IPC分类号： H01L23/373

摘要： An electronic assembly including a die (40), having an integrated circuit formed therein, a thermally conductive heat spreader (16), and indium (14) located between the die and the heat spreader, is described. The heat spreader (16) has a layer of nickel (22). A gold layer (24) is formed on the nickel layer (22), and provides better wetting of indium than nickel. A better structural connection between the indium (14) and the heat spreader (16) is provided, especially during thermal cycling.

公开(公告)号：WO2003058714A2

公开(公告)日：2003-07-17

申请号：PCT/US2002/036039

申请日：2002-11-07

申请人： INTEL CORPORATION

发明人： FITZGERALD, Thomas ,  DEPPISCH, Carl ,  HUA, Fay

IPC分类号： H01L23/34

CPC分类号： H01L23/42 ,  H01L21/563 ,  H01L23/367 ,  H01L23/3735 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/16152 ,  H01L2924/3511 ,  Y10T29/49 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled into a package and exposed to the heat of a die. This device and method for designing and manufacturing an integrated heat spreader would generate a heat spreader that would be built compensate for deformations resulting from (1) physical manipulation during assembly (2) thermal gradients during operation and (3) differing rates of expansion and contraction of the package materials coupled with multiple package assembly steps at elevated temperatures so that one surface of the integrated heat spreader would have a flat shape.

摘要翻译： 一种用于设计和制造集成散热器的装置和方法，使得集成散热器将具有平坦表面，在组装到封装中并且暴露于热 一死。 这种用于设计和制造集成散热器的装置和方法将产生散热器，该散热器将补偿由（1）组装期间的物理操作（2）操作期间的热梯度和（3）不同的膨胀和收缩速率 的封装材料与在高温下的多个封装组装步骤相结合，使得集成散热器的一个表面将具有扁平形状。