公开(公告)号：WO2017112135A1

公开(公告)日：2017-06-29

申请号：PCT/US2016/062143

申请日：2016-11-16

Applicant: INTEL CORPORATION

Inventor： YEE, Rashelle ,  AOKI, Russell S. ,  FERGUSON, Shelby ,  HUI, Michael ,  CARSTENS, Jonathon Robert ,  JASNIEWSKI, Joseph J. ,  CEURTER, Kevin J.

IPC: H05K1/02 ,  H01L23/00

CPC classification number: H05K1/0271 ,  B23K1/0016 ,  B23K2201/42 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05B1/0233 ,  H05K1/0212 ,  H05K1/141 ,  H05K2201/041 ,  H05K2201/10378

Abstract: Disclosed herein are apparatus, systems, and methods for warpage mitigation in printed circuit board (PCB) assemblies. In some embodiments, a PCB assembly for warpage mitigation may include: a PCB; an interposer disposed on the PCB, wherein the interposer has a first face and an opposing second face, the first face is disposed between the second face and the PCB, conductive contacts are disposed at the second face, solder is disposed on the conductive contacts, the interposer includes a first heater trace proximate to the conductive contacts, and, when a first power is dissipated in the first heater trace, the first heater trace is to generate heat to cause the solder disposed on the conductive contacts to melt; wherein the PCB includes a second heater trace.

Abstract translation: 本文公开了用于印刷电路板（PCB）组件中的翘曲缓解的装置，系统和方法。 在一些实施例中，用于翘曲缓解的PCB组件可以包括：PCB; 设置在所述PCB上的中介层，其中所述中介层具有第一面和相对的第二面，所述第一面设置在所述第二面和所述PCB之间，在所述第二面设置导电触点，在所述导电触点上设置焊料， 所述内插器包括靠近所述导电触点的第一加热器迹线，并且当所述第一加热器迹线中的第一功率耗散时，所述第一加热器迹线将产生热量以使设置在所述导电触点上的所述焊料熔化; 其中PCB包括第二加热器迹线。

公开(公告)号：WO2017112134A1

公开(公告)日：2017-06-29

申请号：PCT/US2016/062117

申请日：2016-11-16

Applicant: INTEL CORPORATION

Inventor： FERGUSON, Shelby ,  YEE, Rashelle ,  AOKI, Russell S. ,  HUI, Michael ,  CARSTENS, Jonathon Robert ,  JASNIEWSKI, Joseph J.

IPC: H01L23/34 ,  H01L23/00

CPC classification number: G01K7/16 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/473 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/81908 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16251 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/014 ,  H01L2224/45099

Abstract: Disclosed herein are integrated circuit (IC) packages with temperature sensor traces, and related systems, devices, and methods. In some embodiments, an IC package may include a package substrate and an IC die disposed on the package substrate, wherein the package substrate includes a temperature sensor trace, and an electrical resistance of the temperature sensor trace is representative of an equivalent temperature of the temperature sensor trace.

Abstract translation: 这里公开了具有温度传感器迹线的集成电路（IC）封装，以及相关的系统，装置和方法。 在一些实施例中，IC封装可以包括封装衬底和设置在封装衬底上的IC管芯，其中封装衬底包括温度传感器迹线，并且温度传感器迹线的电阻代表温度的等效温度 传感器跟踪。

公开(公告)号：WO2017172191A1

公开(公告)日：2017-10-05

申请号：PCT/US2017/020023

申请日：2017-02-28

Applicant: INTEL CORPORATION

Inventor： CHENG, Feifei ,  LIU, Kuang C. ,  GARCIA, Michael ,  BUDDRIUS, Eric W. ,  CEURTER, Kevin J. ,  CARSTENS, Jonathon Robert

IPC: H01R13/629 ,  H01R13/639 ,  H01R107/00

Abstract: Embodiments of the present disclosure are directed to a linear edge connector assembly and corresponding bolster plate features for receiving and securing a linear edge connector assembly. Embodiments of the disclosure are directed to a linear edge connector assembly that includes a grooved and indented receiver that can receive a spring loaded ball on the bolster plate. In embodiments, the linear edge connector assembly can include a magnetic element to create a magnetic attraction to magnetic elements on the bolster plate, such as a press-fit ball or a U-shaped hardstop. In some embodiments, the linear edge connector assembly includes a screw or push pin that can be received by a receiver on the bolster plate. The receiver can include a thread or friction fit receiver.

Abstract translation: 本公开的实施例涉及线性边缘连接器组件和用于接收和固定线性边缘连接器组件的对应垫板特征。 本公开的实施例涉及一种线性边缘连接器组件，该线性边缘连接器组件包括能够在支撑板上接收弹簧加载的球的带凹槽和凹入的接收器。 在实施例中，线性边缘连接器组件可以包括磁性元件以对垫板上的磁性元件（诸如压配球或U形硬门槛）产生磁吸引力。 在一些实施例中，线性边缘连接器组件包括可由垫板上的接收器接收的螺钉或推针。 接收器可以包括一个螺纹或摩擦接收器。

公开(公告)号：WO2017172189A1

公开(公告)日：2017-10-05

申请号：PCT/US2017/020002

申请日：2017-02-28

Applicant: INTEL CORPORATION

Inventor： CHENG, Feifei ,  LIU, Kuang C. ,  GARCIA, Michael ,  BUDDRIUS, Eric W. ,  CEURTER, Kevin J. ,  VALPIANI, Anthony P. ,  CARSTENS, Jonathon Robert

IPC: H01R12/72 ,  G06F1/16

Abstract: Embodiments of the disclosure are directed to a linear edge connector assembly for connecting to a substrate diving board of a mother board. The linear edge connector assembly can include an electrical interface to electrically connect the contacts on the diving board to one or more conducts of a cable bundle. The linear edge connector assembly can also include a retaining force mechanism. The retaining force mechanism can include a torsional spring, a spring loaded hooking mechanism, or a spring loaded cam and lever. In some embodiments, the linear edge connector can include a notch to receive a latch connected to a bolster plate on the mother board.

Abstract translation: 本发明的实施例针对用于连接到母板的基板跳水板的线性边缘连接器组件。 线性边缘连接器组件可以包括电接口，以将跳板上的触点电连接到电缆束的一个或多个导管。 线性边缘连接器组件还可以包括保持力机构。 保持力机构可以包括扭转弹簧，弹簧加载钩机构或弹簧加载凸轮和杠杆。 在一些实施例中，线性边缘连接器可以包括凹口以容纳连接到母板上的摇枕板的闩锁。

公开(公告)号：WO2017112136A1

公开(公告)日：2017-06-29

申请号：PCT/US2016/062146

申请日：2016-11-16

Applicant: INTEL CORPORATION

Inventor： HUI, Michael ,  YEE, Rashelle ,  THIBADO, Jonathan ,  CARTER, Daniel P. ,  FERGUSON, Shelby ,  VALPIANI, Anthony P. ,  AOKI, Russell S. ,  CARSTENS, Jonathon Robert ,  JASNIEWSKI, Joseph J. ,  KOFSTAD, Harvey R. ,  BRAZEL, Michael ,  CLACK, Tracy ,  VOGMAN, Viktor ,  WOODCOCK, Penny ,  CEURTER, Kevin J. ,  YAN, Hongfei

IPC: H01L23/34 ,  H01L23/00 ,  H01L23/48 ,  H01L23/498

CPC classification number: H01L23/345 ,  H01L21/4853 ,  H01L21/4871 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/81908 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/45099 ,  H01L2924/00

Abstract: Disclosed herein are integrated circuit (IC) package support structures, and related systems, devices, and methods. In some embodiments, an IC package support structure may include a first heater trace, and a second heater trace, wherein the second heater trace is not conductively coupled the first heater trace in the IC package support structure.

Abstract translation: 这里公开了集成电路（IC）封装支撑结构以及相关的系统，装置和方法。 在一些实施例中，IC封装支撑结构可以包括第一加热器迹线和第二加热器迹线，其中第二加热器迹线不导电地耦合到IC封装支撑结构中的第一加热器迹线。