公开(公告)号：WO2017112076A1

公开(公告)日：2017-06-29

申请号：PCT/US2016/058879

申请日：2016-10-26

Applicant: INTEL CORPORATION

Inventor： AOKI, Russell S. ,  THIBADO, Jonathan W. ,  SMALLEY, Jeffory L. ,  LLAPITAN, David J. ,  BOYD, Thomas A. ,  KOFSTAD, Harvey R. ,  ZIAKAS, Dimitrios ,  YAN, Hongfei

IPC: H01R12/71 ,  H01R4/02 ,  H05K3/32

CPC classification number: H01L23/345 ,  H01L23/49816 ,  H01L23/49822 ,  H05K1/0212 ,  H05K1/141 ,  H05K1/144 ,  H05K3/3436 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2203/176

Abstract: A rework grid array interposer with direct power is described. The interposer has a foundation layer mountable between a motherboard and a package. A heater is embedded in the foundation layer to provide local heat to reflow solder to enable at least one of attachment or detachment of the package. A connector is mounted on the foundation layer and coupled to the heater and to the package to provide a connection path directly with the power supply and not via the motherboard. One type of interposer interfaces with a package having a solderable extension. Another interposer has a plurality of heater zones embedded in the foundation layer.

Abstract translation: 描述了具有直接功率的返工栅格阵列中介层。 内插器具有可安装在主板和封装之间的基础层。 加热器嵌入在基层中以提供局部热量来回流焊料，以使得封装的附接或分离中的至少一个能够进行。 连接器安装在基础层上并连接到加热器和封装，以提供直接与电源连接的连接路径而不是通过主板。 一种类型的内插器与具有可焊接扩展的封装件接合。 另一个插入器具有多个嵌入基础层中的加热器区域。

公开(公告)号：WO2008137291A1

公开(公告)日：2008-11-13

申请号：PCT/US2008/060975

申请日：2008-04-21

Applicant: INTEL CORPORATION ,  YAN, Hongfei ,  YUAN, Gang

Inventor： YAN, Hongfei ,  YUAN, Gang

IPC: G01R31/26

CPC classification number: G01R1/06722 ,  Y10T29/49147 ,  Y10T29/49155

Abstract: A test pin includes a compression element (110), a first tip (120) physically coupled to a first end (111) of the compression element, a second tip (130) physically coupled to a second end (112) of the compression element, a first arm (140) physically coupled to a first side (121) of the first tip, and a second arm (150) physically coupled to a second side (122) of the first tip.

Abstract translation: 测试销包括压缩元件（110），物理耦合到压缩元件的第一端（111）的第一尖端（120），物理耦合到压缩元件的第二端（112）的第二尖端（130） 物理耦合到第一末端的第一侧面（121）的第一臂（140）以及物理耦合到第一末端的第二侧（122）的第二臂（150）。

公开(公告)号：WO2017112136A1

公开(公告)日：2017-06-29

申请号：PCT/US2016/062146

申请日：2016-11-16

Applicant: INTEL CORPORATION

Inventor： HUI, Michael ,  YEE, Rashelle ,  THIBADO, Jonathan ,  CARTER, Daniel P. ,  FERGUSON, Shelby ,  VALPIANI, Anthony P. ,  AOKI, Russell S. ,  CARSTENS, Jonathon Robert ,  JASNIEWSKI, Joseph J. ,  KOFSTAD, Harvey R. ,  BRAZEL, Michael ,  CLACK, Tracy ,  VOGMAN, Viktor ,  WOODCOCK, Penny ,  CEURTER, Kevin J. ,  YAN, Hongfei

IPC: H01L23/34 ,  H01L23/00 ,  H01L23/48 ,  H01L23/498

CPC classification number: H01L23/345 ,  H01L21/4853 ,  H01L21/4871 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/81908 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/45099 ,  H01L2924/00

Abstract: Disclosed herein are integrated circuit (IC) package support structures, and related systems, devices, and methods. In some embodiments, an IC package support structure may include a first heater trace, and a second heater trace, wherein the second heater trace is not conductively coupled the first heater trace in the IC package support structure.

Abstract translation: 这里公开了集成电路（IC）封装支撑结构以及相关的系统，装置和方法。 在一些实施例中，IC封装支撑结构可以包括第一加热器迹线和第二加热器迹线，其中第二加热器迹线不导电地耦合到IC封装支撑结构中的第一加热器迹线。

公开(公告)号：WO2017052990A1

公开(公告)日：2017-03-30

申请号：PCT/US2016/048848

申请日：2016-08-26

Applicant: INTEL CORPORATION

Inventor： HE, Jiangqi ,  YAN, Hongfei ,  GUO, Chunlei ,  SHEN, Wei

IPC: G06F11/30

CPC classification number: G06F11/3058 ,  G01K7/36 ,  G01K11/26

Abstract: A method and device for temperature measurement of a processor is disclosed. A temperature-sensing circuit of the processor may have an associated resonance frequency, wherein the resonance frequency depends on a temperature of the temperature-sensing circuit. A temperature of the temperature-sensing circuit may be determined by determining the resonance frequency of the temperature-sensing circuit.

Abstract translation: 公开了一种用于处理器的温度测量的方法和装置。 处理器的温度感测电路可以具有相关联的谐振频率，其中谐振频率取决于温度感测电路的温度。 温度检测电路的温度可以通过确定温度感测电路的谐振频率来确定。

公开(公告)号：WO2014105626A1

公开(公告)日：2014-07-03

申请号：PCT/US2013/076520

申请日：2013-12-19

Applicant: INTEL CORPORATION ,  YAN, Hongfei ,  SMALLEY, Jeffory L.

Inventor： YAN, Hongfei ,  SMALLEY, Jeffory L.

IPC: H01R33/76

CPC classification number: H05K7/20436 ,  H01R12/716 ,  H01R12/73

Abstract: A modular multiple piece socket and a computing system are described herein. The modular multiple piece socket includes a plurality of socket pieces, wherein at least one corridor separates the socket pieces. The plurality of socket pieces may be configured to secure a processing unit to a printed circuit board. The at least one corridor may be filled with a thermally conductive material.

Abstract translation: 本文描述了模块化多件式插座和计算系统。 模块化多件式插座包括多个插座件，其中至少一个走廊分离插座件。 多个插座件可以被配置为将处理单元固定到印刷电路板。 至少一个走廊可以用导热材料填充。