公开(公告)号：WO2018004857A1

公开(公告)日：2018-01-04

申请号：PCT/US2017/033090

申请日：2017-05-17

Applicant: INTEL CORPORATION

Inventor： TANG, Zhizhong ,  JAIN, Syadwad ,  HU, Wei ,  SCHROEDER, Michael A. ,  SIDHU, Rajen S. ,  DEPPISCH, Carl L. ,  NARDI, Patrick ,  LOFGREEN, Kelly P. ,  DUBEY, Manish

IPC: H01L23/373 ,  H05K7/20 ,  C09K5/06

Abstract: Devices and methods disclosed herein can include a conductive foam having pores disposed within the conductive foam. The conductive foam can be compressible between an uncompressed thickness and a compressed thickness. The compressed thickness can be ninety-five percent or less of the uncompressed thickness. In one example, a filler can be disposed in the pores of the conductive foam. The filler can include a first thermal conductivity. The first thermal conductivity can be greater than a thermal conductivity of air.

Abstract translation: 本文公开的装置和方法可以包括具有设置在导电泡沫内的孔的导电泡沫。 导电泡沫可以在未压缩厚度和压缩厚度之间压缩。 压缩厚度可以是未压缩厚度的百分之九十五或更少。 在一个示例中，填充物可以设置在导电泡沫的孔中。 填充物可以包括第一热导率。 第一个导热系数可以大于空气的导热系数。

公开(公告)号：WO2018005000A1

公开(公告)日：2018-01-04

申请号：PCT/US2017/035771

申请日：2017-06-02

Applicant: INTEL CORPORATION

Inventor： XU, Mingjie ,  GU, Pan ,  ZIADEH, Bassam ,  GARCIA, Michael ,  TANG, Zhizhong

IPC: H01L21/673 ,  H01L21/48 ,  H05K13/04 ,  H05K13/00 ,  H01L23/40

Abstract: A container assembly and system for dispensing a stack of electronic device components includes an elongated tube having a cavity configured to contain a stack of said components. The tube has a dispensing end opposite an access end and a dispenser opening sized to dispense the electronic device components. The access end has an access opening sized to allow entry of a press to push the stack upwardly. A retainer is positioned proximate the access end to engage a last component in the stack and prevent it from exiting the tube through the access opening. The retainer may include a plurality of retainers. The retainer(s) can be a pair of retainers, four retainers, a chamfer formed in the tube, a perimeter insert, and/or a slidable panel. A method of making and a method of dispensing are provided.

Abstract translation: 用于分配电子设备组件的堆叠的容器组件和系统包括具有被配置为容纳所述组件的堆叠的腔的细长管。 该管具有与进入端相对的分配端和分配开口，该分配开口的大小被设定为分配电子装置部件。 接近端有一个入口，其大小允许压入机构向上推动堆垛。 保持器定位在进入端附近以接合堆叠中的最后部件并且防止其通过进入开口离开管。 保持器可以包括多个保持器。 保持器可以是一对保持器，四个保持器，在管中形成的倒角，周边插入件和/或可滑动面板。 提供了一种制造方法和一种分配方法。

公开(公告)号：WO2017086911A1

公开(公告)日：2017-05-26

申请号：PCT/US2015/060831

申请日：2015-11-16

Applicant: INTEL CORPORATION ,  HU, Wei ,  ANTONISWAMY, Aravindha R. ,  FITZGERALD, Thomas J. ,  PATEL, Nikunj P. ,  JAIN, Syadwad ,  TANG, Zhizhong ,  KOTHARI, Shrenik

Inventor： HU, Wei ,  ANTONISWAMY, Aravindha R. ,  FITZGERALD, Thomas J. ,  PATEL, Nikunj P. ,  JAIN, Syadwad ,  TANG, Zhizhong ,  KOTHARI, Shrenik

IPC: H05K7/20 ,  H01L23/34

CPC classification number: H01L21/4871 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/3731 ,  H01L23/3736 ,  H01L23/42 ,  H01L23/544 ,  H01L2223/54406 ,  H01L2223/54433 ,  H01L2223/54486

Abstract: Disclosed herein are embodiments of sintered heat spreaders with inserts and related devices and methods. In some embodiments, a heat spreader may include: a frame including aluminum and a polymer binder; an insert disposed in the frame, wherein the insert has a thermal conductivity higher than a thermal conductivity of the frame; and a recess having at least one sidewall formed by the frame. The polymer binder may be left over from sintering frame material and insert material to form the heat spreader.

Abstract translation: 这里公开了具有插入件和相关装置和方法的烧结散热器的实施例。 在一些实施例中，散热器可以包括：包括铝和聚合物粘合剂的框架; 设置在所述框架中的插入件，其中所述插入件具有比所述框架的导热率更高的导热率; 以及具有由框架形成的至少一个侧壁的凹部。 聚合物粘合剂可以从烧结框架材料上留下并插入材料以形成散热器。

公开(公告)号：WO2017111839A1

公开(公告)日：2017-06-29

申请号：PCT/US2015/000397

申请日：2015-12-26

Applicant: INTEL CORPORATION ,  TANG, Zhizhong ,  KOURAKATA, Shinobu ,  OGATA, Kazuo ,  START, Paul, R. ,  JIAN, Syadwad ,  LABANOK, William, Nicholas ,  HU, Wei ,  LI, Peng ,  YOUNG, Douglas, R. ,  CONSTABLE, Gregory, S. ,  BEATTY, John, J. ,  BHATTI, Pardeep, K. ,  GARNER, Luke, J. ,  ANTONISWAMY, Aravindha, R.

Inventor： TANG, Zhizhong ,  KOURAKATA, Shinobu ,  OGATA, Kazuo ,  START, Paul, R. ,  JIAN, Syadwad ,  LABANOK, William, Nicholas ,  HU, Wei ,  LI, Peng ,  YOUNG, Douglas, R. ,  CONSTABLE, Gregory, S. ,  BEATTY, John, J. ,  BHATTI, Pardeep, K. ,  GARNER, Luke, J. ,  ANTONISWAMY, Aravindha, R.

IPC: H01L23/36

CPC classification number: H01L21/4882 ,  H01L23/3675 ,  H01L23/49833 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15311

Abstract: Embodiments are generally directed to a swaging process for complex integrated heat spreaders. An embodiment of an integrated heat spreader includes components, each of the components including one or more swage points; and a multiple swage joints, each swage joint including a swage pin joining two or more components, wherein components are joined into a single integrated heat spreader unit by the swage joints.

Abstract translation: 实施例通常针对用于复杂集成散热器的模锻过程。 集成散热器的实施例包括部件，每个部件包括一个或多个型锻点; 和多个型锻接头，每个型锻接头包括连接两个或多个部件的型锻销，其中部件通过型锻接头连接到单个整体式散热器单元中。

公开(公告)号：WO2017086912A1

公开(公告)日：2017-05-26

申请号：PCT/US2015/060832

申请日：2015-11-16

Applicant: INTEL CORPORATION ,  ANTONISWAMY, Aravindha R. ,  JAIN, Syadwad ,  TANG, Zhizhong ,  HU, Wei

Inventor： ANTONISWAMY, Aravindha R. ,  JAIN, Syadwad ,  TANG, Zhizhong ,  HU, Wei

IPC: H01L23/34

CPC classification number: H01L23/3675 ,  H01L21/4871 ,  H01L23/36

Abstract: Disclosed herein are embodiments of heat spreaders with interlocked inserts, and related devices and methods. In some embodiments, a heat spreader may include: a frame formed of a first material, wherein the frame includes an opening, a projection of the frame extends into the opening, and the projection has a top surface, a side surface, and a bottom surface; a recess having at least one sidewall formed by the frame; and an insert formed of a second material different from the first material, wherein the insert is disposed in the frame and in contact with the top surface, the side surface, and the bottom surface of the projection.

Abstract translation: 这里公开了具有互锁插入件的散热器以及相关装置和方法的实施例。 在一些实施例中，散热器可以包括：由第一材料形成的框架，其中框架包括开口，框架的突出部延伸到开口中，并且突出部具有顶表面，侧表面和底部 表面; 具有由所述框架形成的至少一个侧壁的凹部; 以及由与第一材料不同的第二材料形成的插入件，其中插入件设置在框架中并与突出部的顶表面，侧表面和底表面接触。