公开(公告)号：WO2015147844A1

公开(公告)日：2015-10-01

申请号：PCT/US2014/032084

申请日：2014-03-27

Applicant: INTEL CORPORATION ,  MIRPURI, Kabirkumar J. ,  JIANG, Hongjin ,  OSBORN, Tyler N. ,  SIDHU, Rajen S. ,  BEKAR, Ibrahim ,  JADHAV, Susheel G.

Inventor： MIRPURI, Kabirkumar J. ,  JIANG, Hongjin ,  OSBORN, Tyler N. ,  SIDHU, Rajen S. ,  BEKAR, Ibrahim ,  JADHAV, Susheel G.

IPC: H01L23/34 ,  H01L23/48

CPC classification number: H01L24/73 ,  H01L21/4867 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/13 ,  H01L24/29 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/0569 ,  H01L2224/11 ,  H01L2224/13014 ,  H01L2224/13026 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/29026 ,  H01L2224/29109 ,  H01L2224/29113 ,  H01L2224/73104 ,  H01L2224/92143 ,  H01L2924/014

Abstract: Apparatuses, processes, and systems related to an interconnect with an increased z-height and decreased reflow temperature are described herein. In embodiments, an interconnect may include a solder ball and a solder paste to couple the solder ball to a substrate. The solder ball and/or solder paste may be comprised of an alloy with a relatively low melting point and an alloy with a relatively high melting point.

Abstract translation: 这里描述了与具有增加的z高度和降低的回流温度的互连相关的装置，工艺和系统。 在实施例中，互连可以包括焊球和焊膏以将焊球耦合到衬底。 焊球和/或焊膏可以由具有较低熔点的合金和具有较高熔点的合金构成。

公开(公告)号：WO2018004857A1

公开(公告)日：2018-01-04

申请号：PCT/US2017/033090

申请日：2017-05-17

Applicant: INTEL CORPORATION

Inventor： TANG, Zhizhong ,  JAIN, Syadwad ,  HU, Wei ,  SCHROEDER, Michael A. ,  SIDHU, Rajen S. ,  DEPPISCH, Carl L. ,  NARDI, Patrick ,  LOFGREEN, Kelly P. ,  DUBEY, Manish

IPC: H01L23/373 ,  H05K7/20 ,  C09K5/06

Abstract: Devices and methods disclosed herein can include a conductive foam having pores disposed within the conductive foam. The conductive foam can be compressible between an uncompressed thickness and a compressed thickness. The compressed thickness can be ninety-five percent or less of the uncompressed thickness. In one example, a filler can be disposed in the pores of the conductive foam. The filler can include a first thermal conductivity. The first thermal conductivity can be greater than a thermal conductivity of air.

Abstract translation: 本文公开的装置和方法可以包括具有设置在导电泡沫内的孔的导电泡沫。 导电泡沫可以在未压缩厚度和压缩厚度之间压缩。 压缩厚度可以是未压缩厚度的百分之九十五或更少。 在一个示例中，填充物可以设置在导电泡沫的孔中。 填充物可以包括第一热导率。 第一个导热系数可以大于空气的导热系数。

公开(公告)号：WO2013095670A1

公开(公告)日：2013-06-27

申请号：PCT/US2011/067277

申请日：2011-12-23

Applicant: INTEL CORPORATION ,  SIDHU, Rajen S. ,  DUDEK, Martha A. ,  MATAYABAS, JR., James C. ,  PHEN, Michelle S. ,  TAN, Wei

Inventor： SIDHU, Rajen S. ,  DUDEK, Martha A. ,  MATAYABAS, JR., James C. ,  PHEN, Michelle S. ,  TAN, Wei

IPC: H01L21/60 ,  H01L23/48

CPC classification number: B23K35/025 ,  B23K35/362 ,  H01L21/4853 ,  H01L23/488 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0381 ,  H01L2224/03828 ,  H01L2224/03829 ,  H01L2224/03849 ,  H01L2224/0401 ,  H01L2224/05794 ,  H01L2224/058 ,  H01L2224/05809 ,  H01L2224/05811 ,  H01L2224/05813 ,  H01L2224/05817 ,  H01L2224/05839 ,  H01L2224/05844 ,  H01L2224/11334 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/131 ,  H01L2924/3511 ,  H01L2924/3841 ,  H05K3/3489 ,  H05K2203/041 ,  H05K2203/046 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/01032 ,  H01L2924/01105 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/0103 ,  H01L2924/01049 ,  H01L2924/01083

Abstract: Flux formulations and solder attachment during the fabrication of electronic device assemblies are described. One flux formation includes a flux component and a metal particle component, the metal particle component being present in an amount of from 5 to 35 volume percent of the flux formulation. In one feature of certain embodiments, the metal particle component includes solder particles. Other embodiments are described and claimed.

Abstract translation: 描述了在制造电子器件组件期间的焊剂配方和焊料附着。 一种熔剂形成包括助熔剂组分和金属颗粒组分，金属颗粒组分的存在量为焊剂配方的5至35体积％。 在某些实施方案的一个特征中，金属颗粒组分包括焊料颗粒。 描述和要求保护其他实施例。