公开(公告)号：WO2019231607A1

公开(公告)日：2019-12-05

申请号：PCT/US2019/030423

申请日：2019-05-02

Applicant: INVENSAS CORPORATION

Inventor： HABA, Belgacem ,  MOHAMMED, Llyas ,  DELACRUZ, Javier, A.

IPC: H01L25/065 ,  H01L21/78 ,  H01L23/00 ,  H01L25/00

Abstract: A three-dimensional stacking technique performed in a wafer-to-wafer fashion reducing the machine movement in production. The Wafers are processed with metallic traces and stacked before dicing into separate die stacks. The traces of each layer of the stacks are interconnected via electroless plating.

公开(公告)号：WO2014165245A1

公开(公告)日：2014-10-09

申请号：PCT/US2014/024950

申请日：2014-03-12

Applicant: INVENSAS CORPORATION

Inventor： KATKAR, Rajesh ,  UZOH, Cyprian, Emeka ,  HABA, Belgacem ,  MOHAMMED, Llyas

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H05K1/0306 ,  H01L21/481 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/13 ,  H01L23/3731 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5381 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K1/09 ,  H05K1/112 ,  H05K1/115 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/09545 ,  H05K2201/10378 ,  H05K2203/0323

Abstract: Interposers and methods of making the same are disclosed herein. In one embodiment, an interposer includes a region having first and second oppositely facing surfaces and a plurality of pores, each pore extending in a first direction from the first surface towards the second surface, wherein alumina extends along a wall of each pore; a plurality of electrically conductive connection elements extending in the first direction, consisting essentially of aluminum and being electrically isolated from one another by at least the alumina; a first conductive path provided at the first surface for connection with a first component external to the interposer; and a second conductive path provided at the second surface for connection with a second component external to the interposer, wherein the first and second conductive paths are electrically connected through at least some of the connection elements.

Abstract translation: 中间体及其制备方法在本文中公开。 在一个实施例中，插入件包括具有第一和第二相对面的表面和多个孔的区域，每个孔在第一方向上从第一表面向第二表面延伸，其中氧化铝沿每个孔的壁延伸; 多个导电连接元件，其沿第一方向延伸，主要由铝构成，并通过至少氧化铝彼此电隔离; 第一导电路径，设置在第一表面处，用于与插入件外部的第一部件连接; 以及设置在所述第二表面处用于与所述插入件外部的第二部件连接的第二导电路径，其中所述第一和第二导电路径通过至少一些所述连接元件电连接。

公开(公告)号：WO2017123398A1

公开(公告)日：2017-07-20

申请号：PCT/US2016/068133

申请日：2016-12-21

Applicant: INVENSAS CORPORATION

Inventor： MOHAMMED, Llyas ,  HABA, Belgacem

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48

CPC classification number: H01L25/0657 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/565 ,  H01L21/566 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic assembly or package can include first and second support elements and a microelectronic element between inwardly facing surfaces of the support elements. First connectors and second connectors such as solder balls, metal posts, stud bumps, or the like face inwardly from the respective support elements and are aligned with and electrically coupled with one another in columns. The first connectors, the second connectors or both may be partially encapsulated prior to electrically coupling respective pairs of first and second connectors in columns. A method may include arranging extremities of first connectors or second connectors in a temporary layer before forming the partial encapsulation.

Abstract translation: 微电子组件或封装可以包括第一支撑元件和第二支撑元件以及在支撑元件的面向内的表面之间的微电子元件。 第一连接器和第二连接器（例如焊球，金属柱，柱形凸块等）从相应的支撑元件向内面向并且彼此对齐并且以列的方式彼此电耦合。 第一连接器，第二连接器或两者可以在将各对第一和第二连接器成列地电耦合之前被部分地封装。 一种方法可以包括在形成部分封装之前将第一连接器或第二连接器的末端布置在临时层中。