公开(公告)号：WO2011068249A3

公开(公告)日：2011-08-18

申请号：PCT/JP2010072063

申请日：2010-12-02

Applicant: NIPPON KOGAKU KK ,  SHIBAZAKI YUICHI

Inventor： SHIBAZAKI YUICHI

IPC: G03F7/20

CPC classification number: G03F7/70925 ,  G03F7/70341 ,  G03F7/70858

Abstract: Liquid (Lq) is held between a tip lens (42) of a projection optical system and a wafer (W) on a wafer stage, using a nozzle member (32) which has a shape enclosing an optical path of an illumination light (IL), and a bottom surface to which the wafer is placed facing via a predetermined clearance that has an annular recess section (32n, 32h) formed having multiple projecting sections (32b1, 32b2, 32d). This prevents adhesion of contamination and liquid from remaining that become factors of defects of a pattern formed on the wafer. The nozzle member preferably has an annular shaped inclined surface(32c) whose gap with the wafer surface becomes smaller from the inner side to the outer side, formed on an inner bottom surface facing the wafer of an outer recess section (32h) formed on the bottom surface of the nozzle member.

Abstract translation: 使用具有包围照明光的光路（IL）的喷嘴构件（32）将液体（Lq）保持在投影光学系统的前端透镜（42）和晶圆台（W） ）和通过具有形成有多个突出部（32b1,32b2,32d）的环形凹部（32n，32h）的预定间隙而面对晶片的底面。 这样可防止成为晶片上形成的图案缺陷的因素的污染物和液体残留。 喷嘴构件优选具有环形倾斜面（32c），其与晶片表面的间隙从内侧到外侧变小，形成在与形成在其上的外部凹部（32h）的晶片相对的内底面上 喷嘴构件的底面。

公开(公告)号：WO2010032878A3

公开(公告)日：2010-06-17

申请号：PCT/JP2009066848

申请日：2009-09-18

Applicant: NIPPON KOGAKU KK ,  SHIBAZAKI YUICHI

Inventor： SHIBAZAKI YUICHI

IPC: G03F7/20

CPC classification number: G03F7/70725 ,  G03F7/70716 ,  G03F7/70775 ,  H01L21/681

Abstract: In measurement of a positional information in the XY plane of a fine movement stage (WFS) held by a coarse movement stage(WCS), an encoder system is used including a head which is placed facing a grating (RG) placed on a surface substantially parallel to the XY plane of the fine movement stage and irradiates a measurement beam on the grating. Then, the fine movement stage is driven individually or integrally with the coarse movement stage by a drive system, based on the positional information measured by the encoder system. In this case, the head of the encoder system can be placed in proximity to the fine movement stage (the grating), which allows a highly precise measurement of the positional information of the fine movement stage by the encoder system.

Abstract translation: 在测量由粗动载台（WCS）保持的微动载台（WFS）的XY平面中的位置信息时，使用编码器系统，该编码器系统包括面向放置在表面上的光栅（RG）放置的光头 平行于微动台的XY平面并将测量光束照射在光栅上。 然后，基于由编码器系统测量的位置信息，通过驱动系统单独地或整体地与粗动载台一起驱动微动载台。 在这种情况下，编码器系统的头部可以放置在精细运动平台（光栅）附近，从而可以通过编码器系统高精度测量精细运动平台的位置信息。

公开(公告)号：WO2010030018A3

公开(公告)日：2010-05-06

申请号：PCT/JP2009065977

申请日：2009-09-07

Applicant: NIPPON KOGAKU KK ,  SHIBAZAKI YUICHI ,  HIRUKAWA SHIGERU

Inventor： SHIBAZAKI YUICHI ,  HIRUKAWA SHIGERU

IPC: G03F7/095

CPC classification number: G03F7/265 ,  G03F7/095 ,  G03F7/405 ,  H01L21/0274

Abstract: A pattern forming method includes coating, on a wafer W, a negative resist 3 and a positive resist 4 which has a higher sensitivity; exposing the positive resist 4 and the negative resist 3 on the wafer W with an image of a line-and-space pattern; and developing the positive resist 4 and the negative resist 3 in a direction parallel to a normal line of a surface of the wafer W. A fine pattern, which exceeds the resolution limit of an exposure apparatus, can be formed by using the lithography process without performing the overlay exposure.

Abstract translation: 图案形成方法包括：在晶片W上涂覆具有较高灵敏度的负性抗蚀剂3和正性抗蚀剂4; 用线和空间图案的图像曝光晶片W上的正抗蚀剂4和负抗蚀剂3; 以及在与晶片W的表面的法线平行的方向上显影正型抗蚀剂4和负型抗蚀剂3.可以通过使用光刻工艺来形成超过曝光装置的分辨率极限的精细图案 执行叠加曝光。

公开(公告)号：WO2008146946A2

公开(公告)日：2008-12-04

申请号：PCT/JP2008060255

申请日：2008-05-28

Applicant: NIPPON KOGAKU KK ,  SHIBAZAKI YUICHI

Inventor： SHIBAZAKI YUICHI

IPC: G03F7/20 ,  G03F9/00

CPC classification number: G03F7/70875 ,  G03F7/70258 ,  G03F7/70341 ,  G03F7/70425 ,  G03F7/70633 ,  G03F7/70733 ,  G03F7/70775 ,  G03F7/70783 ,  G03F7/7085 ,  G03F9/7084

Abstract: An exposure method includes measuring coordinates of alignment marks before and after exposing a first wafer to determine a fluctuation amount ?pi of a parameter of the alignment (Steps 201, 204, 205); measuring coordinates of alignment marks before exposing a second wafer to determine a parameter pi of the alignment (Step 207); and aligning and exposing the second wafer (Step 209) based on a parameter pi' obtained by correcting the parameter pi with the fluctuation amount ?pi determined for the first wafer (Step 208). A high overlay accuracy can be obtained even when the alignment information is gradually changed, for example, due to the linear expansion and contraction of the substrate during the exposure of the substrate.

Abstract translation: 曝光方法包括测量第一晶片曝光之前和之后对准标记的坐标，以确定对准参数的波动量Δpi（步骤201,204,205）; 在暴露第二晶片之前测量对准标记的坐标以确定对准的参数pi（步骤207）; 并且基于通过用针对第一晶片确定的波动量Δpi校正参数pi而获得的参数pi'（步骤209），对准和曝光第二晶片（步骤209）。 即使当对准信息逐渐改变时，例如由于衬底的曝光期间衬底的线性膨胀和收缩，也可以获得高覆盖精度。

公开(公告)号：WO2010134643A3

公开(公告)日：2011-08-25

申请号：PCT/JP2010058946

申请日：2010-05-20

Applicant: NIPPON KOGAKU KK ,  SHIBAZAKI YUICHI

Inventor： SHIBAZAKI YUICHI

IPC: G03F7/20

CPC classification number: G03F7/70733 ,  G03F7/70691 ,  G03F7/707 ,  G03F7/70775 ,  H01L21/67225 ,  H01L21/67748 ,  H01L21/6838

Abstract: A carrier apparatus positions a chuck member (108) above a wafer (W) mounted on a fine movement stage (WFS2), relatively moves the chuck member (108) and the fine movement stage(WFS2) in a vertical direction, makes the chuck member (108) approach a position which is a predetermined distance away from the upper surface of the wafer (W), makes the chuck member(108) hold the wafer (W) from above in a non-contact manner, and makes the chuck member holding the wafer and the fine movement stage move apart within a predetermined plane after making the chuck member holding the wafer and the fine movement stage move apart in the vertical direction. Further, the carrier apparatus loads the wafer (W) held in a non-contact manner from above by the chuck member on the fine movement stage. Therefore, it is not necessary to form or provide a notch to house an arm and the like used in the wafer exchange on a holding member such as a wafer holder on the fine movement stage, and a vertical movement member used in the delivery of the wafer, in the holding member.

Abstract translation: 载体装置将安装在微动台（WFS2）上的晶片（W）上方的卡盘构件（108）定位在垂直方向上相对移动卡盘构件（108）和微动载置台（WFS2），使卡盘 构件（108）接近离开晶片（W）的上表面预定距离的位置，使卡盘构件（108）以不接触的方式从上方保持晶片（W），并使卡盘 在使夹持构件保持晶片并且微动台在垂直方向上分离的同时，保持晶片和微动载置台在预定平面内移动的构件。 此外，载体装置通过卡盘构件在微动载台上将不以非接触方式保持的晶片（W）装载在卡盘部件上。 因此，不需要在微动台上的保持构件例如晶片保持架上形成或设置用于在晶片更换中使用的臂等的凹口，以及用于输送 晶片，在保持构件中。

公开(公告)号：WO2013112761A2

公开(公告)日：2013-08-01

申请号：PCT/US2013023023

申请日：2013-01-24

Applicant: NIPPON KOGAKU KK ,  BINNARD MICHAEL B ,  SHIBAZAKI YUICHI ,  WELLS J KYLE

Inventor： BINNARD MICHAEL B ,  SHIBAZAKI YUICHI ,  WELLS J KYLE

IPC: H04N3/02

CPC classification number: H02K41/031 ,  G03F7/70758 ,  H02K2201/18

Abstract: A stage assembly (1 0) that moves a device (38) includes a stage mover (1 6) that moves the stage (14) along a first axis and along a second axis. The stage mover (16) includes a magnet assembly (20), and a conductor assembly (22). The conductor assembly (22) includes a plurality of first axis conductor units (24) and a plurality of second axis conductor units (26). The magnet assembly (20) includes a first axis magnet array (28A) and a second axis magnet array (30A). The first axis conductor units (24) are arranged in an alternating fashion with the second axis conductor units (26) along the first axis and along the second axis. The performance of the stage mover (16) can be different in the first and second axes. Either the conductor units (24) (26) and/or the magnet arrays (28A) (30A) can have a different geometry in the first and second axes.

Abstract translation: 移动设备（38）的平台组件（110）包括沿着第一轴线并沿着第二轴线移动台架（14）的平台移动器（116）。 载物台（16）包括磁体组件（20）和导体组件（22）。 导体组件（22）包括多个第一轴导体单元（24）和多个第二轴导体单元（26）。 磁体组件（20）包括第一轴磁体阵列（28A）和第二轴磁体阵列（30A）。 第一轴导体单元（24）沿着第一轴线和第二轴线与第二轴线导体单元（26）交替地布置。 在第一和第二轴上，载物台（16）的性能可以不同。 导体单元（24）（26）和/或磁体阵列（28A）（30A）可以在第一和第二轴线上具有不同的几何形状。

公开(公告)号：WO2010134643A8

公开(公告)日：2011-10-13

申请号：PCT/JP2010058946

申请日：2010-05-20

Applicant: NIPPON KOGAKU KK ,  SHIBAZAKI YUICHI

Inventor： SHIBAZAKI YUICHI

IPC: G03F7/20

CPC classification number: G03F7/70733 ,  G03F7/70691 ,  G03F7/707 ,  G03F7/70775 ,  H01L21/67225 ,  H01L21/67748 ,  H01L21/6838

Abstract: A carrier apparatus positions a chuck member (108) above a wafer (W) mounted on a fine movement stage (WFS2), relatively moves the chuck member (108) and the fine movement stage(WFS2) in a vertical direction, makes the chuck member (108) approach a position which is a predetermined distance away from the upper surface of the wafer (W), makes the chuck member(108) hold the wafer (W) from above in a non-contact manner, and makes the chuck member holding the wafer and the fine movement stage move apart within a predetermined plane after making the chuck member holding the wafer and the fine movement stage move apart in the vertical direction. Further, the carrier apparatus loads the wafer (W) held in a non-contact manner from above by the chuck member on the fine movement stage. Therefore, it is not necessary to form or provide a notch to house an arm and the like used in the wafer exchange on a holding member such as a wafer holder on the fine movement stage, and a vertical movement member used in the delivery of the wafer, in the holding member.

Abstract translation: 载体装置将安装在微动台（WFS2）上的晶片（W）上方的卡盘构件（108）定位在垂直方向上相对移动卡盘构件（108）和微动载置台（WFS2），使卡盘 构件（108）接近离开晶片（W）的上表面预定距离的位置，使卡盘构件（108）以不接触的方式从上方保持晶片（W），并使卡盘 在使夹持构件保持晶片并且微动台在垂直方向上分离的同时，保持晶片和微动载置台在预定平面内移动的构件。 此外，载体装置通过卡盘构件在微动载台上将不以非接触方式保持的晶片（W）装载在卡盘部件上。 因此，不需要在微动台上的保持构件例如晶片保持架上形成或设置用于在晶片更换中使用的臂等的凹口，以及用于输送 晶片，在保持构件中。

公开(公告)号：WO2011081215A4

公开(公告)日：2011-08-25

申请号：PCT/JP2010073871

申请日：2010-12-24

Applicant: NIPPON KOGAKU KK ,  SHIBAZAKI YUICHI ,  OKUTOMI AKIRA ,  HIRANO KAZUHIRO

Inventor： SHIBAZAKI YUICHI ,  OKUTOMI AKIRA ,  HIRANO KAZUHIRO

IPC: G05B19/19 ,  G03F7/20

CPC classification number: G03F7/70775

Abstract: A stage is driven (position control) using a hybrid signal (FHY) which is obtained by synthesizing an output signal (FIY) of an interferometer (16) (an interferometer system (118)) and an output signal (FEY) of an encoder (70A) (an encoder system (150)) that are made to pass through a high pass filter (Hfc) and a low pass filter (Lfc), respectively. A cutoff frequency (fc) is set to a frequency corresponding to a speed slightly smaller than the speed of the stage at the time of scanning exposure. This allows the stage to be driven using the interferometer whose linear measurement is high at the time of scanning exposure, and using the encoder whose measurement reproducibility is high at the time of stepping.

Abstract translation: 使用通过合成干涉仪（16）（干涉仪系统（118））的输出信号（FIY）和编码器的输出信号（FEY）获得的混合信号（FHY）来驱动一个级（位置控制） （70A）（编码器系统（150）），它们分别通过高通滤波器（Hfc）和低通滤波器（Lfc）。 截止频率（fc）被设定为与略低于扫描曝光时的载台的速度相对应的速度的频率。 这允许使用在扫描曝光时线性测量高的干涉仪来驱动载物台，并且使用在步进时测量再现性高的编码器。

公开(公告)号：WO2010134645A3

公开(公告)日：2011-01-20

申请号：PCT/JP2010058948

申请日：2010-05-20

Applicant: NIPPON KOGAKU KK ,  SHIBAZAKI YUICHI

Inventor： SHIBAZAKI YUICHI

IPC: G03F7/20 ,  H01L21/687

CPC classification number: G03F7/70691 ,  G03F7/707 ,  G03F7/70733 ,  G03F7/7075 ,  G03F9/7011 ,  H01L21/67748 ,  H01L21/68707

Abstract: While an exposure processing is performed to a wafer (W) held by a fine movement stage (WFS1) supported by a coarse movement stage (WCS1) in an exposure station (200), at least a part of a measurement processing to a wafer (W) held by a fine movement stage (WFS2) supported by a coarse movement stage (WCS2) and an exchange of a wafer (W) held by a fine movement stage (WFS3) on a center table (130) is concurrently performed. Because of this, exposure with a higher throughput becomes possible, even when compared with a conventional exposure apparatus which concurrently performs an exposure processing to a wafer on a wafer stage, and processing such as wafer exchange and alignment on another stage.

Abstract translation: 在对由曝光站（200）中的粗动台（WCS1）支撑的微动载台（WFS1）保持的晶片（W）进行曝光处理时，至少对晶片进行测量处理 同时进行由粗移动台（WCS2）支撑的微动载台（WFS2）保持的W和由中心台（130）上的微移动台（WFS3）保持的晶片（W）的更换。 因此，即使与同时对晶片台上的晶片进行曝光处理的常规曝光装置以及在另一台上的晶片更换和对准的处理相比较，也能够以更高的通量进行曝光。

公开(公告)号：WO2009041702A3

公开(公告)日：2009-12-03

申请号：PCT/JP2008067778

申请日：2008-09-24

Applicant: NIPPON KOGAKU KK ,  SHIBAZAKI YUICHI

Inventor： SHIBAZAKI YUICHI

IPC: G03F7/20

CPC classification number: G03F7/709 ,  G03F7/70883 ,  G03F7/70991 ,  H02J5/005

Abstract: Electric power is generated by using a generator (38) equipped with: a coil unit (38A) that is arranged on a barrel platform (50) and incorporates coils(39); and a magnet unit (38B) that has a magnet section (44) arranged on a protruding section (33a) of a column (30) separated from the barrel platform (50) in terms of vibration and generates an electromotive force in a non-contact state with the coils (39), and a motor (43) that drives the magnet section, and thus a wiring that supplies electric power to the barrel platform (50) does not have to be used. Accordingly, vibration that has been propagated to the barrel platform through the wiring can be precluded.

Abstract translation: 通过使用发电机（38）产生电力，发电机（38）配备有：线圈单元（38A），其布置在桶形平台（50）上并且包含线圈（39）; 和磁体单元（38B），所述磁体单元（38B）在振动方面具有布置在与所述镜筒平台（50）分离的柱体（30）的突出部分（33a）上的磁体部分（44），并且以非磁性方式产生电动势， 不需要使用与线圈（39）的接触状态和驱动磁体部的电动机（43），因此不需要使用向筒状平台（50）供给电力的配线。 因此，可以排除已经通过布线传播到桶形平台的振动。