Abstract:
This disclosure provides methods and apparatuses for annealing an oxide semiconductor in a thin film transistor (TFT). In one aspect, the method includes providing a substrate with a partially fabricated TFT structure formed on the substrate. The partially fabricated TFT structure can include an oxide semiconductor layer and a dielectric oxide layer on the oxide semiconductor layer. The oxide semiconductor layer is annealed by heating the dielectric oxide layer with an infrared laser under ambient conditions to a temperature below the melting temperature of the oxide semiconductor layer. The infrared laser radiation can be substantially absorbed by the dielectric oxide layer and can remove unwanted defects from the oxide semiconductor layer at an interface in contact with the dielectric oxide layer.
Abstract:
A display apparatus comprising an array of electromechanical display elements and a driver circuit coupled to the array is provided. The driver circuit is configured to apply a DC voltage to a first stationary electrode of the display element and adjust a bias voltage applied to a second stationary electrode of the display element from a first bias voltage to a second bias voltage before a reset period. The driver circuit is further configured to apply a first reset voltage to a movable electrode of the display element during the reset period, apply a write voltage to the movable electrode during a charging period to charge the movable electrode with a charge Q defined at least in part by the write voltage, and adjust the bias voltage applied to the second stationary electrode from the second bias voltage to a third bias voltage during a bias period.
Abstract:
A display assembly includes an array of display elements disposed between a first substrate and a second substrate, the array of display elements including one or more thin film transistors (TFTs). A black mask arrangement is disposed between the first substrate and the second substrate, the black mask arrangement being configured to prevent light entering the display assembly from reaching the TFTs.
Abstract:
This disclosure provides systems, methods and apparatus for driving three-terminal electromechanical systems (EMS) devices. The driving systems and methods described herein include a switched capacitor charge injection circuit that is configured to isolate a single EMS device and transfer a desired amount of charge to the isolated device such that the device can be actuated to produce a desired optical, electrical or mechanical effect. The charge injection circuit can include an operational amplifier and can be connected such that the EMS device is placed in the feedback path of the operational amplifier.
Abstract:
This disclosure provides apparatus, systems and methods for an electromechanical systems (EMS) device having one or more flexible support posts. In one aspect, the EMS device includes a substrate, a stationary electrode over the substrate, one or more flexible support posts over the substrate, and a movable electrode over the stationary electrode and supported by the one or more flexible support posts. The movable electrode is configured to move across a gap between the movable electrode and the stationary electrode upon electrostatic actuation, where the one or more flexible support posts include a first organic material and can be configured to compress to permit the movable electrode to move across the gap.
Abstract:
This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for accurately positioning a movable conductive layer of a reflective display element. In one aspect, an initial position of the movable conductive layer with respect to at least one or more fixed conductive layers is sensed. A charging voltage may be determined based at least in part on the initial position. The charging voltage may be applied to the movable conductive layer.
Abstract:
This disclosure provides systems, methods and apparatus for fabricating thin film transistor (TFT) devices. In one aspect, a substrate having a source area, a drain area, and a channel area is provided. Metal cations are implanted in the oxide semiconductor layer overlying the source area and the drain area of the substrate. The metal cation implantation forms a doped n-type oxide semiconductor in the oxide semiconductor layer overlying the source area and the drain area of the substrate.
Abstract:
This disclosure provides systems, methods and apparatus for a driver circuit providing a selection of a voltage among multiple voltages at its output. In one aspect, the static power consumption of the circuit may be reduced by employing a power supply scheme that allows for a reduction in sub-threshold leakage current.
Abstract:
This disclosure provides apparatus, systems and methods for an electromechanical systems (EMS) device made of organic materials. In one aspect, the EMS device includes a stationary electrode over a substrate and a movable electrode over the stationary electrode, where the movable electrode is configured to move across a gap between the movable electrode and the stationary electrode by electrostatic actuation. One or more layers between the movable electrode and the stationary electrode may be made of polymer material. One or more layers in the EMS device may include an optical layer made of polymer material and configured to attenuate energy of light corresponding to one or more wavelength ranges. In some implementations, the optical layer may include a plurality of absorber particles in a host material that is electrically insulating.
Abstract:
This disclosure provides systems, methods and apparatus for a thin film transistor (TFT) device on a substrate. In one aspect, the TFT device includes a gate electrode, an oxide semiconductor layer, and a gate insulator between the gate electrode and the oxide semiconductor layer. The oxide semiconductor layer includes at least two metal oxides, with the two metal oxides having a varying concentration relative to one another between a lower surface and an upper surface of the oxide semiconductor layer. The TFT device also includes a source metal adjacent to a portion of the oxide semiconductor layer and a drain metal adjacent to another portion of the oxide semiconductor layer. The composition of the oxide semiconductor layer can be precisely controlled by a sequential deposition technique using atomic layer deposition (ALD).