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公开(公告)号：WO2015029004A1
公开(公告)日：2015-03-05
申请号：PCT/IL2013/050730
申请日：2013-08-28
Applicant: QUBEICON LTD. , PODVAL, Shimon
Inventor： PODVAL, Shimon
IPC: H01L25/00
CPC classification number: H01L23/13 , H01L23/49838 , H01L23/49855 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L25/0655 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05555 , H01L2224/06135 , H01L2224/131 , H01L2224/16225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48465 , H01L2224/48471 , H01L2224/48472 , H01L2224/49113 , H01L2224/49177 , H01L2224/73265 , H01L2224/81203 , H01L2224/81205 , H01L2224/81385 , H01L2924/00014 , H01L2924/15162 , H01L2924/15192 , H05K1/0204 , H05K1/117 , H05K1/141 , H05K3/3415 , H05K3/3442 , H05K2201/041 , H05K2201/09063 , H05K2201/09154 , H05K2201/09163 , H05K2201/0939 , H05K2201/09472 , Y02P70/613 , H01L2924/014 , H01L2224/32225 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
Abstract: A submount for connecting a semiconductor device to an external circuit, the submount comprising: a planar substrate formed from an insulating material and having relatively narrow edge surfaces and first and second relatively large face surfaces; at least one recess formed along an edge surface; a layer of a conducting material formed on a surface of each of the at least one recess; a first plurality of soldering pads on the first face surface configured to make electrical contact with a semiconductor device; and electrically conducting connections each of which electrically connects a soldering pad in the first plurality of soldering pads to the layer of conducting material of a recess of the at least one recess.
Abstract translation: 一种用于将半导体器件连接到外部电路的基座，所述基座包括：平面基板，由绝缘材料形成并且具有相对窄的边缘表面和第一和第二相对较大的表面; 沿着边缘表面形成的至少一个凹部; 形成在所述至少一个凹部中的每一个的表面上的导电材料层; 所述第一表面上的第一多个焊盘被配置为与半导体器件电接触; 以及导电连接，每个导电连接将所述第一多个焊盘中的焊盘电连接到所述至少一个凹部的凹部的导电材料层。
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