Abstract:
Embodiments of a communication circuit are described. This communication circuit includes an input node (212) to receive a set of data symbols and a partitioner (216) coupled to the input node. The partitioner is to divide the set of data symbols into M irregular subgroups of data symbols, a given one of which includes non-consecutive data symbols in the set of data symbols. Moreover, this given irregular subgroup of data symbols includes at least two pairs ofadjacent data symbols having different inter-data-symbol spacings in the set of data symbols. This communication circuit also includes M modulators (218-1,,218-Nl) coupled to the partitioner, where the given irregular subgroup of data symbols is coupled to a given modulator in the M modulators. Furthermore, the communication circuit includes M output nodes, where a given output node in the M output nodes is coupled to the given modulator and is to couple to an antenna element in M antenna elements (226).
Abstract:
Embodiments of the present invention include circuits and methods for improving the spectral purity of mixer circuits. In one embodiment the present invention includes mixer circuit including capacitances between sources of mixer transistors to reduce spectral impurity. In another embodiment, the present invention includes a mixer circuit including a bias circuit, the bias circuit comprising feedback loop to control the bias at the gate of mixer transistors.
Abstract:
Embodiments of the present invention include circuits and methods with wide bandwidths. In one embodiment, parasitic capacitances of the output of a first stage and the input of a second stage are included in a network. The output of the first stage is coupled to the input of the network, and the input of the second stage is coupled to an intermediate node of the network. In one embodiment, the parasitic capacitance of the second stage is the largest capacitance in the network. In another embodiment, passive networks are coupled to the outputs of a stage, and one or more current injection circuits may be used to extend the bandwidth of the circuit.
Abstract:
Reconfigurable distributed active transformers are provided. The exemplary embodiments provided allow changing of the effective number and configuration of the primary and secondary windings, where the distributed active transformer structures can be reconfigured dynamically to control the output power levels, allow operation at multiple frequency bands, maintain a high performance across multiple channels, and sustain desired characteristics across process, temperature and other environmental variations. Integration of the distributed active transformer power amplifiers and a low noise amplifier on a semiconductor substrate can also be provided.
Abstract:
Reconfigurable distributed active transformers are provided. The exemplary embodiments provided allow changing of the effective number and configuration of the primary and secondary windings, where the distributed active transformer structures can be reconfigured dynamically to control the output power levels, allow operation at multiple frequency bands, maintain a high performance across multiple channels, and sustain desired characteristics across process, temperature and other environmental variations. Integration of the distributed active transformer power amplifiers and a low noise amplifier on a semiconductor substrate can also be provided.
Abstract:
A fully integrated CMOS multi-element phased-array transmitter (transmitter)includes, in part, on-chip power amplifiers (PA) (262), with integrated output matching. The transmitter is adapted to be configured as a two-dimensional 2-by-2 array or as a one dimensional l-by-4 array. The transmitter uses a two step up-conversion architecture with an IF frequency of 4.8GHz. Double-quadrature architecture for the up-conversion stages attenuates the signal at image frequencies. The phase selectors (252, 254) in each transmitter path have independent access to all the phases of the VCO (202). The double quadrature architecture results in two sets of phase selectors for each path, one for the in-phase (1) and one for the quadrature phase (Q) of the LO signal. The phase selection is done in two stages, with the first stage determining the desired VCO differential phase pair and the next stage selecting the appropriate polarity. An on-chip Balun is used for differential to single-ended conversion.