THIN FILM TRANSISTOR
    1.
    发明申请
    THIN FILM TRANSISTOR 审中-公开
    薄膜晶体管

    公开(公告)号:WO2016073478A1

    公开(公告)日:2016-05-12

    申请号:PCT/US2015/058827

    申请日:2015-11-03

    Abstract: This application discloses a thin film transistor that includes a substrate, a gate, a source, a drain and a channel structure. Each of the source and the drain includes a respective first edge that defines a separation gap between the source and the drain, and the first edges of the source and the drain lie above and at least partially overlap the gate. The channel structure includes a top channel and a bottom channel contact. The top channel fills the separation gap between and covers the first edges of the source and the drain, and the bottom channel contact lies under the source and the drain. The top channel and the bottom channel contact have physical contact with each other near the first edges of the source and the drain, and the first edges of both the source and the drain are wrapped in the resulting channel structure.

    Abstract translation: 本申请公开了一种薄膜晶体管,其包括衬底,栅极,源极,漏极和沟道结构。 源极和漏极中的每一个包括限定源极和漏极之间的间隔的相应的第一边缘,并且源极和漏极的第一边缘位于栅极之上并且至少部分地与栅极重叠。 通道结构包括顶部通道和底部通道接触。 顶部通道填充源极和漏极的第一边缘之间的分隔间隙,并且底部通道接触位于源极和漏极下方。 顶部通道和底部通道接触件在源极和漏极的第一边缘附近彼此物理接触,并且源极和漏极的第一边缘被包裹在所得到的通道结构中。

    SUPPORT AND DETACHMENT OF FLEXIBLE SUBSTRATES
    2.
    发明申请
    SUPPORT AND DETACHMENT OF FLEXIBLE SUBSTRATES 审中-公开
    支撑和分离柔性基板

    公开(公告)号:WO2016168341A1

    公开(公告)日:2016-10-20

    申请号:PCT/US2016/027346

    申请日:2016-04-13

    CPC classification number: H01L51/003 H01L51/0097 H01L2227/326

    Abstract: This application discloses a flexible substrate device that includes a flexible substrate and a plurality of electronic devices. The flexible substrate includes a top surface and a bottom surface opposite to the top surface, and the plurality of electronic devices formed on the top surface of the flexible substrate. The bottom surface further includes one or more strong adhesion regions and one or more normal adhesion regions that are distinct from the one or more strong adhesion regions. Each of the one or more strong adhesion regions and the one or more normal adhesion regions are configured to attach to a rigid carrier with first adhesion strength and second adhesion strength, respectively. The first adhesion strength is substantially larger than the second adhesion strength. In some embodiments, the flexible substrate device is a thin film transistor (TFT) device, and the plurality of electronic devices includes a TFT array.

    Abstract translation: 本申请公开了一种柔性基板装置,其包括柔性基板和多个电子装置。 柔性基板包括顶表面和与顶表面相对的底表面,以及形成在柔性基板的顶表面上的多个电子器件。 底表面还包括一​​个或多个强粘附区域和一个或多个不同于一个或多个强粘附区域的正常粘附区域。 一个或多个强粘附区域和一个或多个正常粘合区域中的每一个被分别构造成分别以第一粘合强度和第二粘合强度附着到刚性载体。 第一粘合强度基本上大于第二粘合强度。 在一些实施例中,柔性衬底器件是薄膜晶体管(TFT)器件,并且多个电子器件包括TFT阵列。

    MANUFACTURING APPARATUS FOR FLEXIBLE ELECTRONICS
    3.
    发明申请
    MANUFACTURING APPARATUS FOR FLEXIBLE ELECTRONICS 审中-公开
    柔性电子制造设备

    公开(公告)号:WO2016200991A1

    公开(公告)日:2016-12-15

    申请号:PCT/US2016/036511

    申请日:2016-06-08

    Abstract: This application discloses a method of forming a flexible substrate using a detachment apparatus. The flexible substrate includes a debonding region, and one or more edge regions located in proximity to one or more edges of the flexible substrate. The detachment apparatus detaches the one or more edge regions of the flexible substrate from a rigid carrier that is configured to support the flexible substrate device, and detach the debonding region of the flexible substrate from the rigid carrier to which a bottom surface of the debonding region is configured to adhere. Specifically, the detachment apparatus detaches the debonding region by contacting the top surface of the flexible substrate at a plurality of suction locations located on the debonding region of the flexible substrate, and applying detachment force at the plurality of suction locations to peel the flexible substrate off the rigid carrier.

    Abstract translation: 本申请公开了使用分离装置形成柔性基板的方法。 柔性基板包括剥离区域和位于柔性基板的一个或多个边缘附近的一个或多个边缘区域。 分离装置将柔性基板的一个或多个边缘区域从构造成支撑柔性基板装置的刚性载体分离,并将柔性基板的脱粘区域从脱粘区域的底表面的刚性载体上分离 被配置为粘贴。 具体地,分离装置通过在位于柔性基板的脱粘区域的多个吸引位置处接触柔性基板的顶表面并且在多个抽吸位置处施加分离力以将柔性基板剥离以去除脱粘区域 刚性载体。

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