THIN FILM TRANSISTOR ARRAY PANEL AND CONDUCTING STRUCTURE
    2.
    发明申请
    THIN FILM TRANSISTOR ARRAY PANEL AND CONDUCTING STRUCTURE 审中-公开
    薄膜晶体管阵列面板和导电结构

    公开(公告)号:WO2017121211A1

    公开(公告)日:2017-07-20

    申请号:PCT/CN2016/108892

    申请日:2016-12-07

    Abstract: A thin film transistor array panel includes a first conductive layer (102) including a gate electrode; a channel layer (104) disposed over the gate; and a second conductive layer (105) disposed over the channel layer (104). The second conductive layer (105) includes a multi-layered portion defining a source electrode (105a) and a drain electrode (105b), which includes a first sub-layer (105-1), a second sub-layer (105-2), and a third sub-layer (105-3) sequentially disposed one over another. Both the third and the first sub-layers (105-3, 105-1) include indium and zinc oxide materials. An indium to zinc content ratio in the first sub-layer (105-1) is greater than that in the third sub-layer (105-3). The content ratio differentiation between the first and the third sub-layers (105-1, 105-3) affects a lateral etch profile associated with a gap (106) generated in the second conductive layer (105) between the source and the drain electrodes (105a, 105b), where the associated gap (106) width in the third sub-layer (105-3) is wider than that in the first sub-layer (105-1).

    Abstract translation: 薄膜晶体管阵列面板包括:第一导电层(102),其包括栅电极; 布置在所述栅极上方的沟道层(104) 和设置在沟道层(104)上的第二导电层(105)。 第二导电层(105)包括限定源电极(105a)和漏电极(105b)的多层部分,其包括第一子层(105-1),第二子层(105-2) )和第三子层(105-3),其顺序地一个在另一个之上。 第三和第一子层(105-3,105-1)都包括铟和氧化锌材料。 第一子层(105-1)中的铟与锌的含量比大于第三子层(105-3)中的铟与锌的含量之比。 第一和第三子层(105-1,105-3)之间的含量比例区分影响与源极和漏极之间的第二导电层(105)中产生的间隙(106)相关的横向蚀刻轮廓 (105a,105b),其中第三子层(105-3)中的相关间隙(106)宽度比第一子层(105-1)中的宽度更宽。

    BUTTED BODY CONTACT FOR SOI TRANSISTOR
    6.
    发明申请
    BUTTED BODY CONTACT FOR SOI TRANSISTOR 审中-公开
    SOI晶体管的受控体接触

    公开(公告)号:WO2017087035A1

    公开(公告)日:2017-05-26

    申请号:PCT/US2016/039894

    申请日:2016-06-28

    Abstract: Systems, methods, and apparatus for an improved body tie construction that produces all the benefits of conventional body tie (H-gate, T-gate), without the limitations and degradations associated with those constructions are described. The improved body tie construction is configured to have a lower resistance body tie when the transistor is "off" (Vg approximately 0 volts). When the transistor is "on" (Vg>Vt), the resistance to the body tie is much higher, reducing the loss of performance associated with presence of body tie.

    Abstract translation: 描述了用于改进身体领带结构的系统,方法和装置,其产生了常规身体领带(H型门,T型门)的所有优点,而没有与这些结构相关的限制和降级 。 当晶体管“断开”时,改进的体连系结构被配置为具有较低的电阻体连结。 (Vg大约0伏)。 当晶体管“接通”时, (Vg> Vt)时,对身体系带的抵抗力要高得多,减少了与身体系带相关的性能损失。

    THIN FILM TRANSISTOR
    8.
    发明申请
    THIN FILM TRANSISTOR 审中-公开
    薄膜晶体管

    公开(公告)号:WO2016073478A1

    公开(公告)日:2016-05-12

    申请号:PCT/US2015/058827

    申请日:2015-11-03

    Abstract: This application discloses a thin film transistor that includes a substrate, a gate, a source, a drain and a channel structure. Each of the source and the drain includes a respective first edge that defines a separation gap between the source and the drain, and the first edges of the source and the drain lie above and at least partially overlap the gate. The channel structure includes a top channel and a bottom channel contact. The top channel fills the separation gap between and covers the first edges of the source and the drain, and the bottom channel contact lies under the source and the drain. The top channel and the bottom channel contact have physical contact with each other near the first edges of the source and the drain, and the first edges of both the source and the drain are wrapped in the resulting channel structure.

    Abstract translation: 本申请公开了一种薄膜晶体管,其包括衬底,栅极,源极,漏极和沟道结构。 源极和漏极中的每一个包括限定源极和漏极之间的间隔的相应的第一边缘,并且源极和漏极的第一边缘位于栅极之上并且至少部分地与栅极重叠。 通道结构包括顶部通道和底部通道接触。 顶部通道填充源极和漏极的第一边缘之间的分隔间隙,并且底部通道接触位于源极和漏极下方。 顶部通道和底部通道接触件在源极和漏极的第一边缘附近彼此物理接触,并且源极和漏极的第一边缘被包裹在所得到的通道结构中。

    AMOLED背板的制作方法
    9.
    发明申请

    公开(公告)号:WO2016070505A1

    公开(公告)日:2016-05-12

    申请号:PCT/CN2015/072350

    申请日:2015-02-06

    Inventor: 徐源竣

    Abstract: 提供一种AMOLED背板的制作方法,在图案化第一金属层形成第一栅极(61)、第二栅极(63)及电极板(65)后,以图案化的第一金属层为遮蔽层对图案化的多晶硅层进行N型轻掺杂;再沉积绝缘层(7),对绝缘层(7)进行非等向性蚀刻,形成阻隔物(71),以图案化的第一金属层与阻隔物(71)为遮蔽层对图案化的多晶硅层进行N型重掺杂,从而在第一栅极(61)的两侧于阻隔物(71)的正下方形成轻掺杂漏极区域(N-),能够使得开关TFT沟道区域两侧的轻掺杂漏极区域(N-)对称,可缩短轻掺杂漏极区域(N-)的长度,增大导通电流,有效降低光电流,且节省一道光罩,降低成本。

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