Abstract:
The invention includes supercapacitors and methods of making supercapacitor by fabricating transition metal dichalcogenide (MX 2 ) layers using a combination of magnetron sputtering followed by chemical vapor deposition.
Abstract:
A thin film transistor array panel includes a first conductive layer (102) including a gate electrode; a channel layer (104) disposed over the gate; and a second conductive layer (105) disposed over the channel layer (104). The second conductive layer (105) includes a multi-layered portion defining a source electrode (105a) and a drain electrode (105b), which includes a first sub-layer (105-1), a second sub-layer (105-2), and a third sub-layer (105-3) sequentially disposed one over another. Both the third and the first sub-layers (105-3, 105-1) include indium and zinc oxide materials. An indium to zinc content ratio in the first sub-layer (105-1) is greater than that in the third sub-layer (105-3). The content ratio differentiation between the first and the third sub-layers (105-1, 105-3) affects a lateral etch profile associated with a gap (106) generated in the second conductive layer (105) between the source and the drain electrodes (105a, 105b), where the associated gap (106) width in the third sub-layer (105-3) is wider than that in the first sub-layer (105-1).
Abstract:
A thin film transistor, a thin film transistor array substrate, and a display apparatus, and their fabrication methods. The thin film transistor is formed by forming a source and drain electrode structure(170). To form the source and drain electrode structure(170), at least one metal film(177) is formed using a target of a metal element in a sputtering chamber. A gas is introduced in the sputtering chamber to in-situ react with the metal element to form an anti-reflection layer(179) over the at least one metal film(177).
Abstract:
Systems, methods, and apparatus for an improved body tie construction that produces all the benefits of conventional body tie (H-gate, T-gate), without the limitations and degradations associated with those constructions are described. The improved body tie construction is configured to have a lower resistance body tie when the transistor is "off" (Vg approximately 0 volts). When the transistor is "on" (Vg>Vt), the resistance to the body tie is much higher, reducing the loss of performance associated with presence of body tie.
Abstract:
This application discloses a thin film transistor that includes a substrate, a gate, a source, a drain and a channel structure. Each of the source and the drain includes a respective first edge that defines a separation gap between the source and the drain, and the first edges of the source and the drain lie above and at least partially overlap the gate. The channel structure includes a top channel and a bottom channel contact. The top channel fills the separation gap between and covers the first edges of the source and the drain, and the bottom channel contact lies under the source and the drain. The top channel and the bottom channel contact have physical contact with each other near the first edges of the source and the drain, and the first edges of both the source and the drain are wrapped in the resulting channel structure.