Abstract:
본 발명은 산화아연(ZnO)에 격자 정합된 자외선용 단결정 ZnMgAlO 박막 및 그 제조방법으로서, ZnO 기판을 준비하고, 산화 마그네슘(MgO)과 알루미나(Al 2 O 3 )의 혼합비가 5.5~5.7 : 1인 ZnMgAlO 박막을 스퍼터링 기법을 통해 상기 ZnO 기판 상에 성장시킴으로써, 격자 상수(원자 면간 거리)가 일치하면서도 자외선 영역에서 사용할 수 있으며 에너지 밴드 갭이 큰 ZnMgAlO 박막을 얻을 수 있다.
Abstract translation:本发明涉及与氧化锌(ZnO)晶格匹配的用于紫外线的单晶ZnMgAlO薄膜及其制备方法。 可以得到ZnMgAlO薄膜,其可以在紫外线的范围内使用,并且通过制备ZnO衬底与晶格参数(原子晶面间距)一致而具有大的能带隙,并且生长具有 通过溅射在ZnO衬底上的氧化镁(MgO)和氧化铝(Al 2 O 3)的混合比为5.5-5.7:1。
Abstract:
A method for forming a gallium nitride crystal sheet. According to the method a metal melt, including gallium, is brought to a vacuum of 0.01 Pa or lower and is heated to a growth temperature of between approximately 860oC and approximately 870oC. A nitrogen plasma is applied to the surface of the melt at a sub-atmospheric working pressure, until a gallium nitride crystal sheet is formed on top. Preferably, the growth temperature is of 863oC, and the working pressure is within the range of 0.05 Pa and 2.5 Pa. According to a preferred embodiment, application of the plasma includes introducing nitrogen gas to the metal melt at the working pressure, igniting the gas into plasma, directing the plasma to the surface of the metal melt, until gallium nitride crystals crystallize thereon, and maintaining the working pressure and the directed plasma until a gallium nitride crystal sheet is formed.
Abstract:
A one-step and room-temperature process for depositing nanoparticles or nanocomposite (nanoparticle-assembled) films of metal oxides such as crystalline titanium dioxide (TiO 2 ) onto a substrate surface using ultrafast pulsed laser ablation of Titania or metal titanium target. The system includes a pulsed laser with a pulse duration ranging from a few femtoseconds to a few tens of picoseconds, an optical setup for processing the laser beam such that the beam is focused onto the target surface with an appropriate average energy density and an appropriate energy density distribution, and a vacuum chamber in which the target and the substrate are installed and background gases and their pressures are appropriately adjusted.
Abstract:
코어/쉘 구조를 갖는 열전 나노와이어의 제조 방법이 개시된다. 상기 열전나노와이어의 제조 방법은, 일면에 산화층이 형성된 기판을 마련하고, 상기 산화층 상에 Bi 박막을 형성하는 단계; 상기 Bi 박막을 형성하는 단계에서 생성된 구조물 을 열처리하여, 상기 기판, 상기 산화층 및 상기 Bi 박막 사이의 팽창계수 차이에 따른 압축응력을 유도하여 상기 Bi 박막 상면에 Bi 단결정 나노와이어를 성장시 키는 단계; 및 상기 나노와이어가 성장된 구조물의 기판을 저온 냉각시키고, 상기 저온 냉각이 이루어지는 상태에서 상기 Bi 단결정 나노와이어 상에 열전재료를 스 퍼터링함으로써 Bi/열전재료의 코어/쉘 구조를 갖는 열전 나노와이어를 제조하는 단계를 포함한다.
Abstract:
The present invention provides a vapour deposition process for the preparation of a chemical compound, wherein the process comprises providing each component element of the chemical compound as a vapour, and co-depositing the component element vapours on a common substrate, wherein: the vapour of at Ieast one component element is provided using a cracking source; the vapour of at least one other component element is provided using a plasma source; and at Ieast one further component element vapour is provided; wherein the component elements react on the substrate to form the chemical compound.
Abstract:
A one-step and room-temperature process for depositing nanoparticles or nanocomposite (nanoparticle-assembled) films of metal oxides such as crystalline titanium dioxide (TiO 2 ) onto a substrate surface using ultrafast pulsed laser ablation of Titania or metal titanium target. The system includes a pulsed laser with a pulse duration ranging from a few femtoseconds to a few tens of picoseconds, an optical setup for processing the laser beam such that the beam is focused onto the target surface with an appropriate average energy density and an appropriate energy density distribution, and a vacuum chamber in which the target and the substrate are installed and background gases and their pressures are appropriately adjusted.
Abstract:
An apparatus and process for fast epitaxial deposition of compound semiconductor layers includes a low-energy, high-density plasma generating apparatus for plasma enhanced vapor phase epitaxy. The process provides in one step, combining one or more metal vapors with gases of non-metallic elements in a deposition chamber. Then highly activating the gases in the presence of a dense, low-energy plasma. Concurrently reacting the metal vapor with the highly activated gases and depositing the reaction product on a heated substrate in communication with a support immersed in the plasma, to form a semiconductor layer on the substrate. The process is carbon-free and especially suited for epitaxial growth of nitride semiconductors at growth rates up to 10 nm/s and substrate temperatures below 1000°C on large-area silicon substrates. The process requires neither carbon-containing gases nor gases releasing hydrogen, and in the absence of toxic carrier or reagent gases, is environment friendly.