Abstract:
A lubricant composition for use in the bonded-abrasive polishing of magnetic heads. It comprises 100 parts by mass of a hydrocarbon solvent and, incorporated therein, 0.001-4.999 parts by mass of an organic onium salt, e.g., tetraoctylammonium bis(trifluoromethanesulfonyl)imide, and 0.001-4.999 parts by mass of a C 8-25 fatty acid, the sum of the organic onium salt and the fatty acid being 0.01-5 parts by mass. With the lubricant composition, sufficient productivity can be maintained in the step of finish polishing of magnetic heads without arousing the breaking or reliability decrease caused by static buildup.
Abstract:
The present invention provides a composition for chemical-mechanical polishing which comprises at least one abrasive particle having a surface at least partially coated by a activator. The activator comprises a metal other than a metal of Group 4(b), Group 5(b) or Group 6(b). The composition further comprises at least one oxidizing agent. The composition is believed to be effective by virtue of the interaction between the activator coated on the surface of the abrasive particles and the oxidizing agent, at the activator surface, to form free radicals. The invention further provides a method that employs the composition in the polishing of a feature or layer, such as a metal film, on a substrate surface. The invention additionally provides a substrate produced this method.
Abstract translation:一种磁头用基材,由含有60-70质量%Al2O3和30-40质量%TiCXOYNZ(其中X,Y和Z满足0.5 = X = 0.993,0.005 = Y = 0.30,0.002 = Z = 0.20和0.507 = X + Y + Z = 1)。 在烧结体的一部分中,存在于长度为10μm以上的任何直线上存在的TiCXOYNZ晶粒数量的比例为55-75%,基于存在于管线上的Al 2 O 3晶粒数和 TiCXOYNZ晶粒的晶粒。 还提供有:从磁头基板获得的磁头; 以及采用磁头的记录媒体驱动。
Abstract:
An electrical lap guide (ELG) system and method are disclosed for use in lapping a bar (10) of magnetic transducer carrying sliders to a desired transducer height. A first ELG (ELG1) contained within the bar has at least two first ELG resistive elements (R11, R12). A second ELG (ELG2) contained within the bar has at least two second ELG resistive elements (R21, R23). A first of the at least two first ELG resistive elements is electrically coupled to a first of the at least two second ELG resistive elements to thereby reduce a total number of leads needed between a data acquisition unit (100) and the bar (10) during lapping. The reduction in required data acquisition unit (100) leads (L) allows more ELGs to be included on each bar (10) in order to more accurately control the lapping process
Abstract:
Systems and methods are provided for manufacturing magneto-resistive devices utilized in magneto-resistive read elements by depositing a plurality of rows of magnetic transducers on a wafer. The wafer may then be diced/cut into bars of active device regions for incorporation into a magnetic recording head. Sampling of a subset of bars from one or more bar sections of the wafer may be processed to obtain feedback associated with magnetic erase width (MEW). An air bearing surface (ABS) tilt angle based on the MEW feedback may then be applied to the one or more bar sections of the wafer during subsequent processing to optimize the magnetic performance of each resulting magneto-resistive device.
Abstract:
Articles that include a magnetic structure; an intermediate layer, the intermediate layer positioned on the magnetic structure, the intermediate layer having a thickness from about 3 Å to about 50 Å, the intermediate layer including a bottom interface layer, the bottom interface layer positioned adjacent the magnetic structure, the bottom interface layer including atoms of a metal bonded to atoms, compounds, or both of the magnetic structure; an interlayer, the interlayer positioned on the bottom interface layer, the interlayer including oxides of the metal; and a top interface layer, the top interface layer positioned adjacent the interlayer, the top interface layer including atoms of the metal, oxides of the metal, or some combination thereof bonded to atoms or compounds of the adjacent overcoat layer; and an overcoat layer, the overcoat layer positioned on the top interface layer of the intermediate layer.