APPARATUS, SYSTEMS, AND METHODS FOR TEMPERATURE CONTROL OF SUBSTRATES USING EMBEDDED FIBER OPTICS AND EPOXY OPTICAL DIFFUSERS
    2.
    发明申请
    APPARATUS, SYSTEMS, AND METHODS FOR TEMPERATURE CONTROL OF SUBSTRATES USING EMBEDDED FIBER OPTICS AND EPOXY OPTICAL DIFFUSERS 审中-公开
    使用嵌入式光纤和环氧光学扩散器的基板温度控制的装置,系统和方法

    公开(公告)号:WO2016003633A1

    公开(公告)日:2016-01-07

    申请号:PCT/US2015/035643

    申请日:2015-06-12

    IPC分类号: H01L21/324 H01L21/683

    摘要: Substrate temperature control apparatus and electronic device manufacturing systems provide pixelated light-based heating to a substrate in a process chamber. A substrate holder in the process chamber may include a baseplate. The baseplate has a top surface that may have a plurality of cavities and a plurality of grooves connected to the cavities. Optical fibers may be received in the grooves such that each cavity has a respective optical fiber terminating therein to transfer light thereto. Some or all of the cavities may have an epoxy optical diffuser disposed therein to diffuse light provided by the optical fiber. A ceramic plate upon which a substrate may be placed may be bonded to the baseplate. A thermal spreader plate may be provided between the baseplate and the ceramic plate. Methods of controlling temperature across a substrate holder in an electronic device manufacturing system are also provided, as are other aspects.

    摘要翻译: 基板温度控制装置和电子装置制造系统向处理室中的基板提供像素化的基于光的加热。 处理室中的衬底保持器可以包括底板。 底板具有可以具有多个空腔的顶表面和连接到空腔的多个凹槽。 光纤可以被容纳在槽中,使得每个空腔具有终止于其中的相应光纤以将光传送到其上。 一些或所有空腔可以具有设置在其中的环氧光学漫射器以漫射由光纤提供的光。 可以在其上放置基板的陶瓷板可以结合到基板。 可以在基板和陶瓷板之间设置散热板。 还提供了在电子设备制造系统中控制衬底保持器温度的方法,以及其他方面。

    HEATING ELEMENT WITH A LAYER OF RESISTIVE MATERIAL LOCALLY CONFIGURED TO OBTAIN PREDETERMINED SHEET RESISTANCE
    4.
    发明申请
    HEATING ELEMENT WITH A LAYER OF RESISTIVE MATERIAL LOCALLY CONFIGURED TO OBTAIN PREDETERMINED SHEET RESISTANCE 审中-公开
    具有局部配置的电阻材料层的加热元件可以获得预测的电阻

    公开(公告)号:WO2015097219A1

    公开(公告)日:2015-07-02

    申请号:PCT/EP2014/079157

    申请日:2014-12-23

    IPC分类号: H05B3/34

    摘要: The invention concerns a heating element (1) for generating heat when connected to an electrical power source, comprising a substrate supporting first and second feedline (2, 2a) extending generally along opposite sides of the element (1), each feedline comprising an electrical contact point to the source, each feedline (2, 2a) distributing the power supply along it, an intermediate substrate part (3) sandwiched between the two feedlines (2, 2a) supporting a layer of resistive material, a current flowing from one feedline (2) to the other feedline (2a) in operation through the layer and dissipating heat. The layer is in the form of a pattern applied on the substrate part (3) and configured so that the sheet resistance thus locally obtained varies continuously over the intermediate substrate part (3) in correspondence to a respective predetermined sheet resistance in order to achieve a desired temperature distribution over the heating element (1).

    摘要翻译: 本发明涉及一种用于当连接到电源时产生热量的加热元件(1),包括支撑基本上沿元件(1)的相对侧延伸的第一和第二馈线(2,2a)的基板,每个馈线包括电 接触点到源,沿其分配电源的每个馈线(2,2a),夹在支撑一层电阻材料的两个馈线(2,2a)之间的中间衬底部分(3),从一个馈线 (2)通过该层运行到另一个馈线(2a)并消散热量。 所述层是施加在基板部分(3)上的图案的形式,并且构造成使得局部获得的薄层电阻相应于相应的预定薄层电阻在中间基板部分(3)上连续地变化,以便实现 在加热元件(1)上所需的温度分布。

    KOCHFELDVORRICHTUNG
    5.
    发明申请
    KOCHFELDVORRICHTUNG 审中-公开
    HOB DEVICE

    公开(公告)号:WO2015087208A1

    公开(公告)日:2015-06-18

    申请号:PCT/IB2014/066576

    申请日:2014-12-04

    IPC分类号: H05B6/06 H05B1/02

    摘要: Um eine gattungsgemäße Vorrichtung mit verbesserten Eigenschaften hinsichtlich einer vorteilhaften Erhitzung bereitzustellen, wird eine Kochfeldvorrichtung (10), insbesondere eine Induktionskochfeldvorrichtung, mit einem Heizbereich (12), der zu einem Erhitzen von aufgestelltem Gargeschirr (14) und/oder aufgelegtem Gargut vorgesehen ist, und mit einer Steuereinheit (16) vorgeschlagen, die dazu vorgesehen ist, wenigstens einen Teilbereich (18a-f) des Heizbereichs (12) in wenigstens einem Betriebszustand als zumindest ein Solltemperatur-Feld zu betreiben und unterschiedlichen Positionen des zumindest einen Solltemperatur-Felds unterschiedliche Solltemperaturen zuzuordnen.

    摘要翻译: 为了有利的加热,烹饪装置(10),特别是电磁炉的装置提供一种通用的设备具有改进的性能相对于,包括加热区(12)的加热竖立的烹饪容器(14)和/或钩的食物被提供,并且 提出了意在至少一个操作状态操作的至少一部分的加热区(12)的(图18a-f)和至少一个目标温度场和向其分配至少一个目标温度场不同的设定温度的不同位置的控制单元(16) ,

    MULTIREGION HEATED EYE SHIELD
    6.
    发明申请
    MULTIREGION HEATED EYE SHIELD 审中-公开
    多重加热眼镜

    公开(公告)号:WO2015048564A1

    公开(公告)日:2015-04-02

    申请号:PCT/US2014/057887

    申请日:2014-09-26

    IPC分类号: A42B3/24

    摘要: Eye shield device adapted for fog prevention for use in a ski goggle, dive mask, medical or testing face shield or the like, while preventing undesirable hot spots on the eye shield, comprising an optically-transparent substrate, a plurality of conductive regions defined on the substrate and connected to a powered circuit of one or more channels. The regions on the substrate are electrically isolated from each other in a first embodiment, and the regions on the substrate are not electrically isolated, or contiguous with adjacent regions on the substrate, in a second embodiment. The regions may be uniformly-sized or of varying sizes and shapes from one region to the next region, and resistivity per square of heating material applied to the regions may be selected based on formulation of the heating material and/or thickness of the heating material.

    摘要翻译: 适用于防雾用于防滑镜,潜水面罩,医疗或测试面罩等的防护眼装置,同时防止眼罩上的不希望的热点,包括光学透明基底,多个导电区域 基板并连接到一个或多个通道的供电电路。 在第二实施例中,衬底上的区域在第一实施例中彼此电隔离,并且衬底上的区域不是电隔离的,或者与衬底上的相邻区域邻接。 这些区域可以从一个区域到下一个区域的尺寸和形状均匀地变化,并且可以基于加热材料的配方和/或加热材料的厚度来选择施加到该区域的加热材料的每平方的每个电阻率 。

    DEVICE FOR HEATING PREFORM BODIES OR FLAT OR PREFORMED SEMI-FINISHED PRODUCTS FROM THERMOPLASTIC MATERIAL
    7.
    发明申请
    DEVICE FOR HEATING PREFORM BODIES OR FLAT OR PREFORMED SEMI-FINISHED PRODUCTS FROM THERMOPLASTIC MATERIAL 审中-公开
    设备技术预制坯坯体加热或持平或预制的半成品热塑性

    公开(公告)号:WO2015000748A3

    公开(公告)日:2015-04-02

    申请号:PCT/EP2014063293

    申请日:2014-06-24

    IPC分类号: B29C49/64 B29C35/02 B29C51/42

    摘要: The invention relates to a device for heating preform bodies or flat or preformed semi-finished products from thermoplastic material (3), comprising at least one base body (1.0, 2.0), on the surface of which at least a first layer or coating is formed, which comprises at least one electric heating resistor in the form of a flat, geometrically arranged conductor loop. The base body also has contact elements, by which the at least one heating resistor can be connected to a power source, wherein, as a result of the geometrically arranged conductor loop(s), a defined temperature profile can be generated, which can be transmitted contactlessly to the preform body or the semi-finished product by an outer contact layer formed on the first layer or coating, by contact with the surface of a preform body or semi-finished product and/or by using convection or thermal radiation. During a transmission of the defined temperature profile, the preform body or the semi-finished product is arranged at a distance to the contact layer(s).

    摘要翻译: 设备,用于由热塑性材料(3)的预型件体或平的或预成形的半成品的加热,与至少一个基体(1.0,2.0),在其表面上的至少一个第一层或涂层形成,在平坦的几何形式的至少一个电加热电阻 具有布置导体回路。 所述基体还包括接触元件,通过该至少一个加热电阻器连接到电源,由于几何上布置导体环(一个或多个)被限定的温度分布而产生,与形成在第一层或涂层接触层上的外部,通过接触该 的预成型体,或半成品和/或利用对流或热辐射的表面可以被转移到预成型件主体,或半成品接触,其中,在在/接触层(多个)的一个距离的预成型件主体或半成品的限定的温度分布的传输布置 是。

    KOCHFELDVORRICHTUNG
    8.
    发明申请
    KOCHFELDVORRICHTUNG 审中-公开
    HOB DEVICE

    公开(公告)号:WO2015015360A1

    公开(公告)日:2015-02-05

    申请号:PCT/IB2014/063204

    申请日:2014-07-18

    IPC分类号: H05B6/06 H05B6/12 H05B3/68

    摘要: Die Erfindung geht aus von einer Kochfeldvorrichtung (10), insbesondere einer Induktionskochfeldvorrichtung, mit zumindest einer Heizanordnung (26), die zumindest zwei Heizelemente (12) aufweist, die nebeneinander angeordnet und zumindest zu einem Erhitzen von aufgestelltem Gargeschirr (14) vorgesehen sind, und mit zumindest einer Steuereinheit (16). Um eine gattungsgemäße Vorrichtung mit verbesserten Eigenschaften hinsichtlich eines hohen Komforts für einen Bediener bereitzustellen, wird vorgeschlagen, dass die Steuereinheit (16) dazu vorgesehen ist, zumindest in einem Betriebsmodus in Abhängigkeit von einer Größe zumindest eines aufgestellten Gargeschirrs (14) eine Anzahl an virtuellen Heizzonen (18) mit unterschiedlicher Heizleistungsdichte festzulegen, wobei die virtuellen Heizzonen (18) von nebeneinander angeordneten Heizelementen (12) gebildet sind, die von ihrer Anzahl und/oder Größe zu einem Betreiben des Gargeschirrs (14) geeignet sind.

    摘要翻译: 本发明是基于一个炉灶装置(10)上,在具有与至少一个加热器组件(26)特别是电磁炉的装置中的至少两个加热元件(12)并排布置,并在加热竖立的烹饪容器(14)至少提供,并 与至少一个控制单元(16)。 为了提供一个通用的设备具有改进的特性相对于一高舒适用于操作者建议,所述控制单元(16)被提供,至少在一个操作模式下响应于一个尺寸至少一个已建立Gargeschirrs(14)多个虚拟的加热区的 组(18)具有不同的加热功率密度,形成并置的加热元件(12)的虚拟的加热区(18),其适合通过它们的数量和/或尺寸给Gargeschirrs(14)的操作。

    HEATING PLATE WITH PLANAR HEATER ZONES FOR SEMICONDUCTOR PROCESSING
    10.
    发明申请
    HEATING PLATE WITH PLANAR HEATER ZONES FOR SEMICONDUCTOR PROCESSING 审中-公开
    加热板用于半导体加工的平面加热区

    公开(公告)号:WO2012064543A1

    公开(公告)日:2012-05-18

    申请号:PCT/US2011/058590

    申请日:2011-10-31

    发明人: SINGH, Harmeet

    IPC分类号: H01L21/3065

    摘要: Abstract A heating plate for a substrate support assembly in a semiconductor plasma processing apparatus, comprises multiple independently controllable planar heater zones arranged in a scalable multiplexing layout, and electronics to independently control and power the planar heater zones. Each planar heater zone includes one or more heater elements made of an insulator-conductor composite. A substrate support assembly in which the heating plate is incorporated includes an electrostatic clamping electrode and a temperature controlled base plate. Methods for manufacturing the heating plate include bonding together ceramic sheets having planar heater zones, power supply lines, power return lines and vias.

    摘要翻译: 摘要:一种用于半导体等离子体处理装置中的基板支撑组件的加热板,包括以可伸缩复用布局布置的多个可独立控制的平面加热器区域,以及用于独立地控制和供电平面加热器区域的电子装置 每个平面加热器区域包括由绝缘体 - 导体复合材料制成的一个或多个加热器元件。 其中结合加热板的基板支撑组件包括静电夹持电极和温度控制的基板。 制造加热板的方法包括将具有平面加热区,电源线,电源返回线和通孔的陶瓷片接合在一起。