公开(公告)号：WO2017172203A1

公开(公告)日：2017-10-05

申请号：PCT/US2017/020147

申请日：2017-03-01

Applicant: INTEL CORPORATION

Inventor： YONG, Khang Choong ,  HALL, Stephen H. ,  CHUAH, Tin Poay ,  KOH, Boon Ping ,  GOH, Eng Huat

IPC: H05K9/00

CPC classification number: H05K1/147 ,  G06K9/0002 ,  H01L25/18 ,  H05K1/0218 ,  H05K1/181 ,  H05K3/363 ,  H05K9/0024 ,  H05K2201/047 ,  H05K2201/056 ,  H05K2201/10159

Abstract: Three-dimensional (3-D) volumetric board architectural design provides technical solutions to technical problems facing miniaturization of circuit boards. The 3-D volumetric architecture includes using more of the unused volume in the vertical dimension (e.g., Z-dimension) to increase the utilization of the total circuit board volume. The 3-D volumetric architecture is realized by mounting components on a first PCB and on a second PCB, and inverting and suspending the second PCB above the first PCB. The use of 3-D volumetric board architectural design further enables formation of a shielded FEMIE, providing shielding and improved volumetric use with little or no reduction in system performance or increase in system Z-height.

Abstract translation: 三维（3-D）体积电路板架构设计为面向电路板小型化的技术问题提供技术解决方案。 三维立体体系结构包括在垂直维度中使用更多未使用的体积（例如，Z维度）以增加总电路板体积的利用率。 三维体积架构是通过将组件安装在第一PCB和第二PCB上以及倒置并悬挂第一PCB上方的第二PCB来实现的。 使用3D体积电路板架构设计可以进一步形成屏蔽FEMIE，从而提供屏蔽和改进的体积使用，而系统性能几乎没有降低或系统Z高度增加。

公开(公告)号：WO2013162844A1

公开(公告)日：2013-10-31

申请号：PCT/US2013/035188

申请日：2013-04-04

Applicant: 3M INNOVATIVE PROPERTIES COMPANY ,  GUNDEL, Douglas B. ,  KHAN, Zulfiqar A. ,  BARR, Alexander W. ,  NEU, Steven A.

Inventor： GUNDEL, Douglas B. ,  KHAN, Zulfiqar A. ,  BARR, Alexander W. ,  NEU, Steven A.

IPC: H05K1/02 ,  H04B5/00 ,  H05K1/14

CPC classification number: H04B1/40 ,  G02B6/4279 ,  H04B1/3827 ,  H04B5/0037 ,  H04B5/0075 ,  H04B7/0413 ,  H04B10/803 ,  H05K1/0239 ,  H05K1/0243 ,  H05K1/144 ,  H05K1/18 ,  H05K3/366 ,  H05K5/0026 ,  H05K2201/042 ,  H05K2201/047 ,  H05K2201/10098 ,  H05K2201/10189

Abstract: A wireless connector includes a plurality of printed circuit boards (PCBs) (901, 902) disposed within a housing of the electronic system. Each PCB comprises a plurality of transceivers (910a, 910b, 920a, 920b) configured to wirelessly transmit and receive modulated carrier signals (910, 920). Each transceiver in the system is configured to receive signals transmitted by every other transceiver in the system.

Abstract translation: 无线连接器包括设置在电子系统的壳体内的多个印刷电路板（PCB）（901,902）。 每个PCB包括多个收发器（910a，910b，920a，920b），被配置为无线发送和接收经调制的载波信号（910,920）。 系统中的每个收发器被配置为接收系统中每个其他收发器发送的信号。

公开(公告)号：WO2011156417A2

公开(公告)日：2011-12-15

申请号：PCT/US2011/039508

申请日：2011-06-07

Applicant: SULLIVAN, Jason A.

Inventor： SULLIVAN, Jason A.

IPC: G06F1/00 ,  G06F1/20 ,  G06F13/14 ,  G06F21/00

CPC classification number: G06F1/181 ,  G06F1/1607 ,  G06F1/1626 ,  G06F1/1656 ,  G06F1/183 ,  G06F1/20 ,  G06F2200/1635 ,  H05K1/14 ,  H05K2201/047

Abstract: The present invention relates to systems and methods for providing a universal computing system. Implementations include a modular motherboard having two or more electronic circuit boards that are connected to form a motherboard. The two or more electronic circuit boards each include a security key structure on a connector for providing a keyed connector therebetween. Computing components may be provided on two of the major surfaces of the first electronic circuit board circuit board. Components are disclosed in which the computing system will not turn on unless the first printed circuit board is electrically connected to the second printed circuit board. A heat sink is disclosed that may be used in the universal computing system. A customizable encasement is disclosed. An expandable memory device is disclosed.

Abstract translation: 本发明涉及用于提供通用计算系统的系统和方法。 实现包括具有两个或多个连接以形成主板的电子电路板的模块化主板。 两个或更多个电子电路板各自包括用于在其间提供键控连接器的连接器上的安全密钥结构。 计算部件可以设置在第一电子电路板电路板的两个主表面上。 公开了其中计算系统将不会打开的组件，除非第一印刷电路板电连接到第二印刷电路板。 公开了可以在通用计算系统中使用的散热器。 公开了可定制的包装。 公开了一种可扩展存储器件。

公开(公告)号：WO2007116555A1

公开(公告)日：2007-10-18

申请号：PCT/JP2006/321937

申请日：2006-11-02

Applicant: シャープ株式会社 ,  濱田 哲也

Inventor： 濱田 哲也

IPC: G02F1/13357 ,  F21V8/00 ,  G02F1/1345 ,  F21Y101/02

CPC classification number: G02B6/0068 ,  G02B6/0031 ,  G02B6/0073 ,  G02B6/0083 ,  G02F1/133615 ,  H05K1/189 ,  H05K2201/047 ,  H05K2201/10106 ,  H05K2201/2054

Abstract: 　配線４４を設けたフィルム４１上に、ＬＥＤ４３を列状に配置する。配線４４は、ＬＥＤ４３とコネクタ４５とを接続する。フィルム４１を、ＬＥＤ４３が設けられた領域４１ａと、配線４４が設けられた領域４１ｂの境界４１ｃで曲げ、リフレクタの内面に配置する。配線領域４１ｂのＬＥＤ４４に対向する面には反射材４６を配置する。

Abstract translation: LED（43）在配置有布线（44）的膜（41）上配置成一行。 接线（44）将LED（43）连接到连接器（45）。 薄膜（41）在布置有LED（43）的区域（41a）和形成有布线（44）的区域（41b）之间的边界（41c）处弯曲，并且放置在 反射器。 在布线区域（41b）的与LED（43）相对的表面上布置有反射材料（46）。

公开(公告)号：WO2005119737A1

公开(公告)日：2005-12-15

申请号：PCT/CA2005/000866

申请日：2005-06-03

Applicant: FUDAN UNIVERSITY ,  DING, Chuan-Fan

Inventor： DING, Chuan-Fan

IPC: H01J49/26

CPC classification number: H01J49/422 ,  H01J49/004 ,  H05K1/14 ,  H05K2201/047 ,  Y10T156/10

Abstract: An ion trap mass analyzer includes an elongated tunnel that has a wall, a longitudinal axis and an inner space. The wall includes a substrate and conductor trace patterns. There is also a variable electric potential means for providing electric potentials which is connected to the conductor trace patterns. The conductor trace patterns and the variable electric potential means provide a variable electric field within the inner space of the tunnel for transferring, storing, and analyzing ions.

Abstract translation: 离子阱质量分析器包括具有壁，纵向轴线和内部空间的细长隧道。 墙壁包括基板和导体迹线图案。 还有一个可变电位装置，用于提供连接到导体迹线图案的电位。 导体迹线图案和可变电位装置在隧道的内部空间内提供可变电场，用于转移，存储和分析离子。

公开(公告)号：WO2018101666A1

公开(公告)日：2018-06-07

申请号：PCT/KR2017/013205

申请日：2017-11-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： LEE, Wu Seong ,  KIM, Tae Kyun ,  LIM, Bae Seok ,  CHOI, Youn Hyung ,  KIM, Seung Nyun ,  YUN, Yong Sang

IPC: B64C39/02 ,  B64C27/08 ,  B64C27/12 ,  B64D47/08

CPC classification number: B64C39/024 ,  B64C2201/024 ,  B64C2201/027 ,  B64C2201/042 ,  B64C2201/108 ,  B64C2201/127 ,  B64C2201/146 ,  B64C2201/165 ,  B64D27/24 ,  B64D47/08 ,  B64D2221/00 ,  H05K1/148 ,  H05K1/181 ,  H05K2201/047 ,  H05K2201/10151

Abstract: Disclosed are a body of an unmanned aerial vehicle and an unmanned aerial vehicle including the same. The body includes a housing arranged in a first direction and including at least four housing sidewalls and an opening defined by the housing sidewalls and configured to receive a battery pack, a propeller support extending a specific distance from each housing sidewall in a second direction away from the center of the housing and perpendicular to the first direction and having, on a distal end, a motor and a propeller connected to the motor, and a PCB disposed on at least one of the housing sidewalls and associated with operating the motor and the propeller.

公开(公告)号：WO2018057196A1

公开(公告)日：2018-03-29

申请号：PCT/US2017/047962

申请日：2017-08-22

Applicant: INTEL CORPORATION

Inventor： HEPPNER, John ,  MALLIK, Debendra

IPC: H02S30/20

CPC classification number: H02S30/20 ,  H01L31/0201 ,  H01L31/0504 ,  H02J7/355 ,  H02S40/36 ,  H02S40/38 ,  H05K1/028 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/047 ,  H05K2201/10143

Abstract: A solar cell assembly includes a bendable substrate and multiple solar cells to be mounted over different surfaces of an electronic device. The bendable substrate includes an electrical contact to couple to an electrical contact on one of the surfaces of the electronic device. Thus, the electronic device only needs an electrical connection on one surface, and the solar cell assembly can mount solar cells on multiple surfaces to couple to the one electrical connection.

Abstract translation: 太阳能电池组件包括可弯曲基板和多个太阳能电池以安装在电子设备的不同表面上。 可弯曲基板包括电触点以耦合到电子设备的一个表面上的电触点。 因此，电子设备仅需要在一个表面上的电连接，并且太阳能电池组件可以将太阳能电池安装在多个表面上以耦合到一个电连接。

公开(公告)号：WO2017051282A1

公开(公告)日：2017-03-30

申请号：PCT/IB2016/055447

申请日：2016-09-13

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ,  IBM UNITED KINGDOM LIMITED ,  IBM (CHINA) INVESTMENT COMPANY LIMITED

Inventor： DANGLER, John ,  LONG, David, Clifford ,  ISAACS, Philip, Duane

IPC: G06F21/87

CPC classification number: H05K3/10 ,  G06F21/72 ,  G06F21/87 ,  H05K1/0275 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/147 ,  H05K1/167 ,  H05K3/062 ,  H05K3/366 ,  H05K2201/0352 ,  H05K2201/042 ,  H05K2201/047 ,  H05K2201/055 ,  H05K2201/09036 ,  H05K2201/09263 ,  H05K2201/10151

Abstract: Tamper-respondent electronic circuit structures, electronic assembly packages, and methods of fabrication are provided which include, at least in part, a tamper-respondent sensor. The tamper-respondent sensor includes one or more formed flexible layers of, for instance, a dielectric material, having opposite first and second sides, and circuit lines defining at least one resistive network. The circuit lines are disposed on at least one of the first side or the second side of the formed flexible layer(s). The formed flexible layer(s) with the circuit lines includes curvatures, and the circuit lines overlie, at least in part, the curvatures of the formed flexible layer(s). In certain embodiments, the formed flexible layer(s) may be one or more corrugated layers or one or more flattened, folded layers.

Abstract translation: 提供了篡改响应的电子电路结构，电子组件封装和制造方法，其至少部分地包括篡改响应传感器。 防篡改传感器包括具有相反的第一和第二侧的一个或多个形成的例如介电材料的柔性层，以及限定至少一个电阻网络的电路线。 电路线设置在所形成的柔性层的第一侧或第二侧中的至少一个上。 形成的具有电路线的柔性层包括曲率，并且电路线至少部分地覆盖所形成的柔性层的曲率。 在某些实施例中，所形成的柔性层可以是一个或多个波纹层或一个或多个扁平折叠层。

公开(公告)号：WO2011156158A1

公开(公告)日：2011-12-15

申请号：PCT/US2011/038454

申请日：2011-05-27

Applicant: CREE, INC. ,  BRANDES, George, R. ,  GARCERAN, Julio, A.

Inventor： BRANDES, George, R. ,  GARCERAN, Julio, A.

IPC: F21S2/00 ,  F21V29/00 ,  F21Y101/02

CPC classification number: F21V29/70 ,  F21K9/135 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21K9/60 ,  F21K9/64 ,  F21K9/90 ,  F21V3/049 ,  F21V3/08 ,  F21V3/12 ,  F21V23/005 ,  F21V23/02 ,  F21V29/006 ,  F21V29/506 ,  F21V29/507 ,  F21V29/51 ,  F21V29/57 ,  F21V29/677 ,  F21V29/74 ,  F21V29/83 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2107/30 ,  F21Y2107/40 ,  F21Y2115/10 ,  F21Y2115/30 ,  H05K2201/047 ,  H05K2201/10106 ,  Y10S362/80 ,  Y10T29/4913

Abstract: LED light bulbs include openings in base or cover portions, and optional forced flow elements, for convective cooling. Thermally conductive optically transmissive material may be used for cooling, optionally including fins. A LED light engine may be fabricated from a substrate via planar fabrication techniques and shaped to form a substantially rigid upright support structure. Mechanical, electrical, and thermal connections may be made between a LED light engine and a LED light bulb.

Abstract translation: LED灯泡包括底座或盖部分的开口，以及可选的强制流动元件，用于对流冷却。 导热透光材料可用于冷却，可选地包括翅片。 LED光引擎可以通过平面制造技术由衬底制造并成形为形成基本刚性的直立支撑结构。 机械，电气和热连接可以在LED光引擎和LED灯泡之间进行。

公开(公告)号：WO2009036611A1

公开(公告)日：2009-03-26

申请号：PCT/CN2007/002904

申请日：2007-10-09

Applicant: 百富计算机技术(深圳)有限公司 ,  史书宪 ,  同存良

Inventor： 史书宪 ,  同存良

IPC: H05K5/02 ,  G06F12/14

CPC classification number: H05K5/0208 ,  H05K1/0275 ,  H05K1/141 ,  H05K1/147 ,  H05K2201/047 ,  H05K2201/10151

Abstract: A security protection cover (20, 30) surrounds a protected region (14) of a protected circuit board (10) and provides protection for components within the protected region (14). The security protection cover (20, 30) includes a flexible circuit board (32) which has acceptance space with an opening on one side, the flexible circuit board (32) covers the protected region (14) of the protected circuit board (10) and surrounds the components within the protected region (14). The flexible circuit board (32) triggers the corresponding circuit to erase or destroy information in the components within the protected region (14) when being attacked physically.