公开(公告)号：WO99025162A1

公开(公告)日：1999-05-20

申请号：PCT/NL1998/000656

申请日：1998-11-12

IPC: H05K3/30 ,  H05K7/10 ,  H05K5/00

CPC classification number: H05K7/1076 ,  H05K3/305 ,  H05K3/306 ,  H05K2201/10037 ,  H05K2201/10242 ,  H05K2201/10333 ,  H05K2201/10962 ,  H05K2203/0769 ,  H05K2203/178

Abstract: Materials which are used for detachable injection moulded parts can be applied for making fast, solid and reliable connections, particularly by using easily degradable respectively soluble polymers. The materials can be adapted to other conditions, such as the prevention of chemical influencing or other kind of poisoning, the degree of electrical insulation, etc.

Abstract translation: 用于可分离注塑部件的材料可用于制造快速，牢固和可靠的连接，特别是通过使用容易降解的分别可溶性聚合物。 这些材料可以适应其他条件，如防止化学影响或其他类型的中毒，电绝缘程度等。

公开(公告)号：WO2012074963A1

公开(公告)日：2012-06-07

申请号：PCT/US2011/062313

申请日：2011-11-29

Applicant: HSIO TECHNOLOGIES, LLC ,  RATHBURN, James

Inventor： RATHBURN, James

IPC: H01R12/00

CPC classification number: H01R23/6813 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01R12/73 ,  H01R12/82 ,  H01R13/2457 ,  H01R13/2485 ,  H01R31/06 ,  H05K1/092 ,  H05K1/111 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0094 ,  H05K3/10 ,  H05K3/1291 ,  H05K3/326 ,  H05K3/363 ,  H05K3/365 ,  H05K3/4007 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/425 ,  H05K3/4694 ,  H05K7/1076 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09381 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2201/10386 ,  H05K2201/2072 ,  H05K2201/209 ,  H05K2203/041 ,  H05K2203/1476 ,  Y10T29/49165 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A surface mount electrical interconnect adapted to provide an interface between solder balls on a BGA device and a PCB. The electrical interconnect includes a socket substrate with a first surface, a second surface, and a plurality of openings sized and configured to receive the solder balls on the BGA device. A plurality of electrically conductive contact tabs are bonded to the first surface of the socket substrate so that contact tips on the contact tabs extend into the openings. The contact tips electrically couple with the BGA device when the solder balls are positioned in the openings. Vias are located in the openings that electrically couple the contact tabs to contact pads located proximate the second surface of the socket substrate. Solder balls are bonded to the contact pad that are adapted to electrically and mechanically couple the electrical interconnect to the PCB.

Abstract translation: 适于在BGA器件上的焊球和PCB之间提供界面的表面贴装电互连。 电互连包括具有第一表面，第二表面和多个开口的插座基板，其尺寸和构造用于接收BGA器件上的焊球。 多个导电接触片接合到插座衬底的第一表面，使得接触片上的接触尖端延伸到开口中。 当焊球定位在开口中时，接触尖端与BGA器件电耦合。 通孔位于开口中，其将接触片电耦合到位于插座衬底的第二表面附近的接触垫。 焊球被接合到接触焊盘上，适于电连接和机械地将电互连件耦合到PCB。

公开(公告)号：WO2002069397A2

公开(公告)日：2002-09-06

申请号：PCT/US2002/005283

申请日：2002-02-25

Applicant: SILICON BANDWIDTH INC.

Inventor： CRANE, Stanford, W., Jr. ,  JEON, Myoung-soo ,  OGATA, Charley, Takeshi ,  WANG, Ton-Yong ,  CANGELLARIS, Andreas, C. ,  SCHUTT-AINE, Jose

IPC: H01L23/00

CPC classification number: H05K7/1061 ,  H01L2924/0002 ,  H01R12/52 ,  H05K7/1076 ,  H01L2924/00

Abstract: A cluster grid array semiconductor die package and mating socket provide electrical connection between one or more semiconductor dies housed within the die package and substrate, such as a printed circuit board, on which the mating socket is mounted. The die package and the mating socket may be easily connected and disconnected. The die package may include power and ground planes built into and distributed within the housing of the die package.

Abstract translation: 集群栅格阵列半导体管芯封装和配合插座提供容纳在管芯封装内的一个或多个半导体管芯与安装有配合插座的衬底（例如印刷电路板）之间的电连接。 模具封装和配套插座可以很容易地连接和断开。 管芯封装可以包括内置在管芯封装的壳体内并分布在其中的电源和接地层。

公开(公告)号：WO1982001655A1

公开(公告)日：1982-05-27

申请号：PCT/AU1981000163

申请日：1981-11-13

Applicant: COMMW AUSTRALIA ,  DALY CHRISTOPHER N ,  MONEY DAVID K ,  PATRICK JAMES F

Inventor： COMMW AUSTRALIA

IPC: A61N01/36

CPC classification number: H05K7/1076 ,  A61B5/076 ,  A61F11/04 ,  A61F2250/0001 ,  A61N1/02 ,  A61N1/375 ,  H01R13/52 ,  H01R24/86 ,  H04R2225/67

Abstract: A connector for hearing prothesis comprising two portions (4), (9) which interfit resiliently. The outer surface of the first portion (4) carries electrical contacts (5) each of which includes a spring (6). This first portion fits into a second portion (9) which carries on its internal surface electrical contacts (16) which contact the electrical contacts (5).

Abstract translation: 一种用于听觉的连接器，包括两个弹性地相互配合的部分（4），（9）。 第一部分（4）的外表面承载各自包括弹簧（6）的电触点（5）。 该第一部分装配在第二部分（9）中，第二部分（9）承载其内表面与触点（5）接触的电触头（16）。