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    METHOD AND EQUIPMENT FOR PROCESSING ELECTRONIC WASTES
    2.
    发明申请
    METHOD AND EQUIPMENT FOR PROCESSING ELECTRONIC WASTES 审中-公开
    用于处理电子废物的方法和设备

    公开(公告)号：WO2012168744A3

    公开(公告)日：2013-04-25

    申请号：PCT/HU2012000006

    申请日：2012-01-19

    申请人： EWR HUNGARY KFT ,  SZALAY CSABA ,  KOCSIS LASZLO ,  PARTI JUDIT ,  SZLAVIK ALAJOS ,  HARTAINE FABRY MARIA ,  SZINAY ZOLTAN

    发明人： SZALAY CSABA ,  KOCSIS LASZLO ,  PARTI JUDIT ,  SZLAVIK ALAJOS ,  HARTAINE FABRY MARIA ,  SZINAY ZOLTAN

    IPC分类号： B09B3/00 ,  B03B1/00 ,  B03B9/06

    CPC分类号： B09B3/00 ,  C22B7/001 ,  H05K3/22 ,  H05K2203/178 ,  Y02P10/214 ,  Y02P10/22 ,  Y02P10/224 ,  Y02P10/236 ,  Y02P70/613 ,  Y02W30/822

    摘要： The invention relates to a method for processing electronic wastes, characterized that: . a/ grist is prepared from electronic wastes containing metals too, and the grist is heated in a reactor, preferable at 455-465 °C temperature, the vapours of the soldering metals exiting over 200 °C are lead away, precipitated with cooling, the soldering metals are recovered, the gas generated in the reactor is lead into an alkaline quencher, where it is purified, the coal portion of the heating residue remaining on the bottom of the reactor is lead away, and the polymer heating residue is treated with acidic solution, or . b/ the metals are removed from the surface of the surface of the electronic waste to be processed with rubbing-grinding, separation of the copper, nickel and noble metals is carried out with a known method, electrically, this way dischargeable melt is obtained, at higher temperature the lead-containing soldering metals are recovered as secondary melt, the metals are separated, and the light fraction is crushed, the resin is heated in a low temperature reactor, in order to recover the resin, the vapours generated are lead away, cooled, the solidified resin is recovered, the bottom product of the reactor is treated with nitric acid, and the solid residue is separated. . The equipment of the invention is characterized that inside its feeding screw (14) there is a plate lock (13), the central unit of the reactor is the bearing box of the driving engine (15), containing double stuffing box (26, 27, 28 and 29), and the lower part of its stirring mechanics is an anchor stirrer, has dredging shovels (5), on the conoidal frustum shaped bottom of the reactor there is a removal hole, closed by a cone lock (6), and the removal hole continues in a vertical neck (10).

    摘要翻译： 本发明涉及一种处理电子废物的方法，其特征在于： 由含有金属的电子废物制备砂浆，并将粗粉在反应器中加热，优选在455-465℃的温度下，离开200℃的焊接金属的蒸汽导出，冷却沉淀， 回收焊接金属，将反应器中产生的气体引入碱性猝灭剂，在其中进行纯化，剩余在反应器底部的加热残渣的煤部分被排出，聚合物加热残余物用酸性 解决方案，或。 b /金属从摩擦研磨的待处理电子废物表面的表面除去，铜，镍和贵金属的分离是用已知的方法进行的，这样可得到可排出的熔体， 在较高温度下，含铅焊接金属作为二次熔体回收，金属分离，轻馏分被粉碎，树脂在低温反应器中加热，以回收树脂，所产生的蒸气导致 ，冷却，回收固化的树脂，用硝酸处理反应器的底部产物，分离固体残余物。 。 本发明的设备的特征在于，在其进给螺杆（14）内部有一个板锁（13），反应器的中心单元是驱动发动机（15）的轴承箱，包含双重填料函（26,27 ，28和29），其搅拌机构的下部是锚式搅拌器，在反应器的锥形截头锥形底部有疏浚铲（5），有一个由锥形锁（6）封闭的拆卸孔， 并且所述移除孔在垂直的颈部（10）中继续。

    CHARGE SYSTEM FOR DESTROYING CHIPS ON A CIRCUIT BOARD AND METHOD FOR DESTROYING CHIPS ON A CIRCUIT BOARD
    4.
    发明申请
    CHARGE SYSTEM FOR DESTROYING CHIPS ON A CIRCUIT BOARD AND METHOD FOR DESTROYING CHIPS ON A CIRCUIT BOARD 审中-公开
    在电路板上烧毁电路的充电系统和电路板上的电路板的方法

    公开(公告)号：WO2008157463A1

    公开(公告)日：2008-12-24

    申请号：PCT/US2008/067065

    申请日：2008-06-16

    申请人： SPECTRE ENTERPRISES, INC. ,  MOHLER, Jonathan

    发明人： MOHLER, Jonathan

    IPC分类号： H01H37/76

    CPC分类号： F42D3/00 ,  F42B3/00 ,  F42B3/006 ,  F42B3/10 ,  H01L23/573 ,  H01L2924/0002 ,  H05K1/0275 ,  H05K1/185 ,  H05K2203/178 ,  H01L2924/00

    摘要： A charge system for destroying chips on a circuit board is provided. The charge system has a first substrate having a number of recesses formed therein with each of the recesses having a housing disposed therein. A high density charge is disposed within the housing. A number of recesses are formed within the high density charge. A number of low density charges are disposed within each of the recesses formed within the high density charge. A second substrate is located proximate to the first substrate. The low density charge and the high density charge are structured to destroy the second substrate after ignition. A method of destroying chips is also provided.

    摘要翻译： 提供一种用于破坏电路板上的芯片的充电系统。 充电系统具有形成在其中的多个凹部的第一基板，每个凹部具有设置在其中的壳体。 高密度电荷设置在壳体内。 在高密度电荷内形成多个凹槽。 多个低密度电荷设置在形成在高密度电荷内的每个凹部内。 第二衬底位于第一衬底附近。 低密度电荷和高密度电荷被构造成在点火之后破坏第二衬底。 还提供了一种破坏芯片的方法。

    複合樹脂成形物およびその製造方法
    5.
    发明申请
    複合樹脂成形物およびその製造方法 审中-公开
    复合树脂模塑及其制造方法

    公开(公告)号：WO2003051628A1

    公开(公告)日：2003-06-26

    申请号：PCT/JP2002/013105

    申请日：2002-12-13

    申请人： 鈴鹿富士ゼロックス株式会社 ,  鈴木 康公

    发明人： 鈴木 康公

    IPC分类号： B32B27/06

    CPC分类号： C08J5/00 ,  H05K1/0373 ,  H05K3/181 ,  H05K3/22 ,  H05K2201/0129 ,  H05K2201/09118 ,  H05K2203/0783 ,  H05K2203/178

    摘要： A composite resin molding which comprises a solvent-soluble thermoplastic resin element and a solvent-insoluble thermoplastic resin element. For example, the composite resin molding is a printed wiring board, wherein the solvent-soluble thermoplastic resin element is a substrate and the solvent-insoluble thermoplastic resin element comprises a thin metal film circuit formed on a surface of the substrate and a thermoset resin coating.

    摘要翻译： 一种复合树脂成型体，其包含溶剂可溶性热塑性树脂元素和溶剂不溶性热塑性树脂元素。 例如，复合树脂成型体是印刷线路板，其中溶剂可溶性热塑性树脂元件是基材，溶剂不溶性热塑性树脂元件包括在基材表面上形成的薄金属膜电路和热固性树脂涂层 。

    APPARATUS, METHODS, AND SYSTEMS FOR REMOVING COMPONENTS FROM A CIRCUIT BOARD
    8.
    发明申请
    APPARATUS, METHODS, AND SYSTEMS FOR REMOVING COMPONENTS FROM A CIRCUIT BOARD 审中-公开
    从电路板移除组件的设备，方法和系统

    公开(公告)号：WO2015192335A1

    公开(公告)日：2015-12-23

    申请号：PCT/CN2014/080192

    申请日：2014-06-18

    申请人： EMPIRE TECHNOLOGY DEVELOPMENT LLC ,  WANG, Wusheng

    发明人： WANG, Wusheng

    IPC分类号： B09B3/00 ,  B23K1/018

    CPC分类号： H05K13/0486 ,  B09B3/00 ,  B09B5/00 ,  B23K1/0016 ,  B23K1/018 ,  B23K3/029 ,  B23K2201/42 ,  H01L24/799 ,  H01L24/98 ,  H05K3/22 ,  H05K2203/176 ,  H05K2203/178 ,  Y02W30/822

    摘要： A detachment apparatus for detaching at least one component (120) from a circuit board (125) can include a shaft (105) configured to rotate about a central axis, at least one lever (110) having a first end and a second end, the lever being attached to the shaft at the first end, and a hook (115) attached to the second end of the lever. Rotation of the shaft causes the hook to come into contact with the component on the circuit board, and the hook is configured to separate the component from the circuit board.

    摘要翻译： 用于从电路板（125）分离至少一个部件（120）的分离装置可以包括构造成围绕中心轴线旋转的轴（105），具有第一端和第二端的至少一个杠杆（110） 所述杠杆在所述第一端处附接到所述轴，以及附接到所述杠杆的第二端的钩（115）。 轴的旋转导致钩与电路板上的部件接触，并且钩被配置为将部件与电路板分离。