USE OF A WATER-SOLUBLE AGENT CONTAINING POLYGLYCEROLS FOR LUBRICATING EXTRUSIONS, IN PARTICULAR STRIPS
    3.
    发明申请

    公开(公告)号:WO01049271A1

    公开(公告)日:2001-07-12

    申请号:PCT/CH2000/000670

    申请日:2000-12-19

    CPC classification number: A61K9/4883 A61J3/07 A61K9/4825

    Abstract: The invention relates to a lubricant for lubricating extrusions, preferably strips (4, 4a) in a work process, consisting of a biopolymer substance, in particular gelatine, and to a method for producing soft gelatine capsules. According to the invention, the lubricant is water-soluble and contains one or several polyglycerols consisting of 2 - 28 monomer units, preferably 2 - 10 monomer units. The advantage of the hydrophilic lubricant is that residual lubricant no longer needs to be removed from the capsule jacket before the capsules (8) are dried and that the lattice of waste (14) can be recycled.

    Abstract translation: 润滑剂从明胶润滑股线,优选条(4,4a)中,从一个生物聚合材料,特别是,在工作过程和用于软明胶胶囊的制备方法,其中所述润滑剂是水溶性的,从2-28个单体单元的一种或多种聚甘油, 优选为2 - 10含有单体单元。 优选地,所述亲水性润滑剂是需要去除的胶囊(8)和所述废物网络(14)的可能的回收干燥之前剩余润滑剂的胶囊壳的消除。

    METHODS AND APPARATUSES FOR PLANARIZING MICROELECTRONIC SUBSTRATE ASSEMBLIES
    9.
    发明申请
    METHODS AND APPARATUSES FOR PLANARIZING MICROELECTRONIC SUBSTRATE ASSEMBLIES 审中-公开
    用于平面化微电子基板组件的方法和装置

    公开(公告)号:WO01005555A1

    公开(公告)日:2001-01-25

    申请号:PCT/US2000/019692

    申请日:2000-07-19

    CPC classification number: B24B37/245 B24B21/04 B24B37/26 B24D2203/00

    Abstract: Methods and apparatuses for planarizing microelectronic substrate assemblies (12) on fixed-abrasive polishing pads (40) with non-abrasive lubricating planarizing solutions (170). One aspect of the invention is to deposit a lubricating planarizing solution without abrasive particles onto a fixed-abrasive polishing pad having a body (41), a planarizing surface on the body, and a plurality of abrasive particles fixedly attached to the body at the planarizing surface. The front face of a substrate assembly (12) is pressed against the lubricating planarizing solution (170) and at least a portion of the fixed abrasive particles on the planarizing surface of the polishing pad. At least one of the polishing pad or the substrate assembly is then moved with respect to the other to impart relative motion therebetween. As the substrate assembly moves relative to the polishing pad, regions of the front face are separated from the abrasive particles in the polishing pad (40) by a lubricant-additive (160) in the lubricating planarizing solution (170).

    Abstract translation: 在具有非研磨性润滑平坦化溶液(170)的平面化固定研磨抛光垫(40)上的微电子衬底组件(12)的方法和装置。 本发明的一个方面是将没有磨料颗粒的润滑平坦化溶液沉积在具有主体(41),主体上的平坦化表面的固定研磨抛光垫上,以及在平坦化处固定地附接到身体的多个研磨颗粒 表面。 衬底组件(12)的前表面被压在抛光垫的平坦化表面上的润滑平坦化溶液(170)和固定磨料颗粒的至少一部分上。 然后抛光垫或基板组件中的至少一个相对于另一个移动以在其间进行相对运动。 当衬底组件相对于抛光垫移动时,前表面的区域通过润滑平面化溶液(170)中的润滑剂添加剂(160)与抛光垫(40)中的磨料颗粒分离。

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