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91.发明公开Post-treatment composition for increasing corrosion resistance of metal or metal alloy surfaces 有权Nachbehandlungszusammensetzung zur Steigerung des Rostschutzes von Metall oderMetalllegierungsflächen
公开(公告)号：EP2180081A1
公开(公告)日：2010-04-28
申请号：EP08167116.6
申请日：2008-10-21
IPC分类号： C23C18/12
CPC分类号： C23C18/12 , H05K3/282 , H05K2201/0162 , Y10T428/294 , Y10T428/31663
摘要： The present invention relates to aqueous post-treatment compositions and an immersion and/or electrolytical process using said compositions for corrosion protection of metal and/or metal alloy surfaces. The aqueous post-treatment compositions comprise at least one polysiloxane betaine compound and optionally at least one phosphorus containing compound.
摘要翻译： 本发明涉及含水后处理组合物以及使用所述组合物浸渍和/或电解方法以防止金属和/或金属合金表面的腐蚀。 含水后处理组合物包含至少一种聚硅氧烷甜菜碱化合物和任选的至少一种含磷化合物。
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92.发明公开TREATING MODULE OF AN APPARATUS FOR HORIZONTAL WET-CHEMICAL TREATMENT OF LARGE-SCALE SUBSTRATES 有权处理模块的水平和湿法化学处理大面积基板用设备
公开(公告)号：EP3035375A1
公开(公告)日：2016-06-22
申请号：EP14199222.2
申请日：2014-12-19
发明人： Hahn, Roland , Thomas, Christian , Nößner, Martin , Ott, Thomas , Lorenz, Olaf
IPC分类号： H01L21/67 , H01L21/677
CPC分类号： H01L21/6776 , C03C17/002 , C23C18/1608 , C23C18/1632 , C23C18/165 , C23C18/1889 , C23C18/38 , H01L21/67051 , H01L21/6708
摘要： The present invention is related to a treating module of an apparatus for horizontal wet-chemical treatment of large-scale substrates, in particular glass substrates, comprising a housing with a housing cover; a transport device comprising a plurality of transport elements for horizontal processing of large-scale substrates, wherein the treating module further comprises at least a first liquid nozzle and at least a gas nozzle arranged above the transport level of the large-scale substrates at the entry and at the exit of the treating module for accumulating treatment liquid inside of the treating module, wherein the gas nozzle is arranged more exterior than the respective first liquid nozzle; at least a liquid weir arranged below each first liquid nozzle below the transport level of the large-scale substrates; and at least an adjusting device for adjusting the transport device and the liquid weirs of the treating module.
The present invention is further directed to a method for treating of large-scale substrates in a horizontal apparatus comprising among others such a treating module.摘要翻译： 本发明涉及一种用于水平湿化学处理的大型基板的，特别是玻璃基板，其包括与壳体盖的外壳的装置的处理模块; 一个传送装置，包括输送元件，用于大型基板的水平方向处理worin处理模块进一步的数个包含至少一个第一液体喷嘴和至少一个气体喷嘴在条目中的大型衬底的输送水平之上布置 并且在用于累积处理模块的内部处理液，worin气体喷嘴配置在比第一respectivement液喷嘴多个外的处理模块的出口; 下方设置大型衬底的输送级的每个第一液体喷嘴下方的至少一个液体堰; 和至少在用于调节所述传送装置和所述处理模块的液体堰调节装置。 本发明涉及一种方法，还用于在水平装置等寻求治疗模块，包括大型基板的处理。
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93.发明授权DEVICE FOR VERTICAL GALVANIC METAL DEPOSITION ON A SUBSTRATE 有权VORRICHTUNG ZUR VERTIKALEN GALVANISCHEN METALLABSCHEIDUNG AUF EINEM SUBSTRAT
公开(公告)号：EP2935660B1
公开(公告)日：2016-06-15
申请号：EP13801546.6
申请日：2013-12-03
发明人： WEINHOLD, Ray , WIENER, Ferdinand
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公开(公告)号：EP2825690B1
公开(公告)日：2016-05-18
申请号：EP13712718.9
申请日：2013-03-15
发明人： MIDDEKE, Hermann
IPC分类号： C23C18/22
CPC分类号： C23C18/1603 , C23C18/1625 , C23C18/163 , C23C18/1641 , C23C18/166 , C23C18/22 , C23C18/24 , C23C18/52
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公开(公告)号：EP2825689B1
公开(公告)日：2016-05-18
申请号：EP13709443.9
申请日：2013-03-15
IPC分类号： C23C18/22
CPC分类号： C23C18/24 , C23C18/1641 , C23C18/22 , H05K3/382
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96.发明公开Acidic zinc and zinc-nickel alloy plating bath composition and electroplating method 有权酸性锌和锌镍合金镀液组成及电镀方法
公开(公告)号：EP3015571A1
公开(公告)日：2016-05-04
申请号：EP14190510.9
申请日：2014-10-27
摘要： The present invention relates to an acidic zinc or zinc-nickel alloy plating bath composition comprising a source for zinc ions, optionally a source for nickel ions, a source for inorganic ions selected from chloride ions, sulfate ions and mixtures thereof and at least one dithiocarbamyl alkyl sulfonic acid or salt thereof. Said plating bath composition and the corresponding plating method result in zinc or zinc-nickel alloy layers having an improved throwing power and thickness distribution, particularly when plating substrates having a complex shape and/or in rack-and-barrel plating.
摘要翻译： 本发明涉及酸性锌或锌 - 镍合金镀液组合物，其包含锌离子源，任选的镍离子源，选自氯离子，硫酸根离子及其混合物的无机离子源和至少一种二硫代氨基甲酰基 烷基磺酸或其盐。 所述电镀液组合物和相应的电镀方法导致锌或锌 - 镍合金层具有改善的俘获能力和厚度分布，特别是当电镀具有复杂形状和/或机架 - 滚镀的基板时。
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公开(公告)号：EP2997180A2
公开(公告)日：2016-03-23
申请号：EP14723768.9
申请日：2014-05-09
CPC分类号： C25D3/38 , C25D5/10 , C25D5/18 , C25D5/38 , C25D5/44 , C25D5/54 , C25D21/12 , H05K1/0265 , H05K1/0306 , H05K3/241 , H05K3/246 , H05K2203/0307 , H05K2203/0723 , H05K2203/1492
摘要： The present invention relates to a method for electrodepositing a thick copper layer onto an electrically conductive, sintered layer. The thick copper layer has a high adhesion strength, is poor in defects and internal stress, and has high electrical and thermal conductivity. The thick copper layer on the sintered layer is suited for printed circuit boards for high power electronic applications.
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公开(公告)号：EP2855731B1
公开(公告)日：2016-03-23
申请号：EP13727595.4
申请日：2013-06-05
CPC分类号： C23C22/78 , C23C18/1651 , C23C18/2086 , C23C18/24 , C23C18/285 , C23C18/30 , C23C18/34 , C23C18/36 , C23C18/40 , C23C18/405
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公开(公告)号：EP2233608B1
公开(公告)日：2016-03-23
申请号：EP09155882.5
申请日：2009-03-23
IPC分类号： C23C18/18
CPC分类号： C23C18/1841 , C23C18/1607 , C23C18/1608 , C23C18/1637 , H05K3/244 , H05K2203/0716 , H05K2203/072
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100.发明公开Composition, use thereof and method for electrodepositing gold containing layers 审中-公开组合物，其用途和方法含金层的电沉积
公开(公告)号：EP2990507A1
公开(公告)日：2016-03-02
申请号：EP14182083.7
申请日：2014-08-25
摘要： The present invention relates to a composition and method for electrodepositing gold containing layers using the composition and the use of mercapto triazole as additive. The composition contains a mercapto-triazole compound which acts as an anti-immersion additive. The composition and method are suited for depositing functional or hard gold or gold alloys that can be applied in the industry as contact material of electrical connectors for high reliability applications.
摘要翻译： 本发明涉及一种用于电沉积使用该组合物和使用巯基三唑的作为添加剂的含有金层的组合物和方法。 所述组合物含有巯基三唑化合物用作抗浸没添加剂。 该组合物和方法适合用于沉积官能或硬质金或金合金也可以在工业中应用作为用于高可靠性应用的电连接器的接触材料。
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