公开(公告)号：EP0714226B1

公开(公告)日：2000-02-02

申请号：EP95117349.1

申请日：1995-11-03

Applicant: Sumitomo Wiring Systems, Ltd.

Inventor： Noda, Haruo, c/o Sumimoto Wiring Sys, Ltd

IPC: H05K3/34 ,  B23K3/08

CPC classification number: H05K3/3447 ,  B23K3/08 ,  B23K2201/42 ,  H05K1/0393 ,  H05K3/007 ,  H05K3/3452 ,  H05K3/3468 ,  H05K2203/0156 ,  H05K2203/0557 ,  Y10T29/49144 ,  Y10T29/49153

公开(公告)号：EP0941798A2

公开(公告)日：1999-09-15

申请号：EP99500025.4

申请日：1999-02-18

Applicant: MECANISMOS AUXILIARES INDUSTRIALES S.A. M.A.I.S.A.

Inventor： Cubero Pitel, José Antonio

IPC: B23K1/005 ,  H05K3/34

CPC classification number: H05K3/3447 ,  B23K1/0056 ,  B23K2201/42 ,  H05K3/3494 ,  H05K3/4046 ,  H05K2201/10303 ,  H05K2201/1081 ,  H05K2203/107

Abstract: The proposed procedure, that of laser soldering or welding, is an auto-energetic process in which the density of the laser beam is obtained because of the concentration of light beams. Said process involves two metals (alike or disimilar) and, previously to the metallurgical union, same must be positioned in front of the laser head with enough accuracy. The metallurgical union is carried out by direct fusion of the metals to join, not being therefore necessary any filler metal.

Abstract translation: 所提出的激光焊接或焊接方法是一种自动能量过程，其中由于光束的集中而获得激光束的密度。 所述方法涉及两种金属（类似或不相似的），并且预先到冶金联合体，必须以足够的精度将相同的金属定位在激光头前面。 冶金联合是通过金属的直接熔合来进行的，因此不需要任何填充金属。

公开(公告)号：EP0934792A2

公开(公告)日：1999-08-11

申请号：EP99108330.4

申请日：1993-11-15

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Taniguchi, Masahiro ,  Nakamura, Youichi ,  Ishimoto, Kazumi ,  Kuwabara, Kimihito ,  Ando, Manabu ,  Mimura, Toshinori ,  Hamasaki, Kurayasu ,  Nakano, Kenichi

IPC: B23K1/012

CPC classification number: H02K3/34 ,  B23K1/008 ,  B23K1/012 ,  B23K2201/40 ,  B23K2201/42

Abstract: The present invention provides a reflow apparatus and method which can make the running direction of the internal gas flow in a heating section within a reflow furnace constant. A circulating gas path is formed in a heating unit (U) which collects and moves the gas flow (B) from a sirocco fan (11) up to the rear side of the heating unit (U) and at the same time, drops the raised gas flow towards a circuit board (2) on a transfer path from the front side of the heating unit (U). Moreover, a plurality of straightening plates (16) are arranged above the transfer path of the heating unit (U) so as to guide down the hot gas flow (B) running forward to the circuit board (2) on the transfer path. A blow-down nozzle (17) is further constituted of a plurality of plate materials (19) aligned in rows in the transferring direction of circuit boards and having an inverse U-shaped cross section. The blow-down nozzle (17) is arranged below the straightening plates (16) to feed the hot gas flow (B) to the whole surface of the circuit board (1) in the vertical direction uniformly.

公开(公告)号：EP0713743B1

公开(公告)日：1999-04-14

申请号：EP95307284.0

申请日：1995-10-13

Applicant: Ford Motor Company

Inventor： Lemecha, Myron ,  Gao, Guilian ,  Kneisel, Lawrence ,  Sinkunas,Peter ,  Nation, Brenda

IPC: B23K1/20 ,  B23K3/08

CPC classification number: B23K35/3618 ,  B23K1/015 ,  B23K35/386 ,  B23K2201/42 ,  H05K3/3489

公开(公告)号：EP0861136A1

公开(公告)日：1998-09-02

申请号：EP96942008.0

申请日：1996-11-12

Applicant: NORDSON CORPORATION

Inventor： SMITH, James, C. ,  HOGAN, Patrick, T. ,  SAIDMAN, Laurence, B.

IPC: B05D1 ,  B05C5 ,  B05C11 ,  B05D3 ,  B23K1 ,  B23K3 ,  F16K1 ,  G01F13 ,  H05K3

CPC classification number: B05C5/001 ,  B05C5/02 ,  B05C5/0225 ,  B05C11/1034 ,  B23K1/203 ,  B23K3/0607 ,  B23K2201/36 ,  B23K2201/42 ,  G01F13/006 ,  H05K3/1241

Abstract: Apparatus and methods for dispensing droplets of liquid or viscous material are disclosed. A valve is opened to dispense a stream of the heated liquid or viscous material through an elongated orifice of a nozzle. The stream of material being dispensed from the elongated orifice is broken into droplets by rapidly closing the valve. Furthermore, a method for varying the height of a droplet of liquid or viscous material is disclosed by which two or more droplets combine to form a droplet of a desired height. A method for applying a plurality of droplets of material onto a substrate so that the droplets flow together to form a uniform film of desired thickness and shape is also disclosed. A second embodiment of the invention relates to dispensing apparatus with a heater assembly removably attached to the dispenser housing. Another modification of the invention relates to a modified seat assembly wherein the valve has three positions with respect to the valve seat and a modified nozzle assembly wherein the nozzle is constructed of a thin walled tube.

公开(公告)号：EP0847828A1

公开(公告)日：1998-06-17

申请号：EP97117867.8

申请日：1997-10-15

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD ,  Tanaka Denshi Kogyo Kabushiki Kaisha

Inventor： Ogashiwa, Toshinori ,  Arikawa, Takatoshi ,  Yokozawa, Masami ,  Aoi, Kazuhiro ,  Sawada, Yoshiharu

IPC: B23K35/26 ,  H05K3/34

CPC classification number: H01L24/48 ,  B23K35/262 ,  B23K2201/42 ,  C22C13/00 ,  H01L23/488 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L2224/04026 ,  H01L2224/05073 ,  H01L2224/05624 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29211 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48655 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48755 ,  H01L2224/73265 ,  H01L2224/83455 ,  H01L2224/85455 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01082 ,  H01L2924/01026 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/3512 ,  H01L2924/053 ,  H01L2924/045 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/2075 ,  H01L2924/20754

Abstract: This invention provides a lead-free high temperature solder material comprising 0.005-3.0 wt % of palladium (Pd) and 97.0-99.995 wt % of tin (Sn) whose liquidus temperature is 200-350°C. The solder material is environmentally-friendly, improved in thermal fatigue property, and it can improve the reliability of electronic apparatuses. A predetermined amount of Sn material and Pd is mixed, vacuum-melted and cast to prepare an ingot. The ingot is rolled to be a tape that is later pressed to obtain a solder pellet. In a preferable composition, at least 95 wt % of Sn and 0.005-3.0 wt 5 of Pd are contained, and 0.1-5.0 wt % of metallic (e.g. Cu, Ni) or alloy particles are added. The average particle diameter is about 40 µm. A substrate and an IC chip (5) (electronic element) are die-bonded substantially in parallel by a solder material (3) provided between an Ni plating (4) on the lower side of an IC chip (semiconductor) (5) and an Ni plating (2) on a die (1).

Abstract translation: 本发明提供一种无铅高温焊料，其包含0.005-3.0重量％的钯（Pd）和97.0-99.995重量％的液相线温度为200-350℃的锡（Sn）。焊料材料是环境友好的 ，提高了热疲劳特性，能够提高电子设备的可靠性。 将预定量的Sn材料和Pd混合，真空熔融并铸造以制备锭。 将锭轧制成随后压制以获得焊料丸的带。 在优选的组成中，含有至少95重量％的Sn和0.005-3.0重量％的Pd，并且加入0.1-5.0重量％的金属（例如Cu，Ni）或合金颗粒。 平均粒径约40μm。 基板和IC芯片（5）（电子元件）通过设置在IC芯片（半导体）（5）的下侧的Ni电镀层（4）之间的焊料材料（3）与基板平行地键合， 在模具（1）上的镀镍（2）。

公开(公告)号：EP0829323A3

公开(公告)日：1998-05-06

申请号：EP97120071.2

申请日：1994-10-25

Applicant: FUJITSU LIMITED

Inventor： Sakuyama, Seiki, c/o Fujitsu Limited ,  Uchida, Hiroki, c/o Fujitsu Limited ,  Watanabe, Isao, c/0 Fujitsu Limited

IPC: B23K1/005

CPC classification number: B23K1/0053 ,  B23K1/08 ,  B23K35/025 ,  B23K35/3612 ,  B23K2201/42 ,  H05B3/28 ,  H05B3/283 ,  H05B3/286 ,  H05K3/3494 ,  Y10T29/49083

Abstract: The present invention relates to an infrared heater which has a heat conduction plate (52) with a resistance heating element (53) disposed below the heat conduction plate (53) for heating the heat conduction plate (52). The upper surface of the heat conduction plate (52) has an infrared radiation layer (55) formed thereon, which receives heat from the heat conduction plate (52) and emits infrared radiation. The infrared radiation layer (55) is formed of alumina and has a relatively narrow temperature distribution over its surface.

Abstract translation: 红外线加热器技术领域本发明涉及一种红外线加热器，其具有在导热板（53）的下方配置有对导热板（52）进行加热的电阻发热体（53）的导热板（52）。 导热板52的上表面上形成有红外线辐射层55，红外线辐射层55接收来自导热板52的热量并发射红外辐射。 红外辐射层（55）由氧化铝形成并且在其表面上具有相对窄的温度分布。

公开(公告)号：EP0758282A1

公开(公告)日：1997-02-19

申请号：EP95915115.0

申请日：1995-03-22

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： ALBRECHT, Hans-Jürgen ,  STRICK, Günter-Werner

IPC: B23K31 ,  B23K1 ,  B23K3 ,  H05K3

CPC classification number: B23K3/085 ,  B23K2201/42 ,  H05K3/3468 ,  H05K2203/081 ,  H05K2203/086 ,  H05K2203/1121

Abstract: The invention relates to a process for wave-soldering printed circuit boards. In order to obtain wave-soldered printed circuit boards with smallest possible number of solder beads, after the passage on the wave of solder (13), the printed circuit boards (1) are further artificially cooled at an approximately constant time-temperature gradient.

公开(公告)号：EP0753370A1

公开(公告)日：1997-01-15

申请号：EP96114213.0

申请日：1993-11-15

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Taniguchi, Masahiro ,  Nakamura, Youichi ,  Ishimoto, Kazumi ,  Kuwabara, Kimihito ,  Mimura, Toshinori ,  Hamasaki, Kurayasu ,  Nakano, Kenichi ,  Ando, Manabu

IPC: B23K1/012 ,  B23K1/008

CPC classification number: H02K3/34 ,  B23K1/008 ,  B23K1/012 ,  B23K2201/40 ,  B23K2201/42

Abstract: The present invention provides a reflow apparatus and method which can make the running direction of the internal gas flow in a heating section within a reflow furnace constant. A circulating gas path is formed in a heating unit (U) which collects and moves the gas flow (B) from a sirocco fan (11) up to the rear side of the heating unit (U) and at the same time, drops the raised gas flow towards a circuit board (2) on a transfer path from the front side of the heating unit (U). Moreover, a plurality of straightening plates (16) are arranged above the transfer path of the heating unit (U) so as to guide down the hot gas flow (B) running forward to the circuit board (2) on the transfer path. A blow-down nozzle (17) is further constituted of a plurality of plate materials (19) aligned in rows in the transferring direction of circuit boards and having an inverse U-shaped cross section. The blow-down nozzle (17) is arranged below the straightening plates (16) to feed the hot gas flow (B) to the whole surface of the circuit board (1) in the vertical direction uniformly.

公开(公告)号：EP0747159A1

公开(公告)日：1996-12-11

申请号：EP96401172.0

申请日：1996-05-31

Applicant: L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE

Inventor： Sindzingre, Thierry ,  Rabia, Stéphane, 14 Parc du Chât. de Courcelles ,  Potier, Nicolas

IPC: B23K1/20 ,  B23K35/38

CPC classification number: B23K35/38 ,  B23K1/203 ,  B23K2201/42 ,  H05K3/3489

Abstract: L'invention concerne un procédé de fluxage par voie sèche d'une surface métallique avant brasage ou étamage à l'aide d'un alliage, selon lequel la surface à fluxer est traitée, à une pression voisine de la pression atmosphérique, par une atmosphère gazeuse de traitement comprenant des espèces excitées ou instables et étant substantiellement dépourvue d'espèces électriquement chargées, obtenue à partir d'un mélange gazeux primaire (8) et le cas échéant d'un mélange gazeux adjacent (9,10), le mélange gazeux primaire étant obtenu à la sortie de gaz d'au moins un appareil (11,4,12) de formation d'espèces gazeuses excitées ou instables dans lequel a été transformé un mélange gazeux initial (7) comprenant un gaz inerte et/ou un gaz réducteur, et comprenant un mélange gazeux oxydant qui comporte de la vapeur d'eau, le mélange gazeux adjacent n'ayant pas transité par l'appareil.

Abstract translation: 混合物（a）中的初始气体的传：干式助熔至少一个金属表面的部件上之前，钎焊或镀锡与包括合金。 （7）在惰性气体和/或还原性气体，其包括和氧化气体混合掺入。 包括水蒸汽，为至少一个约会。 （11,4,12），用于以产生，转化后在此appts，在appts的出口（6）形成已激励或不稳定气态产物的。 一个整洁。 气体混合。 （8）中，初始气体的水蒸汽含量混合。 是一个范围的50ppm至6％的范围内; 和（b）处理的表面在接近那样的大气压力的压力下回流，用气态处理ATMOS。 由所述激励或不稳定气体产物的，并且基本上没有任何电的带电物质，obtd。 从拘谨。 气体混合。