公开(公告)号：EP1273609A1

公开(公告)日：2003-01-08

申请号：EP01999592.7

申请日：2001-12-05

Applicant: Mitsui Mining & Smelting Co., Ltd.

Inventor： SATO, T., c/o MITSUI MINING & SMELTING CO., LTD ,  ASAI, T., c/o MITSUI MINING & SMELTING CO., LTD

IPC: C08G59/62 ,  C08L79/00 ,  B32B15/08 ,  B32B27/38 ,  H05K3/38

CPC classification number: H05K3/4655 ,  C08G59/4042 ,  C08L63/00 ,  H05K3/4652 ,  H05K2201/0358 ,  Y10S428/901 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529 ,  C08L2666/16

Abstract: The present invention provides a resin applied-copper foil, which is free of halogen elements, having high flame retardancy, excellent water resistance, heat resistance, and good peeling strength between a base material and copper foil. To provide the a resin compound used for fabricating an interlayer dielectric of a printed wiring board, the resin compound comprises an epoxy-based resin which includes: an epoxy resin curing agent having 5 to 25% by weight of nitrogen; and maleimide compounds having thermosetting properties, and the resin compound furthrt has composition which is free of halogen elements.

公开(公告)号：EP1260359A2

公开(公告)日：2002-11-27

申请号：EP02011363.5

申请日：2002-05-23

Applicant: SUMITOMO BAKELITE CO., LTD.

Inventor： Ilda, Takahisa, Sumitomo Bakelite Co. Ltd.

IPC: B32B31/08 ,  B32B31/20

CPC classification number: B32B15/14 ,  B32B7/14 ,  B32B15/04 ,  B32B15/20 ,  B32B27/08 ,  B32B37/203 ,  B32B38/0036 ,  B32B2038/0076 ,  B32B2305/076 ,  B32B2309/02 ,  B32B2309/12 ,  B32B2311/00 ,  B32B2311/12 ,  B32B2398/10 ,  B32B2457/08 ,  H05K3/022 ,  H05K3/386 ,  H05K2201/0129 ,  H05K2201/0358 ,  H05K2203/1545

Abstract: A method for manufacturing a laminated board having high quality with high productivity is disclosed. In this manufacturing method, a prepreg 2 that has been supplied from a prepreg supply section 1 is fed vertically using feed rolls. Further, metal foils 4 are supplied from a metal foil supply section 3 using feed rolls. The prepreg 2 and the metal foil 4 are heated at a heating section 7, and then they pass through between the rolls 5 so that the metal foils are bonded to the prepreg. Thus obtained laminated board is fed to a rolling section 6 using feed rolls, and the laminated is continuously rolled up at the rolling section 6, thereby continuously manufacturing the laminated board.

Abstract translation: 公开了一种生产高质量的层压板的方法。 在该制造方法中，从预浸料供给部1供给的预浸料坯2使用进给辊进行垂直供给。 此外，使用进给辊从金属箔供给部3供给金属箔4。 预浸料坯2和金属箔4在加热部7加热，然后通过辊5之间通过，使得金属箔与预浸料坯接合。 将这样得到的层叠基板通过进给辊供给到轧制部6，并且在轧制部6上连续卷起层压体，从而连续制造层压板。

公开(公告)号：EP1035760A3

公开(公告)日：2001-12-12

申请号：EP00104843.8

申请日：2000-03-07

Applicant: SUMITOMO BAKELITE COMPANY LIMITED

Inventor： Komiyatani, Toshio, c/o Sumitomo Bakelite Co. Ltd. ,  Uesaka, Masao, c/o Sumitomo Bakelite Co. Ltd. ,  Arai, Masataka, c/o Sumitomo Bakelite Co. Ltd. ,  Kawaguchi, Hitoshi, c/o Sumitomo Bakelite Co. Ltd.

IPC: H05K3/46 ,  H05K3/38 ,  C09J181/00 ,  C09J163/00

CPC classification number: H05K3/4655 ,  H05K1/0333 ,  H05K3/4652 ,  H05K2201/0129 ,  H05K2201/0358 ,  Y10S525/936 ,  Y10T428/31522 ,  Y10T428/31529 ,  Y10T428/31533

Abstract: In order to provide a multilayer printed circuit board having a fine pitch circuit, the interlaminar insulating adhesive used therein must have heat resistance and low thermal expansion coefficient so that required accuracy can be obtained during circuit formation and mounting of components. Therefore, the present invention aims at providing a multilayer printed circuit board which uses an interlaminar insulating adhesive superior in heat resistance and low in thermal expansion coefficient and wherein the insulating adhesive layer has a small variation in thickness between circuit layers. That is, the present invention lies in an interlaminar insulating adhesive for multilayer printed circuit board containing the following components as essential components: (a) a sulfur-containing thermoplastic resin having a weight-average molecular weight of 103 to 105, (b) a sulfur-containing epoxy or phenoxy resin having a weight-average molecular weight of 103 to 105, (c) a multifunctional epoxy resin having an epoxy equivalent of 500 or less, and (d) an epoxy-curing agent.

Abstract translation: 为了提供具有细间距电路的多层印刷电路板，其中使用的层间绝缘粘合剂必须具有耐热性和低热膨胀系数，使得在电路形成和部件安装期间可以获得所需的精度。 因此，本发明的目的在于提供一种使用耐热性优异，热膨胀系数低的层间绝缘胶的多层印刷电路板，其中绝缘粘合剂层在电路层之间的厚度变化小。 也就是说，本发明在于用于多层印刷电路板的层间绝缘粘合剂，其包含以下组分作为必要组分：（a）重均分子量为10 3至10 5的含硫热塑性树脂 >，（b）重均分子量为10 3〜10 5的含硫环氧树脂或苯氧基树脂，（c）环氧当量为500以下的多官能环氧树脂，（d ）环氧固化剂

公开(公告)号：EP1108532A1

公开(公告)日：2001-06-20

申请号：EP00127464.6

申请日：2000-12-14

Applicant: Nisshinbo Industries, Inc.

Inventor： Imashiro, Yasuo, c/o Nisshinbo Ind., Inc. ,  Ito, Takahiko, c/o Nisshinbo Ind., Inc. ,  Tomita, Hideshi, c/o Nisshinbo Ind., Inc. ,  Nakamura, Norimasa, c/o Nisshinbo Ind., Inc.

IPC: B32B27/34 ,  B32B27/38 ,  B32B15/08 ,  B32B15/20

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B27/34 ,  B32B27/38 ,  B32B2363/00 ,  B32B2379/08 ,  B32B2457/08 ,  H05K3/4626 ,  H05K2201/0154 ,  H05K2201/0358 ,  Y10T428/31511 ,  Y10T428/31522 ,  Y10T428/31678 ,  Y10T428/31681

Abstract: A resin-coated metal foil comprising:

a metal foil, and
a resin layer formed on the metal foil by coating and semi-curing, on the metal foil, a composition containing a polycarbodiimide resin having a number-average molecular weight of 3,000 to 50,000, an epoxy resin and, as necessary, a curing agent for epoxy resin, the proportions of the polycarbodiimide resin and the epoxy resin being 100 parts by weight and 20 to 200 parts by weight, respectively.

In the resin-coated metal foil, the resin is superior in handleability and storage stability in a semicure state and, after complete cure, high in heat resistance and superior in dielectric properties.

Abstract translation: 1.一种树脂被覆金属箔，其特征在于，在所述金属箔上含有金属箔和在所述金属箔上形成的树脂层，所述组合物含有数均分子量为3,000〜50,000的聚碳化二亚胺树脂 环氧树脂和必要时的环氧树脂用固化剂，聚碳化二亚胺树脂和环氧树脂的比例分别为100重量份和20〜200重量份。 在树脂被覆金属箔中，树脂在半固化状态下的操作性和保存稳定性优异，完全固化后，耐热性高，介电性优异。

公开(公告)号：EP0741505A3

公开(公告)日：1998-01-07

申请号：EP96106841.8

申请日：1996-04-30

Applicant: MITSUI MINING & SMELTING CO., LTD.

Inventor： Tsuyoshi, Hiraoki ,  Satoh, Tetsuro

IPC: H05K3/46 ,  H05K3/38

CPC classification number: H05K3/4655 ,  H05K3/385 ,  H05K3/4652 ,  H05K2201/0133 ,  H05K2201/0358 ,  H05K2203/0315

Abstract: A multilayer printed wiring board wherein an inner-layer copper circuit is provided on one or both of the surfaces of an inner-layer substrate, and subsequent copper circuit is cumulatively provided through an insulating layer on the outside of the inner-layer copper circuit, characterized in that the inner-layer copper circuit has a cuprous oxide film formed on the surface thereof the insulating layer which remarkably facilitate the interlayer adhesion between the inner-layer copper circuit. This multilayer printed wiring board has high interlayer adhesiveness and moistureproofness without causing any haloing phenomena when soaked with an acidic solution.

公开(公告)号：EP0797378A2

公开(公告)日：1997-09-24

申请号：EP96306670.9

申请日：1996-09-13

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Okano, Norio ,  Kobayashi, Kazuhito ,  Nakaso, Akishi

IPC: H05K1/03 ,  H05K3/46 ,  B32B15/08 ,  B32B27/20

CPC classification number: B32B15/14 ,  B32B7/06 ,  B32B15/08 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2307/206 ,  B32B2457/08 ,  H05K1/0373 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0358

Abstract: A copper-clad laminate comprising an electrically insulating layer comprising a thermosetting resin and electrically insulating whiskers, and a copper foil formed on at least one side of the insulating layer, the insulating layer and copper foil being integrated by thermal press molding, and a multilayer copper-clad laminate having an interlayer circuit therein, which laminate comprises an interlayer circuit plate, a copper foil for an outer circuit, and an electrically insulating layer interposed therebetween, the circuit plate, copper foil and insulating layer being integrated by thermal press molding, and the insulating layer comprising electrically insulating whiskers dispersed in a thermosetting resin, are effective for producing multilayer printed circuit boards with a very reduced thickness and high wiring density.

公开(公告)号：EP0702070A3

公开(公告)日：1996-08-07

申请号：EP95114331.2

申请日：1995-09-12

Applicant: MITSUI MINING & SMELTING CO., LTD.

Inventor： Satoh, Tetsuro

IPC: C09J163/00 ,  C09J129/14 ,  H05K3/38

CPC classification number: H05K3/386 ,  C08L2666/04 ,  C08L2666/08 ,  C09J163/00 ,  H05K3/022 ,  H05K2201/0133 ,  H05K2201/0355 ,  H05K2201/0358 ,  Y10S428/921 ,  Y10T428/2804 ,  Y10T428/287 ,  Y10T428/2883 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T428/31551 ,  Y10T428/31681 ,  Y10T428/31696

Abstract: An adhesive for copper foils comprises (I) 60 to 100 parts by weight of the whole epoxy resin including 0.5 to 20 parts by weight of a rubber-modified epoxy resin, and (II) 5 to 30 parts by weight of a polyvinyl acetal resin; and
   an adhesive-backed copper foil has the adhesive coated on its one surface.

Abstract translation: 对铜的粘合箔包含（i）60〜100重量份的整个环氧树脂包含0.5至20重量份的橡胶改性的环氧树脂，以及（II）（重量）的聚乙烯醇缩醛树脂的5至30份 ; 和背胶铜箔涂覆在其一个表面上的粘合剂。

公开(公告)号：EP0487857A3

公开(公告)日：1992-10-07

申请号：EP91116498.6

申请日：1991-09-27

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Linde, Harold G. ,  Previti-Kelly, Rosemary A.

IPC: H01L21/312 ,  H05K3/38

CPC classification number: H01L21/02222 ,  H01L21/02126 ,  H01L21/02211 ,  H01L21/02282 ,  H01L21/3121 ,  H01L21/3125 ,  H05K1/036 ,  H05K3/386 ,  H05K3/4644 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0759

Abstract: In order to improve the adhesion of a polyimide layer to an underlying metal surface, an organic solution which cures to a silsesquioxane copolymer is applied to the surface. The polyimide and the copolymer are formed during a simultaneous curing step.

公开(公告)号：EP0248310B1

公开(公告)日：1991-09-25

申请号：EP87107580.0

申请日：1987-05-25

Applicant: BAYER AG

Inventor： Wank, Joachim, Dipl.-Ing. ,  Burkhardt, Claus, Dr, ,  Schmoranzer, Hans-Wolfgang, Dipl.-Ing.

IPC: B05D7/14 ,  B32B31/12 ,  B32B15/08

CPC classification number: B32B15/08 ,  B05D7/14 ,  B32B7/12 ,  B32B15/095 ,  B32B27/40 ,  B32B37/153 ,  B32B2457/08 ,  H05K1/0284 ,  H05K3/386 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/09118 ,  H05K2203/0759 ,  H05K2203/1327

公开(公告)号：EP0192937A2

公开(公告)日：1986-09-03

申请号：EP86100430.7

申请日：1986-01-15

Applicant: Akzo Patente GmbH

Inventor： Kundinger, Ernst F., Dipl.-Chem. ,  Klimesch, Erich ,  Zengel, Hans G., Dr. Dipl.-Ing. ,  Lasher, Jeffery D.

IPC: B32B15/08 ,  C08G73/10

CPC classification number: B32B27/281 ,  B32B7/12 ,  B32B15/08 ,  B32B15/18 ,  B32B15/20 ,  B32B27/28 ,  H05K1/036 ,  H05K2201/0154 ,  H05K2201/0358 ,  H05K2203/066 ,  Y10T428/26 ,  Y10T428/2826 ,  Y10T428/294 ,  Y10T428/2947 ,  Y10T428/3154 ,  Y10T428/31721

Abstract: Die Erfindung betrifft Laminate mit mindestens einer Schicht aus einem nicht mehr formbaren, vollaromatischen Polyimid, die an einer Seite direkt mit einer Schicht aus Trägermaterial und an der anderen Seite mit einer Schicht aus einem heißsiegelbaren Hochtemperaturklebstoff verbunden ist.
Der Hochtemperaturklebstoff ist hierbei aus der Klasse der Polyacrylate, Polysulfonharze, Epoxiharze, Fluorpolymerharze, Silikonharze oder Butylkautschuke ausgewählt. Zwei so erhaltene Schichtkörper können auf der Seite des heißsiegelbaren Hochtemperaturklebstoffs miteinander verbunden sein. An einer oder beiden Außenseite (n) der Laminate können sich weitere Schichten anschließen. Die Laminate können nach einem ebenfalls beanspruchten temperaturgesteuerten Verfahren hergestellt werden.
Die Trägermaterialien sind bevorzugt Folien aus Metallen oder Legierungen.
Die erhaltenen Mehrschichtlaminate zeichnen sich durch hervorragende mechanische, thermische und elektrische Eigenschaften aus. Sie können als Verstärkungsmaterialien und für gedruckte elektrische Schaltkreise eingesetzt werden.

Abstract translation: 本发明涉及包含不再可成形的，完全芳族聚酰亚胺，其直接连接在一侧上具有载体材料的层和在另一侧上具有可热封的高温粘合剂层的至少一个层的层压材料。 高温粘合剂特此从类聚丙烯酸酯，聚砜树脂，环氧树脂，含氟聚合物，有机硅树脂或丁基橡胶组成的组。 由此得到的2层体可以一起在可热封的高温粘合剂的侧面接合。 附加层可以被连接到层压板的一个或两个外侧（一个或多个）。 层压材料可以由同样的温度控制的方法来制造权利。 的载体材料是金属或合金的优选的膜。 多层层压品是通过优异的机械，热和电性质为特征。 它们可以被用作增强材料和印刷电路。