OPTICAL MEMBER AND MANUFACTURING METHOD THEREOF
    101.
    发明公开
    OPTICAL MEMBER AND MANUFACTURING METHOD THEREOF 审中-公开
    光学元件及其制造方法

    公开(公告)号:EP1731931A4

    公开(公告)日:2009-09-16

    申请号:EP05727995

    申请日:2005-03-31

    CPC分类号: G02B1/118 G02B5/008

    摘要: An optical member utilizing diffraction, which comprises a substrate having a fine structure comprising microstructures with an interval of 50-1,000 nm between the adjacent microstructures on a substrate surface, wherein the substrate has a surface layer portion comprising a region containing fluorine atoms in an amount larger than that in the inner layer portion thereof. The microstructures are preferably micro-protrusions each tapering toward the tip in the direction perpendicular to the substrate surface. The optical member is manufactured by a method comprising a step of exposing the surface of the substrate having a fine structure comprising microstructures with an interval of 50-1, 000 nm between the adjacent microstructures to an atmosphere containing a fluorine gas.

    VACUUM HEAT INSULATION VALVE
    104.
    发明公开
    VACUUM HEAT INSULATION VALVE 审中-公开
    VAKUUMWÄRMEISOLIERVENTIL

    公开(公告)号:EP1707858A4

    公开(公告)日:2008-10-08

    申请号:EP05703504

    申请日:2005-01-13

    摘要: A vacuum heat insulation valve that can be used in high-temperature conditions in a gas supply system and gas discharge system and that can be drastically reduced in size and made compact because of excellent heat insulating performance of the valve. A vacuum heat insulation valve constructed from a valve that has a valve body and an actuator and from a vacuum insulation box that receives the valve. The vacuum heat insulation box (S) is constructed from a rectangular lower vacuum jacket (S5) that has on its side face a tubular vacuum insulation piping receiving section (J) and whose upper face is opened, and from a rectangular upper vacuum jacket (S4) that is air-tightly fitted to the lower vacuum jacket (S5) from the above and whose lower face is opened.

    摘要翻译: 一种真空绝热阀,可用于供气系统和排气系统的高温条件下,由于阀门具有优异的绝热性能,可大幅度减小尺寸并制成紧凑的结构。 由阀门构成的真空隔热阀,该阀门具有阀体和致动器,以及来自容纳阀门的真空绝热箱。 真空隔热箱(S)由矩形的下部真空夹套(S5)构成,其侧面具有管状真空隔热管接收部分(J)并且其上表面开口,并且从矩形上部真空夹套 S4)从上方气密地装配到下部真空夹套(S5)并且其下表面打开。

    DEVICE FOR CONTROLLING CHAMBER INNER PRESSURE AND INNER PRESSURE CONTROLLED-TYPE CHAMBER
    105.
    发明公开
    DEVICE FOR CONTROLLING CHAMBER INNER PRESSURE AND INNER PRESSURE CONTROLLED-TYPE CHAMBER 审中-公开
    一种用于控制腔内部压力和室内压控制型

    公开(公告)号:EP1672457A4

    公开(公告)日:2008-02-13

    申请号:EP04817112

    申请日:2004-09-14

    IPC分类号: G05D7/06 G05D16/20

    摘要: Flow rate control accuracy is prevented from being reduced in a low flow rate region to enable highly accurate flow rate control over the entire flow rate control region. By this, a chamber inner pressure is highly accurately controlled over a wide range by regulating the flow rate of a gas fed to a chamber. A gas feeding device for feeding a gas to a chamber, where the device is constituted of parallelly connected pressure-type flow rate control devices and a control device for controlling the flow rate control devices and feeds a desired gas, while controlling the flow rate, to a chamber deaerated by a vacuum pump. The gas feeding device is constructed such that one of the pressure-type flow control devices controls a gas flow rate range of up to 10% maximum of the maximum flow rate fed to the chamber and the remaining flow control devices control the remaining range. Further, a pressure detector is installed on a chamber and a detected value from the detector is inputted in the control device. Control signals to the pressure-type flow rate control devices are regulated to control the amount of the gas fed to the chamber, controlling a chamber inner pressure.

    SEMICONDUCTOR MANUFACTURING APPARATUS
    106.
    发明公开
    SEMICONDUCTOR MANUFACTURING APPARATUS 审中-公开
    器具,用于产生半导体

    公开(公告)号:EP1065709A4

    公开(公告)日:2007-10-31

    申请号:EP99949372

    申请日:1999-10-22

    摘要: A semiconductor manufacturing apparatus which can process the surface of a wafer uniformly and requires a small installation floor area and has an excellent maintainability. The apparatus comprises a vacuum enclosure including at least one wafer mounting stage on its bottom plate, and a cylinder surrounding the wafer mounting stage, and at least one cylinder lifting mechanism disposed for each cylinder for moving the cylinder vertically to vary the clearance between the cylinder and the top plate or bottom plate of the vacuum enclosure and for separating the space outside the cylinder constituting a transfer chamber for transferring the wafer from the space inside the cylinder constituting a process chamber for processing the surface of the wafer, wherein the transfer chamber includes a wafer transfer mechanism for transferring the wafer between the process chamber and the transfer chamber through the clearance, the process chamber has a process chamber gas feed port and a process chamber gas exhaust port, and said transfer chamber has a transfer chamber gas feed port and a transfer chamber gas exhaust port.