公开(公告)号：EP2491163A1

公开(公告)日：2012-08-29

申请号：EP10768354.2

申请日：2010-10-15

申请人： Atotech Deutschland GmbH

发明人： WILES, Jacob G. ,  JOSHI, Nayan H.

IPC分类号： C23C18/31

CPC分类号： C23C18/31

摘要： Improved compositions and processes for zincating magnesium and magnesium alloy substrates. An aqueous zincating composition having a pH of from about 8 to about 11 and including zinc ions, a complexing agent, fluoride ions and a reducing agent. A non-electrolytic process for zincating a magnesium or magnesium alloy substrate, including immersing the substrate in the non- electrolytic aqueous zincating composition for a time sufficient to deposit a zincate on the substrate. A non-electrolytic process for zincating a magnesium or magnesium alloy substrate, including preparing a aqueous non-electrolytic composition comprising zinc ions, a complexing agent, fluoride ions and a pH in the range from about 8 to about 11; adding to the composition an amount of a reducing agent sufficient to improve deposition of zincate on the magnesium or magnesium alloy substrate; and immersing the substrate in a composition for a time sufficient to deposit the zincate on the substrate.

公开(公告)号：EP2469992A1

公开(公告)日：2012-06-27

申请号：EP10196726.3

申请日：2010-12-23

申请人： Atotech Deutschland GmbH

发明人： Özkök, Mustafa ,  Ramos, Gustavo ,  Kilian, Arnd

IPC分类号： H05K3/24 ,  H01L23/498

CPC分类号： H05K13/04 ,  H01B1/02 ,  H01L23/49811 ,  H01L23/49866 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/03464 ,  H01L2224/04042 ,  H01L2224/05147 ,  H01L2224/05464 ,  H01L2224/05664 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48599 ,  H01L2224/48664 ,  H01L2224/48864 ,  H01L2224/85045 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85205 ,  H01L2224/85464 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/20105 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/09 ,  H05K3/244 ,  H05K2203/049 ,  H05K2203/072 ,  H05K2203/095 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/01201 ,  H01L2924/01202 ,  H01L2924/01203 ,  H01L2924/01005 ,  H01L2924/20752 ,  H01L2924/01007 ,  H01L2924/01001

摘要： The present invention relates to a method of bonding a copper wire to a substrate, particularly a printed circuit board and an IC-substrate, possessing a layer assembly comprising a copper bonding portion and a palladium or palladium alloy layer and a substrate having a copper wire bonded to aforementioned layer assembly.

摘要翻译： 本发明涉及一种铜导线粘合到基材，特别是印刷电路板和以IC基板的方法，波塞唱层组件，其包括铜接合部分和钯或钯合金层和具有铜布线的基板 键合到上述层组件。

公开(公告)号：EP2449149A1

公开(公告)日：2012-05-09

申请号：EP10728680.9

申请日：2010-07-05

申请人： ATOTECH Deutschland GmbH

发明人： HOFMANN, Udo ,  DONSBACH, Hermann ,  UNGER, Jörg ,  KRENZEL, Volker

IPC分类号： C23C22/17 ,  C23C22/83 ,  C23C18/12

CPC分类号： C23C22/17 ,  C23C22/83 ,  C23C2222/10

摘要： The invention relates to a method for producing an anti-corrosive cover layer, a surface to be treated being brought into contact with an aqueous treatment solution containing chromium(III) ions and at least one phosphate compound and an organosol. The method improves the anti-corrosion protection of metal, in particular zinc-containing, surfaces and zinc-containing surfaces provided with conversion layers. This produces or improves the decorative and functional properties of the surfaces. In addition, it avoids the known problems arising with the use of chromium(VI)-containing compounds or multi-stage processes in which a chromium ion-containing passivation layer and a seal are applied consecutively.

公开(公告)号：EP2405468A1

公开(公告)日：2012-01-11

申请号：EP10168468.6

申请日：2010-07-05

申请人： ATOTECH Deutschland GmbH

发明人： Lamprecht, Sven ,  Matejat, Kai-Jens ,  Ewert, Ingo ,  Kenny, Stephen

IPC分类号： H01L21/48 ,  H01L23/498

CPC分类号： B23K1/20 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/11 ,  H01L2224/11462 ,  H01L2924/00015 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/1134

摘要： Described is a method of forming a solder deposit on a substrate comprising the following steps i) provide a substrate that includes at least one inner contact area, ii) contact the entire substrate area including the at least one inner contact area with a solution suitable to provide a conductive layer on the substrate surface, iii) form a patterned resist layer, iv) electroplate a solder deposit layer containing a tin or tin alloy onto the inner contact area, v) remove the patterned resist layer, vi) form a solder resist layer having solder resist openings on the substrate surface.

摘要翻译： 描述了在衬底上形成焊料沉积物的方法，包括以下步骤：i）提供包括至少一个内部接触区域的衬底，ii）使包含至少一个内部接触区域的整个衬底区域与适于 在衬底表面上提供导电层，iii）形成图案化的抗蚀剂层，iv）将含有锡或锡合金的焊料沉积层电镀到内部接触区域上，v）去除图案化的抗蚀剂层，vi）形成阻焊层 层在基板表面上具有阻焊开口。

公开(公告)号：EP2298960A1

公开(公告)日：2011-03-23

申请号：EP09168492.8

申请日：2009-08-24

申请人： ATOTECH Deutschland GmbH

发明人： Hirsekorn, Isabel Roda ,  Kilian, Arnd ,  Schreier, Hans Jürgen ,  Wegricht, Jens

IPC分类号： C23C18/54

CPC分类号： C23C18/54 ,  C23C18/165 ,  C23C18/1651 ,  C23C18/31 ,  C23C18/38

摘要： The invention relates to a method for electroless (immersion) plating of tin and tin alloys having a thickness of ≥ 1 µm as a final finish in the manufacture of printed circuit boards, IC substrates, semiconductor wafers and the like. The method utilizes an electroless plated sacrificial layer of copper between the copper contact pad and the electroless plated tin layer which is dissolved completely during tin plating. The method compensates the undesired loss of copper from a contact pad during electroless plating of thick tin layers.

摘要翻译： 本发明涉及一种在印刷电路板，IC基板，半导体晶片等的制造中作为最终光洁度的厚度为‰¥1μm的锡和锡合金的无电镀（浸渍）电镀方法。 该方法在铜接触焊盘和化学镀锡层之间使用铜的无电解电镀牺牲层，其在镀锡期间完全溶解。 该方法在厚锡层的无电镀期间补偿了来自接触焊盘的铜的不期望的损失。

公开(公告)号：EP2233608A1

公开(公告)日：2010-09-29

申请号：EP09155882.5

申请日：2009-03-23

申请人： ATOTECH Deutschland GmbH

发明人： Zettelmeyer, Elisabeth

IPC分类号： C23C18/18

CPC分类号： C23C18/1841 ,  C23C18/1607 ,  C23C18/1608 ,  C23C18/1637 ,  H05K3/244 ,  H05K2203/0716 ,  H05K2203/072

摘要： The present invention discloses a process for electroless plating of nickel onto copper features of a printed circuit board which suppresses extraneous nickel plating. The process comprises the steps i) activation of the copper features with palladium ions; ii) removal of excessive palladium ions or precipitates formed thereof with a pre-treatment composition comprising at least two different types of acids wherein one type is an organic amino carboxylic acid and iii) electroless plating of nickel.

摘要翻译： 本发明公开了一种用于无电镀镍到印刷电路板的铜特征的方法，其抑制了外部镀镍。 该方法包括以下步骤：i）用钯离子活化铜的特征; ii）用包含至少两种不同类型的酸的预处理组合物除去过量的钯离子或其沉淀物，其中一种是有机氨基羧酸，和iii）无电镀镍。

公开(公告)号：EP2180770A1

公开(公告)日：2010-04-28

申请号：EP08167159.6

申请日：2008-10-21

申请人： ATOTECH Deutschland GmbH

发明人： Lamprecht, Sven ,  Matejat, Kai-Jens ,  Ewert, Ingo

IPC分类号： H05K3/34 ,  H01L21/60

CPC分类号： H05K3/3473 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05657 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/116 ,  H01L2224/11849 ,  H01L2224/13006 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/30107 ,  H01L2924/351 ,  H05K3/06 ,  H05K3/3452 ,  H05K2201/0367 ,  H05K2203/043 ,  H05K2203/054 ,  H01L2924/00

摘要： Described is a method of forming a solder deposit on a substrate comprising the following steps i) provide a substrate including a surface bearing electrical circuitry that includes at least one contact area, ii) form a solder mask layer that is placed on the substrate surface and patterned to expose the at least one contact area, iii) contact the entire substrate area including the solder mask layer and the at least one contact area with a solution suitable to provide a conductive layer on the substrate surface, iv) electroplate a solder deposit layer containing a tin or tin alloy onto the conductive layer and v) etch away an amount of the solder deposit layer containing tin or tin alloy sufficient to remove the solder deposit layer from the solder mask layer area leaving a solder material layer on the at least one contact area.

摘要翻译： 描述了在衬底上形成焊料沉积物的方法，其包括以下步骤：i）提供包括表面承载电路的衬底，其包括至少一个接触区域，ii）形成放置在衬底表面上的焊料掩模层，以及 图案化以暴露所述至少一个接触区域，iii）使包括焊料掩模层和至少一个接触区域的整个衬底区域与适于在衬底表面上提供导电层的溶液接触，iv）电镀焊料沉积层 在导电层上含有锡或锡合金，以及v）蚀刻一定量的包含锡或锡合金的焊料沉积层，其足以从焊料掩模层区域移除焊料沉积层，从而在至少一个 接触面积

公开(公告)号：EP2175048A1

公开(公告)日：2010-04-14

申请号：EP08166465.8

申请日：2008-10-13

申请人： ATOTECH Deutschland GmbH

发明人： Dambrowsky, Nina ,  Brunner, Heiko ,  Bedrnik, Lukas ,  Kriz, Vaclav

IPC分类号： C23C18/48 ,  C25D3/56

CPC分类号： C25D3/565 ,  C23C18/48

摘要： A tin-zinc alloy plating bath composition comprising a quaternary ammonium polymer additive. A process for deposition of tin-zinc alloys from a plating bath composition comprising a quaternary ammonium plating additive onto a substrate.

摘要翻译： 一种包含季铵聚合物添加剂的锡 - 锌合金电镀浴组合物。 一种从包含季铵电镀添加剂的电镀浴组合物沉积锡 - 锌合金到基底上的方法。

公开(公告)号：EP2524976B1

公开(公告)日：2016-06-29

申请号：EP11166399.3

申请日：2011-05-17

申请人： Atotech Deutschland GmbH

发明人： Brüning, Dr. Frank ,  Beck, Birgit ,  Dosse, Bexy ,  Etzkorn, Dr. Johannes

IPC分类号： C23C18/20 ,  C23C18/28 ,  C23C18/30 ,  C23C18/40

CPC分类号： C03C17/40 ,  C03C17/10 ,  C23C18/1889 ,  C23C18/40 ,  Y10T428/12597

摘要： The present invention discloses a method for electroless plating of a metal or metal alloy onto a metal or a metal alloy structure comprising a metal such as molybdenum or titanium and alloys containing such metals. The method comprises the steps of activation, treatment in an aqueous solution comprising at least one nitrogen-containing compound or a hydroxy carboxylic acid and electroless plating of a metal or metal alloy.

公开(公告)号：EP3034655A1

公开(公告)日：2016-06-22

申请号：EP14199374.1

申请日：2014-12-19

申请人： Atotech Deutschland GmbH

发明人： Adolf, James ,  Jagannathan, Rangarajan ,  Suzuki, Hidenao ,  van Eisden, Jobert

IPC分类号： C25D7/12 ,  C25D3/38 ,  C25D5/02 ,  C25D5/48 ,  C23C18/16 ,  C23C18/40 ,  H01L21/288

CPC分类号： C23C18/1653 ,  C23C18/40 ,  C23C18/405 ,  C25D3/38 ,  C25D5/02 ,  C25D5/48 ,  C25D7/123 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/76873 ,  H01L21/76877 ,  H01L21/76898

摘要： The present invention concerns a method for electrodepositing copper into a trench pattern in a structure including the following steps: forming a patterned metal hard mask layer over the dielectric substrate layer; patterning the dielectric layer by using an etch through the patterned metal-based hardmask optionally, forming a barrier and / or liner layer over the surface of the patterned dielectric substrate layer and the hard mask layer; forming over the barrier layer and the hard mask layer a basic metal seed layer by a wet chemical plating method to provide sufficient conductance for subsequent electrolytic deposition of copper; and immersing the dielectric substrate into an electrolytic copper plating bath in an electrolytic copper plating system to electrodeposit copper into the patterned dielectric substrate layer. The hard mask only needs to be removed after copper deposition.

摘要翻译： 本发明涉及一种将铜电沉积成沟槽图案的方法，包括以下步骤：在电介质基底层上形成图案化的金属硬掩模层; 通过使用通过图案化的金属基硬掩模的蚀刻来对介电层进行图案化，任选地，在图案化电介质基底层和硬掩模层的表面上形成阻挡层和/或衬层; 通过湿化学镀方法在阻挡层和硬掩模层上形成碱金属种子层，以提供足够的电导以便随后的铜的电沉积; 将电介质基板浸渍在电解镀铜系统的电解镀铜浴中，将铜电沉积到图案化电介质基板层中。 铜掩模只需要去除硬掩模。