Abstract:
To provide an infrared-reflective pigment and infrared-reflective coating composition provided with both high infrared-light reflecting properties and high visible-light transparency. Provided is a flake-shaped infrared-reflective pigment, the infrared-reflective pigment 1 characterized by being provided with a layered body 13 having at least one metal thin-film layer 11 and at least two transparent dielectric layers 12, the film thickness of the dielectric layer 12 being (an integer multiple of »/4n) ± 10 nm, where » is the wavelength of incident light in a visible-light peripheral region and n is the refractive index of the dielectric layer 12. Also provided is an infrared-reflective coating composition containing the infrared-reflective pigment 1.
Abstract:
There are disclosed porous plate-shaped fillers which are easy to be laminated, a method for producing the porous plate-shaped filler, and a heat insulation film in which a heat insulation effect improves. A porous plate-shaped filler 1 of the present invention is a plate shape having an aspect ratio of 3 or more, a surface shape is one of a round shape, an oval and a round-comer polygonal shape, and its minimum length is from 0.1 to 50 µm. Furthermore, a sectional shape is one of an arch shape, an elliptic shape, and a quadrangular shape in which at least a part of corners is rounded. Consequently, it is possible to obtain the heat insulation film in which the porous plate-shaped fillers 1 are easy to be laminated and the heat insulation effect improves.
Abstract:
Provided is an onboard control apparatus (ECU) having a thermal radiating coating film capable of efficiently radiating heat generated from an electronic component to the outside of the casing. An onboard control apparatus includes: a circuit board stored in a housing; an electronic component mounted on the circuit board; and a thermal radiating coating film which is disposed on the electronic component to radiate heat generated from the electronic components, wherein the thermal radiating coating includes a resin and thermal radiating particles which radiate heat, and the thermal radiating particles and the resin have substantially same specific gravity.
Abstract:
Provided herein are aqueous dispersions. The aqueous dispersions can comprise a first copolymer derived from one or more ethylenically unsaturated monomers, and a second carboxy-functional copolymer derived from one or more carboxylic acid-containing monomers. The aqueous dispersions can be used to prepare low- or zero-VOC aqueous coating compositions that possess desirable properties, including good block resistance and scrub resistance. Coatings and coating formulations comprising the aqueous dispersion, as well as methods of making and using the same are also provided.
Abstract:
An objective of the invention is to provide a urethane-type viscosity modifier composition having good product stability with respect to emulsions using highly hydrophobic monomers. To attain the objective, there is provided a viscosity modifier composition including a compound (A) represented by the following general formula (1) and a compound (B) represented by the following general formula (2) at a mass ratio (A)/(B) of from 70/30 to 95/5. where R 1 to R 4 each represent a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, or an aromatic hydrocarbon group having 6 to 15 carbon atoms, R 5 and R 9 each represent an ethylene group or a propylene group, R 6 and R 8 each represent a divalent saturated hydrocarbon group having 3 to 13 carbon atoms, R 7 represents an ethylene group, x and y represent a number from 0 to 50, n represents a number from 50 to 500, and m represents a number from 1 to 10, where R 10 to R 13 each represent a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, or an aromatic hydrocarbon group
Abstract:
Disclosed is a coated metal pipe including a metal pipe and a multi-layered coating film that covers an outer circumferential surface of the metal pipe. The multi-layered coating film includes a chemical conversion layer and a primer layer, and these layers are provided in this order from the inside. The primer layer contains polyamide imide and at least one kind of additive component selected from polyamide, a fluorine resin, a silane coupling agent, and an epoxy resin.
Abstract:
To provide a composition for a three-dimensional integrated circuit capable of forming a filling interlayer excellent in thermal conductivity also in a thickness direction, using agglomerated boron nitride particles excellent in the isotropy of thermal conductivity, disintegration resistance and kneading property with a resin. A composition for a three-dimensional integrated circuit, comprising agglomerated boron nitride particles which have a specific surface area of at least 10 m 2 /g, the surface of which is constituted by boron nitride primary particles having an average particle size of at least 0.05 µm and at most 1 µm, and which are spherical, and a resin (A) having a melt viscosity at 120°C of at most 100 Pa·s.
Abstract:
The invention relates to a coating composition comprising an oxidatively drying binder and an anti-skinning agent, the anti-skinning agent comprising: a) a diketone of formula (I) (b) an aldoxime or ketoxime of formula (II) wherein R1, R2, R3, R4 and n have the same meaning as that defined by the present application.
Abstract:
Provided is a dendritic silver-coated copper powder which is capable of effectively ensuring a contact, while having excellent electrical conductivity by having the surface coated with silver. This dendritic silver-coated copper powder has excellent uniform dispersibility that is necessary for the formation of a paste, and is suppressed in agglomeration. A silver-coated copper powder according to the present invention is obtained by coating the surface of a copper powder 1, which is an assembly of copper particles 2 and has a dendritic form having a plurality of branches, with silver. Each copper particle 2, the surface of which is coated with silver, is an ellipsoid that has a breadth within the range of from 0.2 µm to 0.5 µm and a length within the range of from 0.5 µm to 2.0 µm. The average particle diameter (D50) of the copper powder 1, which is obtained by coating the surface of the assembly of the ellipsoidal copper particles 2 with silver, is from 5.0 µm to 20 µm.