摘要:
A semiconductor device comprises at least one semiconductor layer (4) of SiC and a layer (8) of a refractory metal nitride separated by an insulating layer (7) being at least next to the SiC layer of SiO2. The insulating layer comprises two sub layers, namely a first sub layer (9) of SiO2 next to the SiC layer and a second sub layer (10) of Si3N4 located between the first sub layer and the metal nitride layer.
摘要:
A semiconductor quantum oscillation device, which realizes Bloch oscillation on the basis of a novel carrier injection scheme, comprises a multilayer semiconductor structure and a means for applying a voltage to said structure. The multilayer structure comprises a tunneling injection region and a pair of oscillation regions which are located on both sides of the tunneling injection region and adjacent to it. The voltage applied across the tunneling region and the pair of oscillation regions causes valence electrons to enter into the conduction band through interband tunneling in the tunneling injection region and leads to electrons and holes being injected into the pair of oscillation regions, respectively. The electrons and holes injected this way undergo quantum oscillation motion and produce far-infrared radiation. The device of the present invention will pave the way for effectively utilizing the electromagnetic spectral resource between the high-end of millimeter-wave and the low-end of far infrared.
摘要:
A MOS transistor is composed of a semiconductor substrate 11 in which a Si thin film 13 is heteroepitaxially grown on a surface of an SiC substrate 12. A source electrode 38 and a drain electrode 34 are so provided that the above SiC substrate 12 is disposed in an output current path. According to this construction, a semiconductor device with a high dielectric strength and current-carrying capacity is achieved.
摘要:
A p-n junction (7) is connected between two terminals (2, 3) and comprises between two semiconductor regions (6, 8) a semiconductor with a breakdown field intensity of at least 106 V/cm. A channel region (9) adjoining the p-n junction is provided in a first one of the two semiconductor regions and is connected in series, between the two terminals, to a silicon device (4). The depletion zone (70) of the p-n junction bears the off-state voltage when the silicon device is off-state. A MOSFET is preferably used as the silicon device.
摘要:
The MIS structure contains an n-drift region (1), a base region (3) arranged on one surface of the drift region (1), an ion-implanted n+ source region (2) in the base region (3), a source electrode (S) short-circuiting the base (3) and source regions (2) and a gate electrode (6) to control the resistance of a channel region (32) of the base region (3) via an insulator region (5). The base region (3) is more highly doped in an ion-implanted p+ partial region (33) beneath the entire source region (2) than in the channel region (32).
摘要:
A semiconductive ceramic composition capable of permitting its resistance-temperature characteristics and resistance to be controlled as desired and a firing temperature of the composition to be lowered to a degree sufficient to facilitate the mass-production at a low cost. The composition contains a main component consisting of SrO, PbO and Ti0 2 and is subjected to firing in an oxidizing atmosphere. The composition may contain at least one of Si0 2 and M as a minor component. A variation in amount of the main and minor components permits characteristics and properties of the composition to be varied as desired.
摘要:
An excellent barrier layer (13A, 13B) can be formed by silicon carbide between a silicon substrate (11) or layer and a metal layer because silicon carbide has many properties similar to those of silicon, has a very slow diffusion rate of a metal through the silicon carbide, or prevents a diffusion of a metal into the silicon, and can be deposited by CVD which has an advantage of a good coverage over a step portion such as a contact window.
摘要:
A thin film transistor characterised in that it comprises, as a switched semiconductor portion thereof, a thin film comprising MP x wherein M represents at least one alkali metal; P represents at least one pnictide; and x ranges from 15 to infinity is disclosed. A process for the production of a transistor characterised in that it comprises vacuum plasma sputtering of successive layers in contact of a semiconductor comprising MP x , wherein M represents at least one alkali metal; P represents at least one pnictide; and x ranges from 15 to infinity; and an insulating layer comprising a pnictide is also disclosed. An insulated semidconductor device characterised in that it comprises as the switched semiconductor portion thereof a layer comprising MP., wherein M represents at least one alkali metal; P represents at least one pnictide; and x ranges from 15 to infinity; and an insulating layer comprising a pnictide is further disclosed. Referring to the accompanying illustrative diagram, a Schottlky barrier thin film field effect transistor in accordance with the present invention may comprise a glass substrate (20), a high pnictide polypnictide semiconductor (22) of high resistivity, a metal (approximately 1 % Ni) doped layer (24) of the same semiconductor material of lower resistivity and metal source (26), gate (28) and drain (30) contacts deposited on layer (24). The present invention provides advances over the prior art.