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    ALUMINUM ALLOY WIRE, ALUMINUM ALLOY STRAND WIRE, COATED ELECTRIC WIRE, WIRE HARNESS, PROCESS FOR PRODUCING ALUMINUM ALLOY WIRE, AND METHOD FOR EXAMINING ALUMINUM ALLOY WIRE
    141.
    发明公开
    ALUMINUM ALLOY WIRE, ALUMINUM ALLOY STRAND WIRE, COATED ELECTRIC WIRE, WIRE HARNESS, PROCESS FOR PRODUCING ALUMINUM ALLOY WIRE, AND METHOD FOR EXAMINING ALUMINUM ALLOY WIRE 审中-公开
    铝合金丝，铝合金丝STRAND，复电线线束，方法铝合金线铝合金丝的研究生产与方法

    公开(公告)号：EP3115473A1

    公开(公告)日：2017-01-11

    申请号：EP14884578.7

    申请日：2014-10-31

    申请人： Furukawa Electric Co. Ltd. ,  Furukawa Automotive Systems Inc.

    发明人： YOSHIDA, Sho ,  SEKIYA, Shigeki ,  MITOSE, Kengo

    IPC分类号： C22C21/00 ,  C22F1/04 ,  G01N25/20 ,  H01B1/02 ,  H01B5/02 ,  H01B5/08 ,  H01B7/00 ,  H01B13/00 ,  C22F1/00

    CPC分类号： H01B1/023 ,  C22C21/00 ,  C22C21/02 ,  C22F1/00 ,  C22F1/04 ,  C22F1/043 ,  H01B5/02 ,  H01B5/08 ,  H01B7/0045 ,  H01B7/02 ,  H01B13/0016 ,  H01B13/0036 ,  H01R11/11

    摘要： Provided is an aluminum alloy wire rod that has a low 0.2% yield strength (YS) to tensile strength (TS) while ensuring a good balance between tensile strength, elongation and conductivity. An aluminum alloy wire rod of the present invention has a composition comprising Mg: 0.10-1.0 mass%, Si: 0.10-1.20 mass%, Fe: 0.01-1.40 mass%, Ti: 0.000-0.100 mass%, B: 0.000-0.030 mass%, Cu: 0.00-1.00 mass%, Ag: 0.00-0.50 mass%, Au: 0.00-0.50 mass%, Mn: 0.00-1.00 mass%, Cr: 0.00-1.00 mass%, Zr: 0.00-0.50 mass%, Hf: 0.00-0.50 mass%, V: 0.00-0.50 mass%, Sc: 0.00-0.50 mass%, Co: 0.00-0.50 mass%, Ni: 0.00-0.50 mass%, and the balance: Al and incidental impurities, Mg/Si mass ratio being 0.4 to 0.8. The aluminum alloy wire rod has a tensile strength of 200 MPa or above, an elongation of 13% or above, a conductivity of 47% IACS, and a ratio (YS/TS) of 0.2% yield strength (YS) to the tensile strength (TS) of 0.7 or less.

    摘要翻译： 本发明提供一种铝合金线材那样具有低的0.2％屈服强度（YS）与抗拉强度（TS），同时确保拉伸强度，伸长率和电导率之间的良好平衡。 本发明的铝合金线材具有组合物包含Mg：按质量计0.10-1.0％以下，Si：0:10至1:20质量％，Fe为0时01分至1:40质量％以下，Ti：从0000到0100质量％，B：0000-0030 质量％的Cu：0点到1点质量％，银：0:00到12点50分质量％，金：0:00到12点50分质量％，Mn：0点到1点质量％以下，Cr：0点到1点质量％以下，Zr：0点到12点50分质量％ 以下，Hf：0：00〜12:50的质量％，V：0:00至12:50质量％，SC：0:00至12:50质量％以下，Co：0:00到12:50质量％以下，Ni：0:00到12:50质量％，和余量的Al及不可避免的杂质， 毫克/ Si的质量比为0.4〜0.8。 所述铝合金线材具有200MPa以上的拉伸强度，在13％或以上的伸长率，47％的导电率IACS，和0.2％屈服强度之比（YS / TS）（YS）与拉伸强度 的0.7或更小（TS）。

    ELECTRONIC CIRCUIT DEVICE
    143.
    发明公开
    ELECTRONIC CIRCUIT DEVICE 审中-公开
    ELEKTRONISCHE SCHALTVORRICHTUNG

    公开(公告)号：EP3093882A1

    公开(公告)日：2016-11-16

    申请号：EP14877890.5

    申请日：2014-12-15

    申请人： Furukawa Electric Co. Ltd.

    发明人： KOJIMA Naoyuki ,  SATO Shunichiro ,  HIKASA Kazuhito ,  FUJIWARA Hidemichi

    IPC分类号： H01L23/12 ,  H01L23/36 ,  H05K1/02

    CPC分类号： H01L23/42 ,  H01L23/367 ,  H01L23/3735 ,  H01L23/3736 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/8384 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/0271 ,  H05K1/0306 ,  H01L2924/00

    摘要： To improve the heat dissipating effect of a conductor layer while suppressing a crack of a substrate along an interface between an insulating layer and a conductor layer. An electronic circuit device (100) has an insulating layer (10), a conductor layer (2) provided on at least one face side of the insulating layer (10), and a heat generating element (4) provided on a face of the conductor layer (2) at a side opposite of the insulating layer (10) via a joining layer (3). The conductor layer (2) has a heat dissipating conductor layer (21) located on a heat generating element (4) side and a circuit layer (22) located on an insulating layer (10) side, and the shortest distance (l 1 ) between a side end portion of the heat generating element (4) and a side end portion of the heat dissipating conductor layer (21) on a face of the heat dissipating conductor layer (21) on the circuit layer (22) side is greater than or equal to a thickness (t 1 ) of the heat dissipating conductor layer (21).

    摘要翻译： 为了提高导体层的散热效果，同时抑制沿着绝缘层和导体层之间的界面的基板的裂纹。 电子电路装置（100）具有绝缘层（10），设置在绝缘层（10）的至少一个面侧的导体层（2）和设置在绝缘层（10）的表面上的发热元件 导体层（2）经由接合层（3）与绝缘层（10）相对的一侧。 导体层（2）具有位于发热元件（4）侧的散热导体层（21）和位于绝缘层（10）侧的电路层（22），并且最短距离（l 1） 在电路层（22）侧的散热导体层（21）的面上的发热元件（4）的侧端部与散热导体层（21）的侧端部之间的距离大于 或等于散热导体层（21）的厚度（t 1）。

    INSULATED WIRE, COIL, ELECTRICAL/ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING INSULATED WIRE IN WHICH COATING FILM SEPARATION IS PREVENTED
    144.
    发明公开
    INSULATED WIRE, COIL, ELECTRICAL/ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING INSULATED WIRE IN WHICH COATING FILM SEPARATION IS PREVENTED 有权
    绝缘电线线圈，电气/电子装置及其制造方法的绝缘导线，当覆膜剥离防止

    公开(公告)号：EP3089168A1

    公开(公告)日：2016-11-02

    申请号：EP14873847.9

    申请日：2014-12-17

    申请人： Furukawa Electric Co. Ltd. ,  Furukawa Magnet Wire Co., Ltd.

    发明人： IKEDA, Keisuke ,  OYA, Makoto ,  FUKUDA, Hideo ,  TOMIZAWA, Keiichi

    IPC分类号： H01B7/02 ,  H01B3/30 ,  H01B3/42 ,  H01B13/00

    CPC分类号： H01B3/306 ,  H01B3/307 ,  H01B3/308 ,  H01B3/421 ,  H01B3/427 ,  H01B13/065 ,  H01F27/2823 ,  H01F27/32

    摘要： An insulated wire comprising a laminated resin-coated insulated wire containing: a thermosetting resin layer (A) directly or via an insulating layer (D) on a conductor having a rectangular cross-section; and at least a thermoplastic resin layer (B) on the outer periphery of the thermosetting resin layer (A), in which the cross-sectional shape of the thermosetting resin layer (A) composed of two pairs of two sides facing each other, and has at least four convex portions each of which has a film thickness in maximum, at least one convex portion of the at least four convex portions is on each of the four sides, or at least two convex portions of the at least four convex portions are at least on each of the two sides facing each other, and in the each side having the convex portion, provided that a minimum film thickness is designated as "a" µm, and an average of maximum film thicknesses of the convex portions is designated as "b" µm, the a/b ratio is 0.60 or more and 0.90 or less; a coil, and electric/electronic equipments as well as a method of preventing a film delamination of an insulated wire.

    摘要翻译： 一种绝缘电线，其包括层压树脂涂覆的绝缘电线包含：在绝缘上具有矩形横截面的导体层（D）直接或通过热固性树脂层（A）; 和至少在所述热固性树脂层（A）的外周上的热塑性树脂层（B），其中彼此面对的两个两个成对的侧面中的组成的热固性树脂层（A）的横截面形状，并且 具有至少4个凸部的每一个具有在最大的膜厚度，该至少4个凸部中的至少一个凸部是在每个四边的，或所述至少4个凸部中的至少两个凸部是 至少在所述两个侧面彼此面对，并在每一侧具有凸部的，提供确实的最小膜厚度被指定为“A”微米，平均凸部的最大膜厚度被指定为 “b”的微米时，a / b比为0.60以上且0.90以下; 的线圈，和电气/电子设备，以及防止绝缘电线的膜剥离的方法。

    HEAT RECEIVING STRUCTURE AND HEAT SINK
    145.
    发明公开
    HEAT RECEIVING STRUCTURE AND HEAT SINK 审中-公开
    KÜHLKÖRPER的WÄRMEAUFNAHMESTRUKTUR

    公开(公告)号：EP3088829A1

    公开(公告)日：2016-11-02

    申请号：EP14873624.2

    申请日：2014-12-22

    申请人： Furukawa Electric Co., Ltd.

    发明人： HIRASAWA, Takeshi ,  SASAKI, Chiyoshi ,  IKEDA, Masami

    IPC分类号： F28D15/02 ,  H01L23/427 ,  H05K7/20

    摘要： A heat receiving structure and a heat sink that can ensure a sufficient contact area between a heat pipe and a heat receiving member, and are high in strength are provided. The heat receiving structure includes heat receiving blocks 7 and 8 that have concave inner faces 7A and 8A along an external shape 3A of a heat pipe 3, in which extended portions 11 and 12 at both sides that continue to the inner faces 7A and 8A extend inward in a radial direction of the heat pipe 3 while covering the heat pipe 3, and the heat pipe 3 is sandwiched by the heat receiving blocks 7 and 8 from both sides and joined.

    摘要翻译： 提供了能够确保热管与受热部件之间的充分的接触面积并且强度高的受热结构和散热器。 热接收结构包括沿着热管3的外形3A具有凹入的内表面7A和8A的热接收块7和8，其中延伸部分11和12在两侧延伸到内表面7A和8A延伸 在覆盖热管3的同时沿着热管3的径向向内侧，并且热管3从两侧被热接收块7和8夹持，并且接合。

    COOLING DEVICE
    147.
    发明公开
    COOLING DEVICE 审中-公开
    KÜHLVORRICHTUNG

    公开(公告)号：EP2933593A4

    公开(公告)日：2016-11-02

    申请号：EP13863431

    申请日：2013-12-09

    申请人： FURUKAWA ELECTRIC CO LTD

    发明人： ISEMURA MASAKAZU ,  OKAMOTO TSUYOSHI ,  YAMADA HIROSHI ,  KONISHI KAZUHIRO ,  SANO MASAKI

    IPC分类号： F28D15/02 ,  F28F1/32 ,  F28F3/02 ,  F28F13/00 ,  H05K7/20

    CPC分类号： F28D15/0275 ,  F28F1/32 ,  F28F3/022 ,  F28F13/00 ,  F28F2013/006 ,  F28F2215/04 ,  F28F2275/04 ,  F28F2275/122 ,  H05K7/20154 ,  H05K7/20936

    摘要： Provided is a cooling apparatus having a heat dissipation fin disposed also at a bent portion of a heat pipe near the heat receiving block and being configured to evenly receive a wind by all the heat dissipation fins, to thereby improve cooling capacity. The cooling apparatus (10) includes a heat receiving block (2) thermally connected to electronic components (H1, H2) constituting heating elements, a heat pipe (3) that is provided to stand on a surface of the heat receiving block (2) and configured to receive heat from the heat receiving block (2) and to transport heat, and a plurality of fins (4) attached to the heat pipe (3). The fins (4) include a first fin group (41) disposed at a straight portion (34) and a second fin group (42) disposed at a bent portion (33) of the heat pipe (3).

    摘要翻译： 本发明提供一种散热片，其散热片也设置在热接收块附近的热管的弯曲部，并且被构造为均匀地接收所有散热片的风，从而提高冷却能力。 冷却装置（10）具有与构成加热元件的电子部件（H1，H2）热连接的热接收块（2），设置在该受热块（2）的表面上的热管（3） 并且构造成从所述受热块（2）接收热量并输送热量，以及附接到所述热管（3）的多个翅片（4）。 翅片（4）包括设置在直管部分（34）处的第一翅片组（41）和设置在热管（3）的弯曲部分（33）处的第二翅片组（42）。

    CONDUCTIVE ADHESIVE FILM
    149.
    发明公开
    CONDUCTIVE ADHESIVE FILM 审中-公开
    LEITFÄHIGEHAFTFOLIE

    公开(公告)号：EP3081610A1

    公开(公告)日：2016-10-19

    申请号：EP15835176.7

    申请日：2015-08-10

    申请人： Furukawa Electric Co. Ltd.

    发明人： MIHARA, Naoaki ,  KIRIKAE, Noriyuki ,  SUGIYAMA, Jirou ,  AOYAMA, Masami

    IPC分类号： C09J7/00 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J183/04 ,  H01L21/301 ,  H01L21/52

    CPC分类号： C09J9/02 ,  C08K3/08 ,  C08K2003/085 ,  C09J7/00 ,  C09J11/04 ,  C09J11/06 ,  C09J183/04 ,  H01L21/52 ,  H01L21/6836 ,  H01L21/78

    摘要： An adhesive film that shows excellent heat resistance while showing excellent stress relaxation property, which further shows high conductivity that enables application to rear-side electrodes for power semiconductors without the use of expensive precious metals such as silver, which also shows sufficient adhesive strength without protruding from the device, and a method for processing semiconductors using the same, are provided.
    In particular, a conductive adhesive film, which comprises two or more types of metal particles including at least Cu and a polymer that has a polydimethylsiloxane structure, is provided. Further, a dicing die bonding film, which is obtained by laminating a dicing tape on said conductive adhesive film, as well as a method for processing semiconductor wafers using said adhesive film and said dicing die bonding film, are provided.

    摘要翻译： 显示优异的耐热性同时显示出优异的应力松弛特性的粘合剂膜，其进一步显示出能够应用于功率半导体的后侧电极的高导电性，而不使用昂贵的贵金属如银，这也显示出足够的粘合强度而没有突出 提供了使用该装置的半导体处理方法。 特别地，提供了包含至少包含Cu的两种或更多种金属颗粒和具有聚二甲基硅氧烷结构的聚合物的导电粘合剂膜。 此外，提供了通过将切割带层压在所述导电粘合膜上而获得的切割芯片接合膜以及使用所述粘合剂膜和所述切割芯片接合膜来处理半导体晶片的方法。