公开(公告)号：EP3046117A4

公开(公告)日：2017-05-17

申请号：EP14851852

申请日：2014-10-09

申请人： HITACHI CHEMICAL CO LTD

发明人： SONG SHIHUI ,  YAMAMOTO TAKAYA ,  TAKEZAWA YOSHITAKA

IPC分类号： H01B17/60 ,  C09J7/02 ,  H01B3/04 ,  H01F5/06 ,  H02K3/30

CPC分类号： H01B3/04 ,  C09J7/20 ,  H01F5/06

摘要： A prepreg mica tape includes: a backing material (3); a boron nitride-containing layer (1) that is provided on or above one surface of the backing material (3) and that includes a boron nitride particle (5) and a first resin (4); and a mica-containing layer (2) that is provided on or above the surface of the backing material (3) on which the boron nitride-containing layer (1) is provided and that includes mica (6) and a second resin (4).

摘要翻译： 预浸云母带包括：背衬材料（3）; （3）的一个表面上或上方设置并包含氮化硼颗粒（5）和第一树脂（4）的含氮化硼层（1）; 和设置在其上设置含氮化硼层（1）的背衬材料（3）的表面上的包含云母（6）和第二树脂（4）的含云母层（2） ）。

公开(公告)号：EP2955724A1

公开(公告)日：2015-12-16

申请号：EP14749364.7

申请日：2014-02-04

申请人： Furukawa Electric Co., Ltd. ,  Furukawa Magnet Wire Co., Ltd.

发明人： MUTO, Daisuke ,  OYA, Makoto ,  TOMIZAWA, Keiichi

IPC分类号： H01B7/02 ,  B32B5/18 ,  B32B27/08 ,  H01B17/60 ,  H01F5/06 ,  H02K3/30

CPC分类号： H01B7/02 ,  H01B3/306 ,  H01B3/308 ,  H01B7/29 ,  H01B13/065 ,  H01F5/06 ,  H02K3/30 ,  Y10T428/2495 ,  Y10T428/24975 ,  Y10T428/2935

摘要： An enamel resin-insulating laminate that has a foamed region including cells and a non-foamed region including no cells on at least one surface of the foamed region, and is shaped into a flat plate form or cylindrical form, wherein the foamed region is configured such that a non-cell layer including no cells has cell layers formed of closed cells on both surface sides of the non-cell layer, a thickness of the non-cell layer is larger than a thickness of a partition wall among the closed cells, and 5 to 60% of a thickness of the foamed region, and at least the cell layer in the foamed region is formed of a thermosetting resin; an inverter surge-resistant insulated wire having a conductor and the enamel resin-insulating laminate; and electric/electronic equipment.

摘要翻译： 1.一种搪瓷树脂绝缘层叠体，其具有发泡区域，所述发泡区域包括单元和在所述发泡区域的至少一个表面上不包含单元的非发泡区域，并且被成形为平板形式或圆柱形，其中所述发泡区域被配置 使得不含细胞的非细胞层在非细胞层的两个表面侧都具有由闭孔形成的细胞层，非细胞层的厚度大于闭孔中的分隔壁的厚度， 和5〜60％的发泡区域的厚度，发泡区域中的至少泡孔层由热固性树脂形成; 具有导体和搪瓷树脂绝缘层压板的逆变器耐冲击绝缘线; 和电气/电子设备。

公开(公告)号：EP2945169A1

公开(公告)日：2015-11-18

申请号：EP13870918.3

申请日：2013-12-11

申请人： Mitsubishi Electric Corporation

发明人： MABUCHI, Takahiro ,  YAMAMOTO, Shigeyuki ,  TSUKIJI, Makoto ,  SAKO, Hiroshi

IPC分类号： H01B17/60 ,  H01B17/56 ,  H01B19/00 ,  H02K3/34

CPC分类号： B32B19/048 ,  B32B5/16 ,  B32B5/30 ,  B32B7/12 ,  B32B19/02 ,  B32B19/04 ,  B32B19/045 ,  B32B27/20 ,  B32B27/36 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/10 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/107 ,  B32B2307/206 ,  B32B2307/302 ,  B32B2307/304 ,  B32B2457/00 ,  H01B3/04 ,  H01B17/60 ,  H01B19/04 ,  H02K3/30 ,  H02K3/34 ,  Y10T428/251

摘要： The present invention is an insulating tape including: a mica layer containing mica; a reinforcing layer that is laminated onto the mica layer and contains a filler and a fibrous reinforcing material; and a flat sheet layer that is laminated onto the reinforcing layer and contains flat sheet-shaped inorganic particles having an aspect ratio of at least 30. In this insulating tape, the filler is supported in advance, and does not therefore flow out during manufacture of a stator coil (during hot-pressing in particular). As a result, an insulating coating exhibiting high thermal conductivity can be formed.

摘要翻译： 本发明是一种绝缘胶带，包括：含有云母的云母层; 层叠在云母层上并含有填料和纤维增强材料的增强层; 以及层叠在增强层上的平板状层，并且包含长径比为至少30°的平板状无机颗粒。在该绝缘带中，填料预先被支撑，因此在制造过程中不会流出 定子线圈（特别是在热压时）。 结果，可以形成表现出高导热性的绝缘涂层。

公开(公告)号：EP2163572B1

公开(公告)日：2014-08-13

申请号：EP08764862.2

申请日：2008-05-29

申请人： Teijin Dupont Films Japan Limited

发明人： TOJO, Mitsuo

IPC分类号： C08J5/18 ,  B29C55/12 ,  B32B27/36 ,  H01B3/42 ,  H01B17/60 ,  H02K3/30 ,  H02K3/34

CPC分类号： H02K3/30 ,  B29C55/143 ,  B29K2067/00 ,  B29K2995/0007 ,  B32B7/12 ,  B32B27/08 ,  B32B27/18 ,  B32B27/34 ,  B32B27/36 ,  B32B2250/24 ,  B32B2264/0214 ,  B32B2264/0235 ,  B32B2264/025 ,  B32B2264/10 ,  B32B2270/00 ,  B32B2307/206 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2307/308 ,  B32B2307/50 ,  B32B2307/518 ,  B32B2307/714 ,  B32B2457/04 ,  B32B2605/08 ,  Y10T428/31725 ,  Y10T428/31736 ,  Y10T428/31786

公开(公告)号：EP1930915A4

公开(公告)日：2014-06-25

申请号：EP06798413

申请日：2006-09-28

申请人： TOSHIBA KK

发明人： SAWA FUMIO ,  IWATA NORIYUKI ,  HATANO HIROSHI ,  OKAMOTO TETSUSHI ,  MUKAI KAZUMA ,  ASO TOSHIYUKI ,  KAWAHARA MAKOTO ,  KAKIUCHI MIKIO

IPC分类号： H01B17/56 ,  H01B3/04 ,  H01B17/60 ,  H01F27/32 ,  H02K3/30 ,  H02K3/32 ,  H02K3/34

CPC分类号： H02K3/30 ,  H01B3/04 ,  H01F27/323 ,  H02K3/40 ,  Y10T428/294 ,  Y10T428/31525 ,  Y10T442/3252

公开(公告)号：EP0933786B1

公开(公告)日：2005-07-20

申请号：EP99300750.9

申请日：1999-02-02

申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD.

发明人： Kondo, Mamoru ,  Takigawa, Hiroshi ,  Hata, Ryosuke ,  Yorita, Jun ,  Horikawa, Takahiro ,  Ashibe, Yuichi ,  Seki, Morihiro

IPC分类号： H01B3/54 ,  H01B7/02 ,  H01B3/22 ,  H01B9/06 ,  H01B17/60

CPC分类号： H01B7/292 ,  H01B3/22 ,  H01B3/28 ,  H01B3/441 ,  H01B7/14 ,  H01B9/0611 ,  H01B9/0688

公开(公告)号：EP1345241A4

公开(公告)日：2004-09-08

申请号：EP01997819

申请日：2001-11-26

申请人： DAIKIN IND LTD

发明人： YAMAMOTO KATSUTOSHI ,  YAMAMOTO SEIGO ,  CHAEN SHINICHI ,  ASANO JUN ,  KONISHI TOMOHISA

IPC分类号： B32B5/26 ,  B32B5/28 ,  B32B27/28 ,  D06M17/00 ,  H01L23/14 ,  H05K1/03 ,  H01B17/60

CPC分类号： H05K1/0366 ,  B32B5/28 ,  B32B27/28 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2203/065 ,  H05K2203/1105

摘要： An electrical insulating plate (1), which comprises a base cloth (3) and a web layer (5), wherein the web layer (5) comprises a fluororesin fiber and is joined by entanglement with the base cloth and laminated on both the surfaces of the base cloth, and wherein at least one surface of the web layer (5) has been subjected to a heat treatment at the melting temperature of the fluororesin fiber or higher under pressure.

公开(公告)号：EP1411028A1

公开(公告)日：2004-04-21

申请号：EP02738689.5

申请日：2002-06-13

申请人： SEIKO EPSON CORPORATION

发明人： NATORI, Eiji ,  KIJIMA, Takeshi ,  FURUYAMA, Koichi ,  TASAKI, Yuzo

IPC分类号： C01B13/14 ,  C01G1/00 ,  H01B17/60 ,  H01B19/00 ,  H01L27/10 ,  B32B18/00 ,  B32B9/00

CPC分类号： C04B35/457 ,  C04B35/01 ,  C04B35/16 ,  C04B35/42 ,  C04B35/4521 ,  C04B35/465 ,  C04B35/472 ,  C04B35/475 ,  C04B35/491 ,  C04B35/493 ,  C04B35/495 ,  C04B35/497 ,  C04B35/624 ,  C04B35/6264 ,  C04B35/62645 ,  C04B35/64 ,  C04B2235/3205 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3215 ,  C04B2235/3224 ,  C04B2235/3227 ,  C04B2235/3232 ,  C04B2235/3244 ,  C04B2235/3251 ,  C04B2235/3256 ,  C04B2235/3258 ,  C04B2235/3287 ,  C04B2235/3296 ,  C04B2235/3298 ,  C04B2235/3418 ,  C04B2235/3427 ,  C04B2235/3436 ,  C04B2235/3445 ,  C04B2235/3454 ,  C04B2235/3463 ,  C04B2235/664 ,  C04B2235/76 ,  C04B2235/80 ,  C23C14/08 ,  C23C16/40 ,  C23C16/409 ,  C23C18/1208 ,  C23C18/1225 ,  H01L21/02197 ,  H01L21/02282 ,  H01L21/31691 ,  H01L27/11502 ,  H01L27/11507 ,  H01L41/1878 ,  H01L41/318

摘要： A method of manufacturing a ceramic film includes forming the ceramic film by crystallizing a ceramic raw material liquid which includes a first raw material liquid and a second raw material liquid. The first raw material liquid and the second raw material liquid are different types of liquids, the first raw material liquid is a raw material liquid for producing a ferroelectric, the second raw material liquid is a raw material liquid for producing an oxide such as an ABO-type oxide, a solvent included in the first raw material liquid and a solvent included in the second raw material liquid have different polarities, and the ceramic film is formed in a state in which the first raw material liquid and the second raw material liquid are phase separated so that first crystals formed of the first raw material liquid are intermittently formed in a surface direction of the ceramic film and second crystals formed of the second raw material liquid are formed so as to interpose between the first crystals.

公开(公告)号：EP1005697A4

公开(公告)日：2002-07-24

申请号：EP98945755

申请日：1998-08-13

申请人： MAC LEAN FOGG CO

发明人： PAZDIREK JIRI V ,  GAERTNER ERNST MATTHEW ,  BURZAWA MICHAEL T

IPC分类号： B60G7/00 ,  B29C53/58 ,  B29C53/80 ,  B29C70/86 ,  F16C7/00 ,  F16C7/02 ,  H01B17/14 ,  H01B17/06 ,  H01B17/12 ,  H01B17/32 ,  H01B17/38 ,  H01B17/60

CPC分类号： F16C7/026 ,  B29C53/585 ,  B29C53/805 ,  B29C70/86 ,  B29L2031/06 ,  B29L2031/748 ,  B60G2206/11 ,  B60G2206/7101 ,  B60G2206/85 ,  H01B17/14 ,  Y10T74/2142 ,  Y10T74/2151

摘要： A composite link includes a fiberglass body. The body is formed by coating glass fibers with a liquid resin and winding the fibers around a plurality of end pieces or bushings. The end pieces have transition sections for smoothly changing the shape of the composite link and the path of the fibers. The fibers are wound in two layers, a first extending longitudinally of the body and the second transversaly and around the first. A shield layer is placed over the fiberglass body.

公开(公告)号：EP1197972A1

公开(公告)日：2002-04-17

申请号：EP01124035.5

申请日：2001-10-09

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： Tomaru, Kazuhiko ,  Yoneyama, Tsumotu ,  Handa, Ryuichi

IPC分类号： H01B17/60 ,  C08K11/00 ,  C08L23/00

CPC分类号： C08K3/01 ,  C08L23/00

摘要： A heat-softening heat-radiation sheet including a polyolefin-based heat-conductive composition which comprises a polyolefin and a heat-conductive filler, has a softening point of 40°C or above, has a thermal conductivity of 1.0 W/mK or higher, has a viscosity at 80°C of from 1 x 10 2 to 1 x 10 5 Pa·s and has a plasticity at 25°C in the range of from 100 to 700. This heat-radiation sheet which is in the form of a solid sheet at room temperature, can readily be attached to or detached from electronic components and a heat sink, is capable of softening by the heat generated during operation of electronic components, to have the interfacial contact thermal resistance at a negligible level, and has a superior heat-radiation performance.

摘要翻译： 包含聚烯烃和导热性填料的聚烯烃类导热性组合物的软化热散射片的软化点为40℃以上，热导率为1.0W / m·K以上 在80℃下具有1×10 2至1×10 5 Pa的粘度，并且在25℃下的塑性在100至700的范围内。该热辐射片是 在室温下以固体片的形式，可以容易地附接到电子部件和散热器上或从电子部件和散热器分离，并且能够通过在电子部件的操作期间产生的热而软化，使界面接触热阻达到可忽略的程度 水平，并具有优异的散热性能。