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33 条记录 (耗时 0.013 秒)

    Process for fabricating an integrated circuit
    11.
    发明公开
    Process for fabricating an integrated circuit 失效
    Verfahren zur Herstellung einer integrierten Schaltung。

    公开(公告)号：EP0675536A1

    公开(公告)日：1995-10-04

    申请号：EP95301883.5

    申请日：1995-03-21

    申请人： AT&T Corp.

    发明人： Degani, Yinon ,  Kossives, Dean Paul

    IPC分类号： H01L21/78 ,  H01L21/304

    CPC分类号： H01L21/6835 ,  H01L21/304 ,  H01L21/78 ,  Y10S148/028

    摘要： A process for fabricating devices is disclosed. Numerous devices (20) are formed on a substrate (10). The substrate is then placed on an adhesive tape (55) mounted on a dicing ring. The devices are then separated into individual chips by dicing the substrate. Prior to dicing, the substrate is coated with a material that is relatively insoluble in water. After the substrate is diced, the coating is removed by rinsing the substrate with an organic solvent in which the material is substantially soluble. The organic solvent dissolves the coating but does not dissolve the adhesive on the tape or otherwise adversely effect the adhesion between the tape and the substrate.

    摘要翻译： 公开了一种用于制造器件的工艺。 许多器件（20）形成在衬底（10）上。 然后将衬底放置在安装在切割环上的胶带（55）上。 然后通过切割衬底将器件分离成单独的芯片。 在切割之前，用相对不溶于水的材料涂覆基材。 在切割基材之后，通过用其中材料基本可溶的有机溶剂冲洗基底来除去涂层。 有机溶剂溶解涂层，但不会将粘合剂溶解在胶带上或以其他方式不利地影响胶带和基材之间的粘附。

    Surface mount solder assembly of leadless integrated circuit packages to substrates
    16.
    发明公开
    Surface mount solder assembly of leadless integrated circuit packages to substrates 失效
    OberflächenmontierteLötanordnungvon integrierten Schaltungspackungen ohneDrahtanschlüsse。

    公开(公告)号：EP0645948A1

    公开(公告)日：1995-03-29

    申请号：EP94306928.6

    申请日：1994-09-21

    申请人： AT&T Corp.

    发明人： Degani, Yinon ,  Dudderar, Thomas Dixon ,  Woods, William Lonzo, Jr.

    IPC分类号： H05K3/34 ,  B23K3/06

    CPC分类号： H01L24/81 ,  H01L21/4853 ,  H01L2224/13111 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/1225 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/0379 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/043 ,  H05K2203/0545 ,  Y02P70/613

    摘要： Described are a process for soldering at least one component having solder bumps (12) to a substrate and a process for forming solder bumps (12) on metal pads (13) of an element, such as an IC package (10) or substrate (11) or both. The bumps (12) are formed by stencil printing solder paste deposits (21) on the metal pads (13), heating the solder paste deposits (21) to reflow temperature of the solder in the solder paste deposits (21), and allowing the molten solder in each deposit to coalesce and during subsequent cooling solidify forming the bumps (12) on the metal pads. The bumps are formed by conducting the stencil printing through apertures (20) in an ultra-thick stencil (19), the apertures (20) having trapezoidal crossection in the plane normal to the broad surfaces of the stencil with the top opening being smaller than the bottom opening and with the walls of the aperture sloping at an angle within a range of from 1 to 45 degrees from the vertical, the solder paste having a low tackiness and high metal loading, and the solder paste deposits (21) covering an area which is equal to or exceeds an area of the metal pad (13) in any ratio between 1.5:1 and 5:1. Bumps formed in this manner lead to the formation of reliable solder joints.

    摘要翻译： 描述了将至少一个具有焊料凸块的部件焊接到基板上的工艺，以及用于在诸如IC封装或基板或两者的元件的金属焊盘上形成焊料凸块的工艺。 凸块通过在金属焊盘上的模版印刷焊膏沉积物形成，加热焊膏沉积物以回流焊膏沉积物中的焊料的温度，并且允许每个沉积物中的熔融焊料聚结并且在随后的冷却期间固化形成凸块 在金属垫上。 通过在超厚模板中的孔进行模版印刷来形成凸块，该孔在垂直于模板的宽表面的平面中具有梯形横截面，顶部开口小于底部开口，并且壁的壁 孔径与垂直于1至45度的角度倾斜，焊膏具有低粘性和高金属负载，并且焊膏沉积覆盖等于或超过金属垫的面积的面积 在1.5：1和5：1之间的任何比例。 以这种方式形成的冲击导致形成可靠的焊点。

    Movable fiber optical switch
    17.
    发明公开
    Movable fiber optical switch 失效
    Verstellbarer faseroptischer Schalter。

    公开(公告)号：EP0400878A2

    公开(公告)日：1990-12-05

    申请号：EP90305584.6

    申请日：1990-05-23

    申请人： AT&T Corp.

    发明人： Dautartas, Mindaugas Fernand ,  Degani, Yinon ,  Kraetsch, Richard Thomas ,  Pimpinella, Richard J. ,  Tai, King L.

    IPC分类号： G02B26/02 ,  G02B26/08

    CPC分类号： G02B6/3508 ,  G02B6/3558 ,  G02B6/3562 ,  G02B6/3572

    摘要： An m- input/n- output (e.g., 2x2) optical fiber switch (10 M ) is disclosed which alters the location of the fibers (20, 22, 24, 26) by the application of an external force. Illustratively, the switch uses a housing with a diamond-shaped opening (11) extending therethrough, with pairs of optical fibers positioned in orthogonally located V-grooves (16, 18). Upon the application of an external force, the fibers are moved into the remaining, vacant V-­grooves (13, 15) formed by the diamond-shaped opening. In a preferred embodiment, a (2x2) switch is magnetically activated.
    As mentioned above, switching into the alternate (e.g., transmit/receive) state of switch (10 M ) is accomplished by the use of appropriately placed soft magnetic (e.g., permalloy) pieces in conjunction with an applied electrical signal which propagates along a coil (17) encircling switch (10 M ). In one particular configuration, the soft magnetic pieces take the form of rods (46), (48), (50) and (58), (60), (62) which are disposed in V-grooves formed parallel to fiber-holding V-grooves (16) and (18). As shown, a first set of soft magnetic pieces (46), (48) and (50) are positioned within a first V-groove (52) located adjacent to interface (vacant) V-groove (15) of opening (11). The pieces are disposed such that gaps (54) and (56) between the adjacent pieces are substantially aligned with magnetic sleeves (36) and (32). Therefore, upon application of an electrical signal to coil (17) a magnetic field will be created in the gaps, causing sleeves (36) and (32) to be attracted to gaps (54) and (56), respectively. Thus, free ends (E₂₆), (E₂₂) of fibers (26) and (22) will move to occupy interface V-groove (15) such that optical coupling is achieved. In association with the system description, the coupling of fibers (22) and (26) may serve to connect the fiber entering the optical transmitter (fiber 26) to the fiber re-entering the communication ring (fiber 22).

    摘要翻译： 公开了通过施加外力来改变光纤（20,22,24,26）的位置的m输入/ n-输出（例如，2x2）光纤开关（10M）。 示例性地，开关使用具有延伸穿过其中的菱形开口（11）的壳体，其中成对的光纤定位在正交位置的V形槽（16,18）中。 在施加外力时，纤维被移动到由菱形开口形成的剩余的空的V形槽（13,15）中。 在优选实施例中，（2x2）开关被磁激活。 如上所述，切换到开关（10M）的交替（例如，发送/接收）状态是通过使用适当放置的软磁（例如，坡莫合金）部件结合沿着线圈传播的施加的电信号来实现的（ 17）环绕开关（10M）。 在一个特定的配置中，软磁片呈杆状（46），（48），（50）和（58），（60），（62）的形式，它们设置在平行于光纤夹持 V形槽（16）和（18）。 如图所示，第一组软磁片（46），（48）和（50）位于与开口（11）的接口（空）V形槽（15）相邻的第一V形槽（52）内， 。 这些片被设置成使得相邻片之间的间隙（54）和（56）基本上与磁性套筒（36）和（32）对准。 因此，当向线圈（17）施加电信号时，将在间隙中产生磁场，从而使套筒（36）和（32）分别被吸引到间隙（54）和（56）。 因此，纤维（26）和（22）的自由端（E26），（E22）将移动以占据界面V形槽（15），从而实现光耦合。 与系统描述相关联，光纤（22）和（26）的耦合可以用于将进入光发射器（光纤26）的光纤连接到再次进入通信环（光纤22）的光纤。