Apparatus for microwave processing in a magnetic field
    11.
    发明公开
    Apparatus for microwave processing in a magnetic field 失效
    Gerbe zur Bearbeitung mittels Mikrowellen in einem magnetischen Feld。

    公开(公告)号:EP0402867A2

    公开(公告)日:1990-12-19

    申请号:EP90111110.4

    申请日:1990-06-12

    IPC分类号: H01J37/32 H05H1/46

    摘要: A microwave-assisted plasma processing apparatus has a reaction chamber in which a substrate holder (13) is provided to support a substrate (1) to be treated. The holder is formed congruent with the inside of reaction chamber and located to substantially separate a reaction space (19) in the reaction chamber save for a narrow clearance therebetween through which exhausted gas passes from said reaction space into said auxiliary space. By this strucure, high density plasmas can be formed in the reaction chamber without substantial loss of input microwave energy.

    摘要翻译: 微波辅助等离子体处理装置具有反应室,在该反应室中设置有用于支撑待处理的基板(1)的基板支架(13)。 保持器与反应室的内部形成为一致并且被设置成基本上分离反应室中的反应空间(19),除了其间的窄间隙,排出的气体从所述反应空间通过所述反应空间进入所述辅助空间。 通过这种结构,可以在反应室中形成高密度等离子体,而不会大量损失输入的微波能量。

    Manufacture of semiconductor device
    12.
    发明公开
    Manufacture of semiconductor device 审中-公开
    半导体器件的制造

    公开(公告)号:EP2259300A3

    公开(公告)日:2017-08-16

    申请号:EP10176959.4

    申请日:2004-10-19

    IPC分类号: H01L21/762 H01L21/84

    摘要: A method for manufacturing a semiconductor device, comprising the steps of: forming a peeling layer containing an element and a terminal electrode over a first substrate; peeling the peeling layer and the terminal electrode from the first substrate; pasting a second substrate to the peeling layer and the terminal electrode with an adhesive material; and pressure-bonding an FPC to the terminal electrode in which a circumference is covered with a protective layer.

    摘要翻译: 一种制造半导体器件的方法,包括以下步骤:在第一衬底上形成含有元件和端电极的剥离层; 从第一基板剥离剥离层和端子电极; 用粘合材料将第二衬底粘贴到剥离层和端子电极上; 并将FPC压接到其周围被保护层覆盖的端子电极。

    Manufacturing method of light emitting device and manufacturing device thereof
    17.
    发明公开
    Manufacturing method of light emitting device and manufacturing device thereof 有权
    一种用于制造发光器件和制造装置为此过程

    公开(公告)号:EP1437777A3

    公开(公告)日:2010-11-17

    申请号:EP03028484.8

    申请日:2003-12-12

    IPC分类号: H01L51/20 H01L21/00

    摘要: It is an object of the present invention to provide a light emitting device having a structure wherein oxygen and moisture are prevented from reaching to the light emitting device, and to provide a manufacturing method thereof. It is another object of the present invention to seal a light emitting device in fewer steps without encapsulating a desiccant.
    The present invention provides a structure in which a pixel region 13 is surrounded by a first sealing material (having higher viscosity than a second sealing material) 16 including a spacer (filler, minute particles and/or the like) which maintains a gap between the two substrates, filled with a few drops of the transparent second sealing material 17a which is spread in the region; and sealed by using the first sealing material 16 and the second sealing material 17.