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公开(公告)号：EP3670621A1
公开(公告)日：2020-06-24
申请号：EP19173321.1
申请日：2019-05-08
IPC分类号： C09G1/02
摘要： This disclosure relates to a polishing composition that includes at least one abrasive; at least one nitride removal rate reducing agent, an acid or a base; and water. The at least one nitride removal rate reduce agent can include a hydrophobic portion containing a C 12 to C 40 hydrocarbon group; and a hydrophilic portion containing at least one group selected from the group consisting of a sulfinite group, a sulfate group, a sulfonate group, a carboxylate group, a phosphate group, and a phosphonate group; in which the hydrophobic portion and the hydrophilic portion are separated by zero to ten alkylene oxide groups. The polishing composition can have a pH of about 2 to about 6.5.
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公开(公告)号：EP3670620A1
公开(公告)日：2020-06-24
申请号：EP19172460.8
申请日：2019-05-03
IPC分类号： C09G1/02
摘要： This disclosure relates to a polishing composition that includes at least one abrasive; at least one nitride removal rate reducing agent, an acid or a base; and water. The at least one nitride removal rate reduce agent can include a hydrophobic portion and a hydrophilic portion; in which the hydrophobic portion includes a C 12 to C 40 hydrocarbon group and is separated by zero to ten alkylene oxide groups from the hydrophilic portion. The polishing composition has a pH of about 2 to about 6.5, and can have a ratio of a removal rate for a silicon oxide to a removal rate for a silicon nitride of at least about 3:1 when polishing a patterned wafer comprising at least silicon nitride patterns overlayed with at least silicon oxide.
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公开(公告)号：EP3602606A1
公开(公告)日：2020-02-05
申请号：EP18772478.6
申请日：2018-03-22
IPC分类号： H01L21/02 , H01L21/3105 , H01L21/306 , H01L21/321 , C09D7/63
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公开(公告)号：EP4396299A1
公开(公告)日：2024-07-10
申请号：EP22865335.8
申请日：2022-08-26
发明人： MCDONOUGH, James , HU, Bin , CHENG, Qingmin
CPC分类号： C09G1/02 , H01L21/3212
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公开(公告)号：EP3602606B1
公开(公告)日：2024-06-26
申请号：EP18772478.6
申请日：2018-03-22
IPC分类号： H01L21/02 , H01L21/3105 , H01L21/306 , H01L21/321 , C09D7/63
CPC分类号： H01L21/02057 , H01L21/306 , H01L21/3105 , H01L21/321 , C09D7/63
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公开(公告)号：EP3562900A1
公开(公告)日：2019-11-06
申请号：EP17888326.0
申请日：2017-12-27
发明人： MCDONOUGH, James
IPC分类号： C09G1/02
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公开(公告)号：EP3537218A1
公开(公告)日：2019-09-11
申请号：EP19166565.2
申请日：2017-05-23
摘要： This disclosure relates to compositions containing 1) at least one water soluble polar aprotic organic solvent; 2) at least one quaternary ammonium hydroxide; 3) at least one compound comprising at least three hydroxyl groups; 4) at least one carboxylic acid; 5) at least one Group II metal cation; 6) at least one copper corrosion inhibitor selected from the group consisting of 6-substituted-2,4-diamino-1,3,5-triazines; and 7) water. The compositions can effectively strip positive or negative-tone resists or resist residues, and be non-corrosive to bumps and underlying metallization materials (such as SnAg, CuNiSn, CuCoCu, CoSn, Ni, Cu, Al, W, Sn, Co, and the like) on a semiconductor substrate.
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公开(公告)号：EP1171801B1
公开(公告)日：2015-11-11
申请号：EP99950004.4
申请日：1999-09-29
CPC分类号： G03F7/0046 , G03F7/0045 , G03F7/039 , G03F7/0392 , G03F7/0757 , Y10S430/107
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公开(公告)号：EP4025319B1
公开(公告)日：2024-10-09
申请号：EP20860953.7
申请日：2020-08-27
IPC分类号： B01D15/18 , B01D15/36 , B01D61/02 , B01D61/18 , B01D61/58 , B01D69/00 , G03F7/42 , B01D61/08 , B01D61/14 , B01D39/16 , B01J20/26 , B01J20/28
CPC分类号： B01J20/2808 , B01J20/28083 , B01J20/261 , B01D39/1692 , B01D2239/121620130101 , B01D15/1871 , B01D15/1885 , B01D15/361 , B01D61/58 , B01D61/14 , B01D61/027 , B01D2311/251220220801
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