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    BRAZING JOINING METHOD OF CNT ASSEMBLIES ON SUBSTRATES USING AN AT LEAST TERNARY BRAZING ALLOY; CORRESPONDING BRAZING MATERIAL AND DEVICE COMPRISING SUCH ASSEMBLY
    13.
    发明公开
    BRAZING JOINING METHOD OF CNT ASSEMBLIES ON SUBSTRATES USING AN AT LEAST TERNARY BRAZING ALLOY; CORRESPONDING BRAZING MATERIAL AND DEVICE COMPRISING SUCH ASSEMBLY 审中-公开
    HARTLÖTVERBINDUNGSVERFAHRENFOR CNT地层ON SUBSTRATES使用最小三元钎焊，软钎焊材料充足和装置利用这样的布置

    公开(公告)号：EP3052266A1

    公开(公告)日：2016-08-10

    申请号：EP14767006.1

    申请日：2014-09-18

    Applicant: EMPA Eidgenössische Materialprüfungs- und Forschungsanstalt

    Inventor： LONGTIN, Rémi ,  ELSENER, Hans Rudolf ,  LEINENBACH, Christian ,  SANCHEZ-VALENCIA, Juan Ramon

    IPC: B23K1/00 ,  B23K1/19 ,  B23K35/30

    CPC classification number: B23K1/0008 ,  B23K1/19 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/302 ,  B23K2201/36 ,  B23K2203/14 ,  B23K2203/18 ,  B23K2203/56 ,  H01J35/065 ,  H01R13/03

    Abstract: The present application describes a joining method of a Carbon Nanotube-assembly (1) on a substrate (2), showing a reproducible controlled joining with partly carbidization of the carbon nanotubes. To solve this problem, the Carbon Nanotube-assembly (1) is fixed to the substrate (2) by an active brazing process, with the steps of : melting and subsequent wetting and spreading of an active brazing alloy (3) in form of a at least ternary alloy, comprising an amount of copper and at least one carbide forming element with an amount of at least lwt% onto the substrate (2), contacting of the Carbon Nanotube-assembly (1) with the active brazing alloy (3) on the substrate (2), followed by a heating step of the components (1, 2, 3) in vacuum or inert gas atmosphere to temperatures above the solidus temperature of the active brazing alloy (3) and between 800°C and 900°C corresponding brazing material and assembly are also claimed.

    Abstract translation: 本申请描述了一种在基板（2）的碳纳米管集合体（1）的接合方法，示出了可再现的控制与碳纳米管的部分carbidization接合。 为了解决这个麻烦，碳纳米管组件（1）是通过在活性钎焊工艺固定到基板（2），具有以下步骤：熔化和随后的润湿和在的形式的活性钎焊合金（3）的扩展 至少三元合金，铜的量和至少一个碳化物形成以至少1重量％的量与元素的包括置于（2）使碳纳米管组件（1）与活性钎焊合金的基片（3 ）在基板（2）其次是1，2，3）在真空或惰性气体气氛中的组分（的加热工序于上述活性钎焊合金（3）的固相线温度和800℃之间℃的温度 因此900℃CORRESPONDING钎焊材料和组装要求保护。

    THERMISCHE SCHALTEINRICHTUNG, HEIZUNGSANORDNUNG SOWIE VERFAHREN ZUR MONTAGE EINER THERMISCHEN SCHALTEINRICHTUNG AN EINER HEIZUNGSEINRICHTUNG
    14.
    发明公开
    THERMISCHE SCHALTEINRICHTUNG, HEIZUNGSANORDNUNG SOWIE VERFAHREN ZUR MONTAGE EINER THERMISCHEN SCHALTEINRICHTUNG AN EINER HEIZUNGSEINRICHTUNG 有权
    热控制设备，用于装配热控制设备的加热装置和方法，加热装置

    公开(公告)号：EP3050070A2

    公开(公告)日：2016-08-03

    申请号：EP14812169.2

    申请日：2014-12-05

    Applicant: Inter Control Hermann Köhler Elektrik GmbH & Co. KG

    Inventor： MARTIN, Andreas ,  ZIMMERMANN, Frédéric ,  SCHMID, Alois ,  HAMM, Wolfgang

    IPC: H01H37/04 ,  B23K26/20

    CPC classification number: H01H37/043 ,  B23K26/242 ,  B23K33/004 ,  B23K2201/36 ,  H01H37/002

    Abstract: The invention relates to a thermal switching device, particularly a temperature controller, temperature limiter, temperature monitor or temperature fuse for connecting to an object of use with a heating device such that thermal contact is established, comprising a thermally-conductive, preferably planar, carrier (2) by means of which said switching device (1) can be brought into thermal contact with said object of use, a functional element which reacts to heat, preferably a bimetallic element (21) or melting element (24), for ensuring a temperature-dependent switching functionality for said thermal switching device (1), as well as connection contacts (4) for connecting the thermal switching device (1) to an electrical wiring section, said carrier (2) being able to be connected to the thermally-contacted object of use by means of laser welding. In order to solve the problem of providing a novel thermal switching device of the aforementioned type which ensures improved safety when operating the thermal switching device, it is suggested that said carrier (2) comprises a region (8) especially prepared for coupling in a laser beam (10), such that said region (8) has a contour which tapers the cross-section of the carrier (2). The invention also relates to a heating arrangement that uses a thermal switching device of the claimed type, and a method for securing a thermal switching device to the surface of a heating device of an object of use by means of laser welding.

    Abstract translation: 本发明涉及一个热开关装置，特别是温度控制器，温度限制器，温度监视器或温度保险丝，用于连接到上使用的对象有加热装置的搜索没有热接触被建立，其包括导热，优选平面的载体 （2）借助于该所述开关装置（1）可被带入与使用所述对象时，会变热的功能性元件，优选的双金属元件（21）热接触或用于确保熔化元件（24） 上依赖于温度的切换功能，所述热交换装置（1），以及（4），用于在电配线部的热交换装置（1）连接到，所述载体（2）能够连接接点被连接到所述热 使用的-contacted目的通过激光焊接的方式。 为了解决这个问题，或者提供上述类型确保改善的安全性当操作所述热开关装置的一种新颖的热交换设备，它建议所述载体（2）包括用于联接在激光特别制备的区域（8）的爱 光束（10），求即所述区域（8）具有这样的轮廓逐渐变细的载体（2）的横截面。 因此，本发明涉及的加热装置那样使用了已声明类型的热交换设备，以及用于通过激光焊接的方式固定的热开关装置的使用对象的加热装置的表面的方法。

    LASER-FORMED FEATURES
    16.
    发明公开
    LASER-FORMED FEATURES 审中-公开
    LASERGEFORMTE MERKMALE

    公开(公告)号：EP3007906A2

    公开(公告)日：2016-04-20

    申请号：EP14735778.4

    申请日：2014-06-06

    Applicant: Apple Inc.

    Inventor： RUSSELL-CLARKE, Peter N. ,  NASHNER, Michael S. ,  FARAHANI, Houtan R.

    IPC: B44C1/22 ,  B44C1/00 ,  B44C1/10

    CPC classification number: B23K26/0066 ,  B23K26/0084 ,  B23K26/0622 ,  B23K26/361 ,  B23K2201/36 ,  B41M5/24 ,  B41M5/26 ,  B44C1/005 ,  B44C1/105 ,  B44C1/228 ,  Y10T428/219 ,  Y10T428/24479

    Abstract: Embodiments are directed to laser-based processes for forming features on the surface of a part. The feature may include a geometric element, a color element, and/or a surface finish element. In some cases, the laser-formed features are formed as a pattern of textured features that produce an aesthetic and/or tactile effect on the surface of the part. In some cases, the texture features may be sufficiently small that they may not be discerned by the unaided human eye. Also, in some cases, a multiple laser-based processes are combined to form a single feature or a finished part having a specific aesthetic and/or tactile effect.

    Abstract translation: 实施例涉及用于在部件的表面上形成特征的基于激光的工艺。 该特征可以包括几何元素，颜色元素和/或表面光洁度元素。 在一些情况下，激光形成的特征形成为纹理特征的图案，其在部件的表面上产生美学和/或触觉效果。 在一些情况下，纹理特征可能足够小，使得它们可能不被肉眼看出。 此外，在一些情况下，多个基于激光的多个工艺被组合以形成具有特定美学和/或触觉效果的单一特征或成品部件。

    AU-SN-BI ALLOY POWDER PASTE, AU-SN-BI ALLOY THIN FILM, AND METHOD FOR FORMING AU-SN-BI ALLOY THIN FILM
    19.
    发明公开
    AU-SN-BI ALLOY POWDER PASTE, AU-SN-BI ALLOY THIN FILM, AND METHOD FOR FORMING AU-SN-BI ALLOY THIN FILM 审中-公开
    AU-SN-BI-LEGIERUNSPULVERPASTE，AU-SN-BI-LEGIERUNGSDÜNNSCHICHTUND VERFAHREN ZUR HERSTELLUNG EINER AU-SN-BI-LEGIERUNGSDÜNNSCHICHT

    公开(公告)号：EP2929975A1

    公开(公告)日：2015-10-14

    申请号：EP13860327.9

    申请日：2013-11-27

    Applicant: Mitsubishi Materials Corporation

    Inventor： ISHIKAWA Masayuki ,  YAMAMOTO Yoshifumi

    IPC: B23K35/22 ,  B22F1/00 ,  B23K1/00 ,  B23K1/20 ,  B23K3/06 ,  B23K35/30 ,  C22C5/02 ,  B22F9/08 ,  B23K101/42

    CPC classification number: B23K35/3013 ,  B23K1/00 ,  B23K1/0016 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/0266 ,  B23K35/22 ,  B23K35/30 ,  B23K2201/36 ,  C22C1/0466 ,  C22C5/02

    Abstract: The present invention provides to an Au-Sn-Bi alloy film which has an excellent bondability on a metalized layer formed on an LED element or a substrate as a bonding layer made of the Au-Sn-Bi alloy and is uniform and thin. In the present invention, an Au-Sn-Bi alloy thin film which has the thickness of 5 µm or less and includes at least a eutectic structure can be formed by using an Au-Sn-Bi alloy powder paste that mixes the Au-Sn alloy powder containing 20 wt% to 25 wt% of Sn, 0.1 wt% to 5.0 wt% of Bi, and a balance of Au, and having a particle diameter of 10 µm or less with an RA flux of 15 wt% to 30 wt%, screen printing the Au-Sn-Bi alloy powder paste in a predetermined region on the Au metallized layer, and subsequently, heating, melting and then solidifying the Au-Sn-Bi alloy powder.

    Abstract translation: 本发明提供一种Au-Sn-Bi合金膜，其在由Au-Sn-Bi合金制成的接合层上形成在LED元件或基板上的金属化层上具有优异的粘合性，并且均匀且薄。 在本发明中，可以通过使用将Au-Sn混合的Au-Sn-Bi合金粉末膏形成厚度为5μm以下并且至少具有共晶组织的Au-Sn-Bi合金薄膜 含有20重量％〜25重量％的Sn，0.1重量％〜5.0重量％的Bi，余量的Au，粒径为10μm以下，RA通量为15重量％〜30重量％ ％，在Au金属化层上的规定区域丝网印刷Au-Sn-Bi系合金粉末膏体，然后，对Au-Sn-Bi合金粉末进行加热，熔融，固化。

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