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公开(公告)号：EP0625537B1
公开(公告)日：2000-12-27
申请号：EP94107717.4
申请日：1994-05-18
申请人： IBIDEN CO, LTD.
IPC分类号： C08J3/00 , C09J101/00 , C09J163/00 , C09J171/00 , C09J181/06
CPC分类号： H05K3/4661 , C08J3/005 , C08L63/00 , C08L63/10 , C08L71/00 , C09J171/00 , C23C18/2033 , C23C18/208 , C23C18/24 , C23C18/30 , H05K3/0023 , H05K3/181 , H05K2201/0129 , H05K2201/0212 , H05K2203/0773 , H05K2203/0789 , H05K2203/0796 , C08L2666/02 , C08L2666/22
摘要： An adhesive usable for electroless plating in the formation of printed circuit boards is formed by dispersing a cured heat-resistant resin powder soluble in an acid or an oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in an acid or an oxidizing agent after the curing treatment, in which the heat-resistant resin matrix is a mixture of a thermoplastic resin and an uncured thermosetting resin or an uncured photosensitive resin.
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12.发明公开
公开(公告)号：EP0719299A4
公开(公告)日：1998-07-01
申请号：EP94924102
申请日：1994-07-28
申请人： DIEMAT INC
IPC分类号： C09J5/06 , C09J9/02 , C09J11/04 , C09J11/06 , C09J159/00 , C09J167/00 , C09J167/02 , C09J181/02 , C09J181/04 , C09J181/06 , C09J183/00 , C09J183/06 , C09J201/00 , H01L21/52 , H01L21/58 , H05K1/09 , C08K3/08
CPC分类号： H01L24/28 , C08L2666/14 , C09J9/02 , C09J201/00 , H01L24/83 , H01L2224/2919 , H01L2224/8319 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01056 , H01L2924/01057 , H01L2924/01068 , H01L2924/01074 , H01L2924/01076 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12033 , H01L2924/14 , H01L2924/19043 , H05K1/092 , H01L2924/00
摘要： Adhesive paste of organic polymer resin, inorganic filler and fugitive liquid can be used for die attach applications.
摘要翻译： 有机聚合物树脂，无机填料和流体液体的粘合剂浆料可用于模具附着应用。
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