公开(公告)号：EP2754683A4

公开(公告)日：2015-06-24

申请号：EP12829551

申请日：2012-09-06

申请人： UBE INDUSTRIES

发明人： NAKAYAMA TAKESHIGE ,  TAKASAKI SUSUMU ,  NAKAYAMA TOMONORI ,  HIROSHIGE KENSUKE

IPC分类号： C08G73/12

CPC分类号： C09D179/085 ,  C08G73/1021 ,  C08G73/1032 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1071 ,  C08G73/1078 ,  C08G73/1082 ,  C08G73/128 ,  C08L79/08 ,  C09D179/08 ,  G02F1/133305 ,  H01M4/0404 ,  H01M4/0471 ,  H01M4/622 ,  H01M4/623 ,  H01M10/0525 ,  H05K1/028 ,  H05K3/007

摘要： The present invention relates to a an aqueous polyimide precursor solution composition, wherein a polyamic acid, which is formed by the reaction of a tetracarboxylic acid component and a diamine component, is dissolved in an aqueous solvent together with an imidazole in an amount of 1.6 mole or more per mole of the tetracarboxylic acid component of the polyamic acid.

公开(公告)号：EP2754683A1

公开(公告)日：2014-07-16

申请号：EP12829551.6

申请日：2012-09-06

申请人： Ube Industries, Ltd.

发明人： NAKAYAMA, Takeshige ,  TAKASAKI, Susumu ,  NAKAYAMA, Tomonori ,  HIROSHIGE, Kensuke

IPC分类号： C08G73/12

CPC分类号： C09D179/085 ,  C08G73/1021 ,  C08G73/1032 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1071 ,  C08G73/1078 ,  C08G73/1082 ,  C08G73/128 ,  C08L79/08 ,  C09D179/08 ,  G02F1/133305 ,  H01M4/0404 ,  H01M4/0471 ,  H01M4/622 ,  H01M4/623 ,  H01M10/0525 ,  H05K1/028 ,  H05K3/007

摘要： The present invention relates to a an aqueous polyimide precursor solution composition, wherein a polyamic acid, which is formed by the reaction of a tetracarboxylic acid component and a diamine component, is dissolved in an aqueous solvent together with an imidazole in an amount of 1.6 mole or more per mole of the tetracarboxylic acid component of the polyamic acid.

摘要翻译： 本发明涉及一种以wässrige聚酰亚胺前体溶液组合物，worin的聚酰胺酸，在所有其由四羧酸组分和二胺组分的反应形成，在wässrige溶剂与咪唑在1.6摩尔的量溶于一起在 或每聚酰胺酸的四羧酸组分的摩尔以上。

公开(公告)号：EP2428535A4

公开(公告)日：2014-05-07

申请号：EP10772185

申请日：2010-05-06

申请人： MITSUBISHI GAS CHEMICAL CO

发明人： BITO TSUYOSHI ,  OISHI JITSUO ,  KIHARA SHUTA

IPC分类号： C08L79/08 ,  C08G73/12 ,  C08K5/3415 ,  C09J179/08

CPC分类号： C08G73/12 ,  C08K5/3415 ,  C08L79/08 ,  C08L79/085 ,  C08L2205/02 ,  C09J179/08 ,  C09J179/085

摘要： To provide a thermosetting polyimide resin composition that can provide a cured product which generates a small amount of decomposition gas even when exposed to, for example, a high-temperature environment of about 250°C, and which exhibits high heat resistance, high durability, favorable flexibility, and favorable adhesive property; a cured product produced from the thermosetting polyimide resin composition; and an adhesive produced from the thermosetting polyimide resin composition. The thermosetting polyimide resin composition containing (a) a polyimide produced through reaction between a tetracarboxylic acid component containing a tetracarboxylic dianhydride and/or a tetracarboxylic acid, and a diamine; and (b) a maleimide composition containing at least one polymaleimide compound represented by any of formulas (4-1) to (4-3).

公开(公告)号：EP2647686A3

公开(公告)日：2013-10-30

申请号：EP13165702.5

申请日：2005-03-16

申请人： SUMITOMO BAKELITE CO., LTD.

发明人： Okubo, Hikaru ,  Tanaka, Nobuki ,  Watanabe, Itaru

IPC分类号： C09J201/02 ,  C08F290/06 ,  H01L21/52 ,  C08G73/12 ,  C08L79/08

CPC分类号： C08F220/58 ,  C08F234/02 ,  C08G73/12 ,  C08K3/08 ,  C08K3/26 ,  C08K5/0025 ,  C08K5/14 ,  C08L79/085 ,  C09J179/08 ,  C09J201/025 ,  H01L23/145 ,  H01L23/3737 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015

摘要： A resin composition which is excellent in quick curing and can be used for curing in conventionally used ovens, and a semiconductor device which is excellent in reliability such as solder crack resistance or the like when the resin composition is used as a die attach material for semiconductor. Further preferably, a resin composition which has a sufficient low stress property, good adhesion and excellent bleeding property.
A resin composition comprising a filler (A), the compound (B) comprising a structure represented by the formula (1) and a functional group represented by the formula (2) and a thermal radical initiator (C), and substantially not containing a photo polymerization initiator.

公开(公告)号：EP2110708B1

公开(公告)日：2012-12-05

申请号：EP08710777.7

申请日：2008-02-05

申请人： Toray Industries, Inc.

发明人： FUJITA, Yoji ,  ARIMOTO, Shinji ,  IKE, Rinsei

IPC分类号： C08F290/06 ,  C08F290/14 ,  C08F299/02 ,  C08F299/06 ,  C08G73/10 ,  C08G73/12 ,  C08G73/14 ,  C08L79/08 ,  G03F7/023 ,  C08L61/06

CPC分类号： C08F290/06 ,  C08F290/14 ,  C08F299/02 ,  C08F299/06 ,  C08G73/101 ,  C08G73/1014 ,  C08G73/1017 ,  C08G73/121 ,  C08G73/122 ,  C08G73/123 ,  C08G73/124 ,  C08G73/125 ,  C08G73/126 ,  C08G73/127 ,  C08G73/14 ,  C08L61/00 ,  C08L61/06 ,  C08L79/085 ,  G03F7/0236 ,  C08L2666/20 ,  C08L2666/16

公开(公告)号：EP2519561A1

公开(公告)日：2012-11-07

申请号：EP10801076.0

申请日：2010-12-28

申请人： SABIC Innovative Plastics IP B.V.

发明人： CHIONG, Hendrich ,  GUGGENHEIM, Thomas, Link ,  DE CASTRO, Miguel Angel Navarro

IPC分类号： C08G73/10 ,  C08G73/12 ,  C08L79/08 ,  C07D209/48 ,  C08L71/00 ,  C08L81/02 ,  C08L81/06

CPC分类号： C08G73/101 ,  C08G73/1053 ,  C08G73/122 ,  C08L71/00 ,  C08L79/08 ,  C08L79/085 ,  C08L81/02 ,  C08L81/06 ,  C08L2666/20 ,  C08L2666/02

摘要： A polyetherimide having an OH content that is greater than 0 and equal or less than 100 ppm; a Relative Thermal Index that is greater than or equal to 170°C; and a chlorine content that is greater than 0 ppm is disclosed herein. A method for preparing the polyetherimide is also disclosed.

公开(公告)号：EP2333004A4

公开(公告)日：2012-01-25

申请号：EP09811545

申请日：2009-09-03

申请人： KANEKA CORP ,  JAPAN AEROSPACE EXPLORATION

发明人： MIYAUCHI MASAHIKO ,  ISHIDA YUICHI ,  OGASAWARA TOSHIO ,  YOKOTA RIKIO

IPC分类号： C08G73/12 ,  C07D209/48 ,  C08F38/00 ,  C08F299/02

CPC分类号： C08F290/065 ,  C07D209/48 ,  C07D487/04 ,  C08F299/00 ,  C08F299/02 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1071 ,  C08J5/24 ,  C08J2379/08 ,  C08K7/02 ,  C08L79/08 ,  C09D179/08 ,  Y10T428/24994 ,  Y10T428/24995 ,  Y10T442/2631 ,  Y10T442/671 ,  Y10T442/69

公开(公告)号：EP2333004A1

公开(公告)日：2011-06-15

申请号：EP09811545.4

申请日：2009-09-03

申请人： Kaneka Corporation ,  Japan Aerospace Exploration Agency

发明人： MIYAUCHI Masahiko ,  ISHIDA Yuichi ,  OGASAWARA Toshio ,  YOKOTA Rikio

IPC分类号： C08G73/12 ,  C07D209/48 ,  C08F38/00 ,  C08F299/02

CPC分类号： C08F290/065 ,  C07D209/48 ,  C07D487/04 ,  C08F299/00 ,  C08F299/02 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1071 ,  C08J5/24 ,  C08J2379/08 ,  C08K7/02 ,  C08L79/08 ,  C09D179/08 ,  Y10T428/24994 ,  Y10T428/24995 ,  Y10T442/2631 ,  Y10T442/671 ,  Y10T442/69

摘要： Disclosed is a novel terminally modified imide oligomer having excellent solubility in organic solvents, excellent solution storage stability, and excellent molding properties such as low melt viscosity. Also disclosed are a varnish obtained by dissolving the terminally modified imide oligomer in an organic solvent; a cure product obtained by using the terminally modified imide oligomer and having excellent thermal and mechanical characteristics such as heat resistance, elastic modulus, tensile strength at break and tensile elongation at break; a prepreg; and a fiber-reinforced laminate. The soluble terminally modified imide oligomer is represented by general formula (1). (In the formula, R 1 and R 2 each represents a divalent aromatic diamine residue; R 3 and R 4 each represents a tetravalent aromatic tetracarboxylic acid residue; R 5 and R 6 each represents a hydrogen atom or a phenyl group, with R 5 or R 6 being a phenyl group; m and n satisfy the following relations: m ≥ 1, n ≥ 0,1 ≤ m + n ≤ 20 and 0.05 ≤ m/(m + n) ≥ 1; and the repeating units may be arranged in blocks or randomly.)

摘要翻译： 公开的是末端改性酰亚胺低聚物具有在有机溶剂中，最佳的储存稳定性，和优异的成型性优异的溶解性的新颖：如低的熔体粘度。 所以盘是游离缺失通过在有机溶剂中的末端改性酰亚胺低聚物溶解，制得的清漆; 通过使用末端改性酰亚胺低聚物，并且具有优良的热和机械特性而获得的固化产物：如耐热性，弹性模量，断裂和拉伸断裂伸长率抗张强度; 的预浸料坯; 和纤维增强层压材料。 可溶性末端改性酰亚胺低聚物由通式（1）表示。 （式中，R 1和R 2各自darstellt二价的芳香族二胺残基; R 3和R 4各自darstellt的四价芳香族四羧酸残基; R 5和R 6各自darstellt氢原子或苯基，其中R 5 或R 6为苯基; m和n满足以下关系：M‰¥1，N‰¥‰‰¥1¤0.1米+ N‰¤20和0:05‰¤M /（M + N）; 和重复单元可以以嵌段或无规排列。）

公开(公告)号：EP1994078B1

公开(公告)日：2009-07-01

申请号：EP07726443.0

申请日：2007-02-20

申请人： International Business Machines Corporation

发明人： HEDRICK, James Lupton ,  FROMMER, Jane Elizabeth ,  WINDELN, Johannes ,  DUERIG, Urs ,  LEE, Victor Yee-Way ,  GOTSMANN, Bernd c/o IBM United Kingdom Limited ,  MILLER, Robert Dennis ,  HAGBERG, Erik ,  MAGBITANG, Teddie ,  KNOLL, Armin ,  PRATT, Russell Clayton ,  WADE, Charles

IPC分类号： C08G73/12 ,  G11B9/00

CPC分类号： G11B9/149 ,  B82Y10/00 ,  C08G73/101 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1053 ,  C08G73/1064 ,  G11B9/1409 ,  G11B9/1454 ,  G11B11/007 ,  G11B2005/0021 ,  Y10T428/265 ,  Y10T428/31721

摘要： An approach is presented for designing a polymeric layer for nanometer scale thermo-mechanical storage devices. Cross-linked polyimide oligomers are used as the recording layers in atomic force data storage device, giving significantly improved performance when compared to previously reported cross-linked and linear polymers. The cross-linking of the polyimide oligomers may be tuned to match thermal and force parameters required in read-write-erase cycles. Additionally, the cross-linked polyimide oligomers are suitable for use in nano-scale imaging.

公开(公告)号：EP1994078A2

公开(公告)日：2008-11-26

申请号：EP07726443.0

申请日：2007-02-20

申请人： International Business Machines Corporation

发明人： HEDRICK, James Lupton ,  FROMMER, Jane Elizabeth ,  WINDELN, Johannes ,  DUERIG, Urs ,  LEE, Victor Yee-Way ,  GOTSMANN, Bernd ,  MILLER, Robert Dennis ,  HAGBERG, Erik ,  MAGBITANG, Teddie ,  KNOLL, Armin ,  PRATT, Russell Clayton ,  WADE, Charles

IPC分类号： C08G73/12 ,  G11B9/00

CPC分类号： G11B9/149 ,  B82Y10/00 ,  C08G73/101 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1053 ,  C08G73/1064 ,  G11B9/1409 ,  G11B9/1454 ,  G11B11/007 ,  G11B2005/0021 ,  Y10T428/265 ,  Y10T428/31721

摘要： An approach is presented for designing a polymeric layer for nanometer scale thermo-mechanical storage devices. Cross-linked polyimide oligomers are used as the recording layers in atomic force data storage device, giving significantly improved performance when compared to previously reported cross-linked and linear polymers. The cross-linking of the polyimide oligomers may be tuned to match thermal and force parameters required in read-write-erase cycles. Additionally, the cross-linked polyimide oligomers are suitable for use in nano-scale imaging.